Abstract: A semiconductor device includes a single-layered dielectric layer, a conductive line, a conductive via and a conductive pad. The conductive line and the conductive via are disposed in the single-layered dielectric layer. The conductive pad is extended into the single-layered dielectric layer to electrically connected to the conductive line.

Abstract: A hybrid lens includes a lens substrate made of glass material, and a plastic layer formed and coating round the lens substrate. An appropriate portion of the outer surfaces of the plastic layer is defined as a datum face. A method of manufacturing the foregoing hybrid lens is described hereinafter. Firstly, the lens substrate is fastened in a shaping cavity of a corresponding shaping mold with an appropriate portion of the inside of the shaping cavity defined as a shaping datum. Secondly, a predetermined amount of transparent plastic is poured into the shaping cavity. Next, the transparent plastic is hardened to form the plastic layer round the lens substrate, and accordingly, the datum face is formed on the plastic layer by means of the shaping datum. Lastly, the shaping mold is opened to obtain the hybrid lens.

Abstract: A method of manufacturing a light emitting device includes steps of setting a threshold of luminous intensity, measuring luminous intensity of a measured light emitting device, calculating an offset value between the threshold of luminous intensity and the measured luminous intensity, performing a destruct structure capable of decreasing energy of light beam on an optical element of the measured light emitting device, wherein the energy decreasing efficiency of the destruct structure is direct proportion to the offset value. While the light beam is radiated from a light emitting chip of the measured light emitting device and to the destruct structure, few light energy is absorbed or scattered by the destruct structure to decrease the luminous intensity. Therefore, the light emitting device with the destruct structure has a consistent luminous intensity due to the energy decreasing efficiency of the destruct structure is direct proportion to the offset luminous intensity.

Abstract: A method of manufacturing a light emitting unit includes steps of previously setting a threshold of luminous intensity, measuring luminous intensity of a measured light emitting unit, calculating an offset value between the threshold of luminous intensity and the measured luminous intensity, performing absorption of light by a light absorbing portion direct proportion to the offset value, and positioning the designed light absorbing portion onto an optical element of the measured light emitting unit. While light beam is radiated from the measured light emitting unit and passed through the light absorbing portion, few light energy is absorbed by the light absorbing portion to decrease the luminous intensity. Therefore, the light emitting unit with the light absorbing portion has a consistent luminous intensity due to the light absorbing ratio of the light absorbing portion is direct proportion to the offset luminous intensity.

Abstract: An automatic pencil includes a pencil tube unit, a pencil tip unit, a press cap and an eraser unit. The pencil tube unit includes an external tube member and a pencil refill tube member contained in the external tube member and having a clamping portion for clamping the pencil refill. The pencil tip unit is connected to the external tube member and includes a retainer connected to the clamping portion in the pencil refill tube member and a pencil refill guide tube situated at a conical tip of the conical body and connected to the retainer to guide the pencil refill. The press cap is installed at the pencil refill tube member, and a protrusion is formed along its axis. The eraser unit includes an eraser and at least one spare eraser, both having a surface and a concave hole for connecting the protrusion of the press cap.