Patents by Inventor Yu-Chieh Wei

Yu-Chieh Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240075082
    Abstract: Provided is a composition including a lactic acid bacterium and a carrier thereof for prophylaxis or treatment of an allergy. The lactic acid bacterium is Lactobacillus paragasseri, such as Lactobacillus paragasseri BBM171 deposited under DSMZ Accession No. DSM 34311. Also provided is a method for preventing or treating an allergy in a subject that includes administering an effective amount of the composition of Lactobacillus paragasseri to the subject.
    Type: Application
    Filed: August 24, 2023
    Publication date: March 7, 2024
    Inventors: Ying-Chieh Tsai, Yu-Hsuan Wei, Chih-Chieh Hsu, Chien-Chen Wu
  • Patent number: 11317504
    Abstract: An electronic assembly is provided, including a wiring board, a control element, and a pair of first internal electrical connectors. The wiring board includes a mounting surface, a first patterned conductive layer, a plurality of second patterned conductive layers, a plurality of near conductive holes, a plurality of far conductive holes, and a first conductive path. The first patterned conductive layer is located between the mounting surface and the second patterned conductive layers. The control element is mounted on the mounting surface of the wiring board. The pair of first internal electrical connectors are mounted on the mounting surface of the wiring board, and are adapted for mounting a pair of memory modules. The first conductive path extends from the control element at least through the corresponding second patterned conductive layer and the first patterned conductive layer to the pair of first internal electrical connectors.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: April 26, 2022
    Assignee: Shanghai Zhaoxin Semiconductor Co., Ltd.
    Inventors: Yu-Chieh Wei, Yen-Chen Chen, Yu-Ching Hung
  • Publication number: 20210378095
    Abstract: An electronic assembly is provided, including a wiring board, a control element, and a pair of first internal electrical connectors. The wiring board includes a mounting surface, a first patterned conductive layer, a plurality of second patterned conductive layers, a plurality of near conductive holes, a plurality of far conductive holes, and a first conductive path. The first patterned conductive layer is located between the mounting surface and the second patterned conductive layers. The control element is mounted on the mounting surface of the wiring board. The pair of first internal electrical connectors are mounted on the mounting surface of the wiring board, and are adapted for mounting a pair of memory modules. The first conductive path extends from the control element at least through the corresponding second patterned conductive layer and the first patterned conductive layer to the pair of first internal electrical connectors.
    Type: Application
    Filed: August 5, 2020
    Publication date: December 2, 2021
    Applicant: Shanghai Zhaoxin Semiconductor Co., Ltd.
    Inventors: Yu-Chieh Wei, Yen-Chen Chen, Yu-Ching Hung
  • Patent number: 11083078
    Abstract: An electronic assembly is provided, including a wiring board, a control element, and a pair of first internal electrical connectors. The wiring board includes a mounting surface, an outer patterned conductive layer, a plurality of inner patterned conductive layers, a plurality of near conductive holes, a plurality of far conductive holes, and a first conductive path. The outer patterned conductive layer is located between the mounting surface and the inner patterned conductive layers. The control element is mounted on the mounting surface of the wiring board. The pair of first internal electrical connectors are mounted on the mounting surface of the wiring board, and are adapted for mounting a pair of memory modules.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: August 3, 2021
    Assignee: Shanghai Zhaoxin Semiconductor Co., Ltd.
    Inventors: Yu-Chieh Wei, Yen-Chen Chen, Yu-Ching Hung