Patents by Inventor YU-CHIH KUO

YU-CHIH KUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12218009
    Abstract: A method of forming a semiconductor device includes forming a first dielectric layer over a front side of a wafer, the wafer having a plurality of dies at the front side of the wafer, the first dielectric layer having a first shrinkage ratio smaller than a first pre-determined threshold; curing the first dielectric layer at a first temperature, where after curing the first dielectric layer, a first distance between a highest point of an upper surface of the first dielectric layer and a lowest point of the upper surface of the first dielectric layer is smaller than a second pre-determined threshold; thinning the wafer from a backside of the wafer; and performing a dicing process to separate the plurality of dies into individual dies.
    Type: Grant
    Filed: August 1, 2023
    Date of Patent: February 4, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Che Tu, Wei-Chih Chen, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu
  • Publication number: 20250037858
    Abstract: The present invention disclose a medical image-based system for predicting lesion classification and a method thereof. The system comprises a feature data extracting module for providing a raw feature data based on a medical image, and a predicting module for outputting a predicted class and a risk index according to the raw feature data. The predicting module comprises a classification unit for generating the predicted class and a prediction score corresponding thereto according to the raw feature data, and a risk evaluation unit for generating the risk index according to the prediction score. The system provides medical personnels a reference score and a risk index to determine progression of a certain disease.
    Type: Application
    Filed: February 1, 2024
    Publication date: January 30, 2025
    Inventors: YI-SHAN TSAI, YU-HSUAN LAI, CHENG-SHIH LAI, CHAO-YUN CHEN, MENG-JHEN WU, YI-CHUAN LIN, YI-TING CHIANG, PENG-HAO FANG, PO-TSUN KUO, YI-CHIH CHIU
  • Patent number: 12205860
    Abstract: In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.
    Type: Grant
    Filed: July 12, 2023
    Date of Patent: January 21, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu, Ying-Cheng Tseng, Chi-Hui Lai, Chiahung Liu, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20110038487
    Abstract: An earphone acoustic simulation system and an optimal simulation method of the same is disclosed. The earphone acoustic simulation system comprises an earphone front end simulation circuit and an earphone back end simulation circuit for simulating acoustic environment of a front cavity and a back cavity inside an earphone, and an artificial ear simulation circuit is connected respectively with the earphone front end simulation circuit and the earphone back end simulation circuit. Variation of an impedance of the artificial ear simulation circuit represents the frequency response in the earphone cavity. Besides, the optimal simulation of the earphone acoustic simulation system utilizes simulated annealing algorithm to obtain the optimal parameter of the earphone cavity, and anticipates the SPL curve related to the optimal earphone cavity through utilizing the earphone acoustic simulation system.
    Type: Application
    Filed: December 23, 2009
    Publication date: February 17, 2011
    Applicant: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: MINGSIAN R. BAI, YU-CHIH KUO