Abstract: A thin push button structure includes a main board, a circuit board, an elastic element, a supporting plate, a key top and a frame. The circuit board is disposed on the main board and formed with a plurality of cavities. The supporting plate includes a seat, an extending portion and a contacting portion. The seat is formed with a window at the central region and connected to the contacting portion by the extending portion. The elastic element is disposed on the circuit board. The key top includes a main body and a plurality of posts that extend therefrom. The frame includes a through opening and a plurality of alignment grooves at the periphery of the opening. The frame sleeves the key top, and the posts are received by the alignment grooves. The key top caps the contacting portion and is movable within the alignment grooves and the cavities.

Abstract: A thin key structure includes a supporting module, a circuit module disposed on the supporting module, a frame and a metal dome disposed on the circuit module, a pressable module, and a guiding portion. The supporting module has a supporting plate and a protrusion disposed on the supporting plate. The supporting plate has a plane defined therein, the plane defines a perpendicular central axis, and the protrusion is arranged on the central axis. The circuit module has a protruding segment formed by the protrusion. The metal dome is arranged in the frame, and has a contact portion arranged on the central axis. The guiding portion arranged on the central axis and is disposed between the contact portion and the pressable module. The metal dome is pressed by the guiding portion to move the contact portion along the central axis and selectively abuts the circuit module.

Abstract: A thin push button structure includes a main board, a circuit board, an elastic element, a supporting plate, a key top and a frame. The circuit board is disposed on the main board and formed with a plurality of cavities. The supporting plate includes a seat, an extending portion and a contacting portion. The seat is formed with a window at the central region and connected to the contacting portion by the extending portion. The elastic element is disposed on the circuit board. The key top includes a main body and a plurality of posts that extend therefrom. The frame includes a through opening and a plurality of alignment grooves at the periphery of the opening. The frame sleeves the key top, and the posts are received by the alignment grooves. The key top caps the contacting portion and is movable within the alignment grooves and the cavities.

Abstract: A thin key structure includes a supporting module, a circuit module disposed on the supporting module, a frame and a metal dome disposed on the circuit module, a pressable module, and a guiding portion. The supporting module has a supporting plate and a protrusion disposed on the supporting plate. The supporting plate has a plane defined therein, the plane defines a perpendicular central axis, and the protrusion is arranged on the central axis. The circuit module has a protruding segment formed by the protrusion. The metal dome is arranged in the frame, and has a contact portion arranged on the central axis. The guiding portion arranged on the central axis and is disposed between the contact portion and the pressable module. The metal dome is pressed by the guiding portion to move the contact portion along the central axis and selectively abuts the circuit module.

Abstract: A method for bonding a plastic member onto a metal housing is provided. A metal housing having an inner surface and an outer surface is prepared. The inner surface of the metal housing is subjected to physical processing to thereby form a bonding area. An adhesive layer is formed on the bonding area. A plastic mold member is formed on the adhesive layer by plastic injection molding.

Abstract: A method for bonding a plastic member onto a metal housing is provided. A metal housing having an inner surface and an outer surface is prepared. A hollow-carved area is provided on the metal housing. The inner surface of the metal housing is subjected to physical process, thereby forming a bonding area. An adhesive layer is formed on the bonding area. A plastic mold member is formed on the adhesive layer by performing a first plastic injection molding. An optical plastic member is molded on the hollow-carved area by performing a second plastic injection molding.

Abstract: A biochemical material detection system is provided, which is used to detect biochemical materials. A material to be detected is placed above a sensor module in the system. A light source is guided in by a light emitting device to measure a refractive index of the material to be detected or other parameters related to the material to be detected. Furthermore, a heat source generated by the light emitting device in the system is further isolated outside the sensor module, thereby preventing the heat source from influencing a sensed result to improve the accuracy of the sensed result.

Abstract: A method of manufacturing non-backlighted illuminating keypad includes preparing a transparent plastic thin plate; forming a plurality of keycaps on a surface the plastic thin plate; forming a light gathering layer on another surface of the plastic thin plate opposite to the keycaps; attaching the plastic thin plate onto an electronic ink layer; and attaching an first elastic layer on the electronic ink layer.

Abstract: A non-backlighted illuminating keypad includes a keypad panel, a light gathering layer, an electronic ink layer, a first elastic layer and a switch board. The keypad panel includes a carrier and a plurality of keycaps arranged on the carrier. The light gathering layer is arranged on a bottom surface of the keypad panel and located corresponding to the keycaps. The electronic ink layer is arranged on a bottom surface of the light gathering layer. The first elastic layer is arranged on a bottom surface of the electronic ink layer and comprises a plurality of protrusion portions respectively corresponding to the keycaps. The switch board is arranged below the elastic layer.

Abstract: A non-backlighted illuminating keypad includes a keypad panel, a light gathering layer, an electronic ink layer, a first elastic layer and a switch board. The keypad panel includes a carrier and a plurality of keycaps arranged on the carrier. The light gathering layer is arranged on a bottom surface of the keypad panel and located corresponding to the keycaps. The electronic ink layer is arranged on a bottom surface of the light gathering layer. The first elastic layer is arranged on a bottom surface of the electronic ink layer and comprises a plurality of protrusion portions respectively corresponding to the keycaps. The switch board is arranged below the elastic layer.

Abstract: A method of manufacturing non-backlighted illuminating keypad includes preparing a transparent plastic thin plate; forming a plurality of keycaps on a surface the plastic thin plate; forming a light gathering layer on another surface of the plastic thin plate opposite to the keycaps; attaching the plastic thin plate onto an electronic ink layer; and attaching an first elastic layer on the electronic ink layer.

Abstract: A manufacturing method of keypad panel includes the steps of preparing a mold formed by assembling a mold base, a transparent mold cavity and a fixed board; coating an ultraviolet curing resin on surfaces of the mold base and the transparent mold cavity of the mold; attaching a transparent or non-transparent plastic thin film onto the ultraviolet curing resin; compressing the ultraviolet curing resin flatly to squeeze the space and eliminate the air remained between the thin film and the ultraviolet curing resin as well as the ultraviolet curing resin and the transparent mold cavity; and performing a light projection to pass light through the transparent mold cavity to cure the ultraviolet curing resin, so as to complete manufacturing the keypad panel.

Abstract: A mold structure for forming a keypad panel includes a mold base, a transparent mold core and a fixed board. The mold base has an opening, a connecting portion around the opening, a containing space extended from the connecting portion, a positioning portion and a groove on the surface of the mold base, and screw holes inside the containing space. The transparent mold cavity has a body, a connecting edge around the periphery of the body and attached to the connecting portion, and a mold of a keypad panel on the surface of transparent mold cavity and exposed from the opening of the mold base. The fixed board has an opening for projecting light onto the transparent mold cavity and through holes around the periphery of the opening for securing screws into the screw holes to assemble the fixed board into the containing space and press the transparent mold cavity.

Abstract: The invention is a structural improvement for wafer supporting apparatus, which is applied in a machine capable of providing a support for a wafer during a manufacturing process of semiconductor.