Patents by Inventor Yu-Chieh Hsueh

Yu-Chieh Hsueh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing flexible substrate structure and flexible flat device
    Patent number: 8773625
    Abstract: A method of manufacturing a flexible substrate structure includes the following steps. A first loading substrate having a center area and a peripheral area is provided. A first adhesive layer is formed on the center area of the first loading substrate, and a second adhesive layer is formed on the peripheral area of the first loading substrate. The first flexible substrate is adhered to the first loading substrate by the first adhesive layer and the second adhesive layer to form a flexible substrate structure, wherein the adhesive force between the first flexible substrate and the second adhesive layer is stronger than that between the first flexible substrate and the first adhesive layer. The flexible substrate structure is cut, and the first flexible substrate is separated from the flexible substrate structure.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: July 8, 2014
    Assignee: AU Optronics Corp.
    Inventors: Wen-Yuan Li, Pin-Hsiang Chiu, Yu-Chieh Hsueh, Li-Yin Chen, Min-Chih Wei, Shiuan-Iou Lin
  • FLEXIBLE FLAT DEVICE AND METHOD OF MANUFACTURING FLEXIBLE SUBSTRATE STRUCTURE AND FLEXIBLE FLAT DEVICE
    Publication number: 20130077033
    Abstract: A method of manufacturing a flexible substrate structure includes the following steps. A first loading substrate having a center area and a peripheral area is provided. A first adhesive layer is formed on the center area of the first loading substrate, and a second adhesive layer is formed on the peripheral area of the first loading substrate. The first flexible substrate is adhered to the first loading substrate by the first adhesive layer and the second adhesive layer to form a flexible substrate structure, wherein the adhesive force between the first flexible substrate and the second adhesive layer is stronger than that between the first flexible substrate and the first adhesive layer. The flexible substrate structure is cut, and the first flexible substrate is separated from the flexible substrate structure.
    Type: Application
    Filed: May 23, 2012
    Publication date: March 28, 2013
    Inventors: Wen-Yuan Li, Pin-Hsiang Chiu, Yu-Chieh Hsueh, Li-Yin Chen, Min-Chih Wei, Shiuan-Iou Lin