Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.

Abstract: A microfluidic purification device for exosomes purification is disclosed that has high speed, high viability and efficiency plus re-cycling of cells for regrowth of exosomes. The microfluidic purification device contains coarse filtering, and/or medium filtering plus fine filter with the medium/fine filter made of MEMS semiconductor process. For high-speed operation, an ultrasound vibrator attached to input chamber/filter/output chamber assembly is also used that the vibration amplitude, duty cycle and duration can be controlled through controller. The MEMS filter is V-shaped and/or funnel shape made of silicon wafer by semiconductor process. For funnel shape MEMS filter, the exit hole size is between 0.2 ?m to 1 ?m suitable for exosomes filtering with high speed and high viability.

Abstract: A microfluidic electroporation device for exogenous molecules transfection is disclosed. The microfluidic electroporation device includes an electroporation chamber assembly, an ultrasound vibrator, and a controller. The electroporation chamber assembly includes an input chamber for exogenous molecules, a MEMS filter, an activation chamber and a MEMS plate. The MEMS plate holds cells within individual cavity for electroporation. Both the MEMS filter and the MEMS plate are made of semiconductor process by wet etching and/or ICP dry etching with V-shaped cavities. The top surfaces of the MEMS filter and the MEMS plate are coated with metal layer for applying electric field during the electroporation process. The electroporation chamber assembly is attached to an ultrasound vibrator which is operated intermittently to allow cells to be fixed in the cavity of the MEMS plate during electroporation process and popped out for collection after electroporation process.

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.

Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.

Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.

Abstract: An infrared temperature sensor comprises a thermopile sensor and an infrared reflector, wherein the infrared reflector reflects the infrared ray radiated by a target to a first thermopile sensing element of the thermopile sensor to sense the temperature of the target. By appropriately designing the reflecting surface of the infrared reflector, a horizontal viewing angle of a sensing range of the infrared temperature sensor can be larger, while a vertical viewing angle is smaller. The thermopile sensor further comprises a second thermopile sensing element, which can sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by the temperature variation of the package structure, which results from the variation of the environmental temperature. Thus, the measurement accuracy is increased.

Abstract: A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.

Abstract: An infrared temperature sensor comprises a thermopile sensing chip. The thermopile sensing chip includes a chip substrate, a thermopile sensing unit, a heater and a temperature sensing element. The thermopile sensing unit is disposed on the chip substrate, receives infrared thermal radiation from a target and outputs a corresponding infrared sensation signal. The heater is disposed on the chip substrate and used to heat the chip substrate to a working temperature. The temperature sensing element is disposed on the chip substrate, senses the working temperature of the chip substrate and outputs a corresponding working temperature signal. In operation, the infrared temperature sensor can maintain the thermopile sensing unit at the preset working temperature. Thereby, a single-point temperature calibration is sufficient to obtain more accurate measurement results in a broad environmental temperature range.

Abstract: A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.

Abstract: The present invention relates to a method for controlling blood glucose level and a method for the prophylaxis or treatment of diabetes mellitus and/or its complications. The present invention further relates to an anti-diabetic formulation for controlling blood glucose level and/or for the prophylaxis or treatment of diabetes mellitus and/or its complications.

Abstract: The present invention relates to a method for controlling blood glucose level and a method for the prophylaxis or treatment of diabetes mellitus and/or its complications. The present invention further relates to an anti-diabetic formulation for controlling blood glucose level and/or for the prophylaxis or treatment of diabetes mellitus and/or its complications.