Abstract: A back light module includes a bezel, a light-guiding plate, an optical film and a fixing element. The bezel includes frame strips defining an accommodating space. Each frame strip has a bottom surface, a carrier surface opposite to the carrier surface, and a lateral surface connected between the bottom and carrier surfaces and facing to the accommodating space. The lateral surface of the frame strips has a first cave extended from the carrier surface through the bottom surface. The light-guiding plate and the optical film are configured in the accommodating space. The optical film has at least a first protrusion within the first cave. The fixing element is configured on the carrier surfaces of the frame strips and a portion of the optical film and corresponds to the boundary between the first protrusion and the first cave. A display device using the back light module is provided.

Abstract: A back light module includes a bezel, a light-guiding plate, an optical film and a fixing element. The bezel includes frame strips defining an accommodating space. Each frame strip has a bottom surface, a carrier surface opposite to the carrier surface, and a lateral surface connected between the bottom and carrier surfaces and facing to the accommodating space. The lateral surface of the frame strips has a first cave extended from the carrier surface through the bottom surface. The light-guiding plate and the optical film are configured in the accommodating space. The optical film has at least a first protrusion within the first cave. The fixing element is configured on the carrier surfaces of the frame strips and a portion of the optical film and corresponds to the boundary between the first protrusion and the first cave. A display device using the back light module is provided.

Abstract: A backlight module includes a light source, a light guide plate and at least one optical film. The light source has a plurality of light emitting devices. The light guide plate includes a light entrance portion, a main body portion and at least one positioning structure. The light entrance portion has a top surface and a light entrance surface. The light source is disposed corresponding to the light entrance surface. The top surface is adjacently connected to the light entrance surface. The main body is connected to the light entrance portion and has a first light extraction surface connecting the top surface. The positioning structure is disposed on the top surface and corresponding to an interval between two adjacent light emitting devices, and has an accommodating space. The optical film is disposed above the light guide plate and has at least one protruding portion disposed in the accommodating space.

Abstract: A backlight module includes a light source, a light guide plate and at least one optical film. The light source has a plurality of light emitting devices. The light guide plate includes a light entrance portion, a main body portion and at least one positioning structure. The light entrance portion has a top surface and a light entrance surface. The light source is disposed corresponding to the light entrance surface. The top surface is adjacently connected to the light entrance surface. The main body is connected to the light entrance portion and has a first light extraction surface connecting the top surface. The positioning structure is disposed on the top surface and corresponding to an interval between two adjacent light emitting devices, and has an accommodating space. The optical film is disposed above the light guide plate and has at least one protruding portion disposed in the accommodating space.

Abstract: A flexible printed circuitboards (FPC) with anti-solder crack structure, adapted for a plurality of circuit components to mount thereon, is disclosed, which comprises: a vacant area, being a region of high aspect ratio formed on the FPC at a location where the FPC is more likely to be bended and is enclosed by the plural circuit components; a layout area, being a region formed on the FPC at a location beyond that of the vacant area so as to be provided for the plural circuit components to mount thereon. By the formation of the vacant area on the FPC at its stress concentration region when it is bended by an external force, stresses in solder bumps bonding the plural circuit components with the FPC can be prevented from happening so that the reliability of circuit component against solder crack is improved.