Abstract: A system for chucking and de-chucking a work piece comprises a wafer stage having a chuck support for supporting a chuck. The wafer stage further comprises a chuck mounted on the chuck support for receiving and attaching the work piece thereto; a support lift means for supporting the work piece; a driving means coupled to the support lift means for gradually raising the support lift means to contact the work piece in response to a variable quantity; a controller for receiving the variable quantity; and a regulating means coupled to the driving means and to the controller, the regulating means for controlling the variable quantity going to the driving means when a predetermined variable quantity is detected.

Abstract: A system for chucking and de-chucking a work piece comprises a wafer stage having a chuck support for supporting a chuck. The wafer stage further comprises a chuck mounted on the chuck support for receiving and attaching the work piece thereto; a support lift means for supporting the work piece; a driving means coupled to the support lift means for gradually raising the support lift means to contact the work piece in response to a variable quantity; a controller for receiving the variable quantity; and a regulating means coupled to the driving means and to the controller, the regulating means for controlling the variable quantity going to the driving means when a predetermined variable quantity is detected.

Abstract: A wafer stage installed in a process chamber for safely dechucking a wafer is provided. In one embodiment, the wafer stage comprises: a chuck support for supporting a chuck; a chuck mounted on the chuck support for receiving and attaching a wafer thereto; a support lift means for supporting the wafer; a driving means coupled to the support lift means for gradually raising the support lift means to contact the wafer in response to a variable quantity; a sensor attached to the driving means for detecting a change in the variable quantity; and a controller for controlling the variable quantity to the driving means when a predetermined variable quantity is detected in comparison to the change in the variable quantity for a predetermined time.

Abstract: A wafer stage installed in a process chamber for safely dechucking a wafer is provided. In one embodiment, the wafer stage comprises: a chuck support for supporting a chuck; a chuck mounted on the chuck support for receiving and attaching a wafer thereto; a support lift means for supporting the wafer; a driving means coupled to the support lift means for gradually raising the support lift means to contact the wafer in response to a variable quantity; a controller for receiving the variable quantity; and a regulating means coupled to the driving means and to the controller, the regulating means for controlling the variable quantity going to the driving means when a predetermined variable quantity is detected.

Abstract: A wafer stage installed in a process chamber for safely dechucking a wafer is provided. In one embodiment, the wafer stage comprises: a chuck support for supporting a chuck; a chuck mounted on the chuck support for receiving and attaching a wafer thereto; a support lift means for supporting the wafer; a driving means coupled to the support lift means for gradually raising the support lift means to contact the wafer in response to a variable quantity; a sensor attached to the driving means for detecting a change in the variable quantity; and a controller for controlling the variable quantity to the driving means when a predetermined variable quantity is detected in comparison to the change in the variable quantity for a predetermined time.

Abstract: A wafer stage installed in a process chamber for safely dechucking a wafer is provided. In one embodiment, the wafer stage comprises: a chuck support for supporting a chuck; a chuck mounted on the chuck support for receiving and attaching a wafer thereto; a support lift means for supporting the wafer; a driving means coupled to the support lift means for gradually raising the support lift means to contact the wafer in response to a variable quantity; a controller for receiving the variable quantity; and a regulating means coupled to the driving means and to the controller, the regulating means for controlling the variable quantity going to the driving means when a predetermined variable quantity is detected.

Abstract: The present invention provides a ventilation system and method that operates to remove outgassing of chemicals formed on a wafer during a wafer fabrication process to prevent contamination in a sealed wafer handling chamber. More particularly, the present invention discloses a ventilation system having a hood body having a gas supply conduit attached to a sealed outer side chamber of the ventilation hood such that contaminating particles in an interior of the hood are carried out by a purge gas flown into the hood interior through an inlet of the hood connected to the gas supply conduit into a facility vacuum exhaust system attached to an outlet of the hood. Preferably, the chamber is a load-lock chamber that operates to perform load lock processing on wafers and further operates to load and unload wafers to another location for further processing after using the ventilation system.