Patents by Inventor Yu-Chih Tsai

Yu-Chih Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240371776
    Abstract: A manufacturing method of a semiconductor package includes the following steps. A semiconductor die set is placed adjacent to a lower conductive via. The semiconductor die set and the lower conductive via are at least laterally encapsulated with a lower encapsulating material to form a lower encapsulated semiconductor device. A lower redistribution structure is formed over the lower encapsulated semiconductor device. A sensor die is placed adjacent to an upper conductive via, wherein the sensor die has a pad and a sensing region. The sensor die and the upper conductive via are encapsulated with an upper encapsulating material to form an upper encapsulated semiconductor device. An upper redistribution structure is formed over the upper encapsulated semiconductor device, wherein the upper redistribution structure is connected to the pad and reveals the sensing region of the sensor die.
    Type: Application
    Filed: July 15, 2024
    Publication date: November 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ying-Cheng Tseng, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu
  • Patent number: 12115618
    Abstract: A belt sander includes a main casing, a frame arm rotatably connected to the main casing, an abrasive belt mounted to the frame arm and adapted to be driven by electric power, a positioning member, a first sensor and a second sensor. The positioning member is movably mounted to the main casing and is movable relative to the main casing between a releasing position, where the first and second sensors are in a first sensor state, and where the second sensor generates a first signal for ceasing the electric power, and a first engaging position, where the first and second sensors are in the second sensor state, and where the second sensor generates a second signal for conducting the electric power.
    Type: Grant
    Filed: May 5, 2022
    Date of Patent: October 15, 2024
    Assignee: Basso Industry Corp.
    Inventors: Yu-Da Chen, Ching-Chih Ho, Bo-Jhuang Chen, Yu-Ming Chan, Min-Hsu Tsai
  • Patent number: 12114411
    Abstract: A target droplet source for an extreme ultraviolet (EUV) source includes a droplet generator configured to generate target droplets of a given material. The droplet generator includes a nozzle configured to supply the target droplets in a space enclosed by a chamber. In some embodiments, a nozzle tube is arranged within the nozzle of the droplet generator, and the nozzle tube includes a structured nozzle pattern configured to provide an angular momentum to the target droplets.
    Type: Grant
    Filed: March 6, 2023
    Date of Patent: October 8, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Huan Chen, Yu-Chih Huang, Ming-Hsun Tsai, Shang-Chieh Chien, Heng-Hsin Liu
  • Patent number: 12113022
    Abstract: A semiconductor package includes a lower encapsulated semiconductor device, a lower redistribution structure, an upper encapsulated semiconductor device, and an upper redistribution structure. The lower redistribution structure is disposed over and electrically connected to the lower encapsulated semiconductor device. The upper encapsulated semiconductor device is disposed over the lower encapsulated semiconductor device and includes a sensor die having a pad and a sensing region, an upper encapsulating material at least laterally encapsulating the sensor die, and an upper conductive via extending through the upper encapsulating material and connected to the lower redistribution structure. The upper redistribution structure is disposed over the upper encapsulated semiconductor device. The upper redistribution structure covers the pad of the sensor die and has an opening located on the sensing region of the sensor die.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: October 8, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ying-Cheng Tseng, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu
  • Publication number: 20240321780
    Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern.
    Type: Application
    Filed: June 4, 2024
    Publication date: September 26, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai, Shih-Wei Chen, Chia-Hung Liu, Hao-Yi Tsai, Chung-Shi Liu
  • Publication number: 20240274461
    Abstract: A die bonding tool having a tool head including a plurality of openings fluidly coupled to a vacuum source to selectively secure a semiconductor die onto the tool head via the application of a suction force. The plurality of openings have non-uniform cross-sectional areas, including one or more first openings having a first cross-sectional area and one or more second openings having a second cross-sectional area that is greater than the first cross-section area. A first minimum offset distance between each of the first openings and any peripheral edge of the tool head is less than a second minimum offset distance between each of the second openings and any peripheral edge of the tool head. The configuration of the openings in the tool head may improve bonding of the semiconductor die to a substrate by inhibiting air becoming trapped between the semiconductor die and the substrate during the bonding process.
    Type: Application
    Filed: February 15, 2023
    Publication date: August 15, 2024
    Inventors: Chia-Yin CHEN, I-Chun HSU, Yu-Sheng LIN, Yan-Zuo TSAI, Yung-Chi LIN, Tsang-Jiuh WU, Wen-Chih CHIOU
  • Publication number: 20230385647
    Abstract: A neural network is provided to include a layer that has a weight set. The neural network is trained based on a first compression quality level, where the weight set and a first set of batch normalization coefficients are used in said layer, so the weight set and the first set of batch normalization coefficients are trained with respect to the first compression quality level. Then, the neural network is trained based on a second compression quality level, where the weight set that has been trained with respect to the first compression quality level and a second set of batch normalization coefficients are used in said layer, so the weight set is trained with respect to both of the first and second compression quality levels, and the second set of batch normalization coefficients is trained with respect to the second compression quality level.
    Type: Application
    Filed: May 24, 2023
    Publication date: November 30, 2023
    Applicant: National Tsing Hua University
    Inventors: Chung-Yueh Liu, Yu-Chih Tsai, Ren-Shuo Liu
  • Publication number: 20230236797
    Abstract: A bit-serial computing device includes a computing circuit and a scaler. The computing circuit includes multiple MAC slices, and receives a multiplier vector and a multiplicand vector that contains multiple multiplicand inputs. Each multiplicand input contains multiple multiplicand segments that have different significances. The significances respectively correspond to the MAC slices. Correspondence between the significances and the MAC slices is variable. Each MAC slice calculates an inner product of the multiplier vector and a vector that is constituted by the multiplicand segments of the multiplicand inputs having the significance corresponding to the MAC slice. With respect to each MAC slice, the scaler multiplies the inner product that is calculated by the MAC slice by a weighting ratio that represents the significance corresponding to the MAC slice, so as to obtain a scaled inner product that corresponds to the MAC slice.
    Type: Application
    Filed: January 18, 2023
    Publication date: July 27, 2023
    Applicant: National Tsing Hua University
    Inventors: Yu-Chih TSAI, Wen-Chien TING, Ren-Shuo LIU
  • Patent number: 11584959
    Abstract: Methods are provided for reducing the complexity of a population of nucleic acids prior to performing an analysis of the nucleic acids, e.g., sequence analysis. The methods result in a subset of the initial population enriched for a target region, which is typically located within one or more target fragments. The methods are particularly useful for analyzing populations having a high degree of complexity, e.g., chromosomal-derived DNA, whole genomic DNA, or mRNA populations.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: February 21, 2023
    Assignee: Pacific Biosciences of California, Inc.
    Inventors: Thang Tat Pham, Yu-Chih Tsai, Jonas Korlach, Tyson A. Clark, Stephen Turner
  • Publication number: 20200399690
    Abstract: Methods are provided for reducing the complexity of a population of nucleic acids prior to performing an analysis of the nucleic acids, e.g., sequence analysis. The methods result in a subset of the initial population enriched for a target region, which is typically located within one or more target fragments. The methods are particularly useful for analyzing populations having a high degree of complexity, e.g., chromosomal-derived DNA, whole genomic DNA, or mRNA populations.
    Type: Application
    Filed: March 24, 2020
    Publication date: December 24, 2020
    Inventors: Thang Tat Pham, Yu-Chih Tsai, Jonas Korlach, Tyson A. Clark, Stephen Turner
  • Patent number: 10858651
    Abstract: Methods are provided for reducing the complexity of a population of nucleic acids prior to performing an analysis of the nucleic acids, e.g., sequence analysis. The methods result in a subset of the initial population enriched for a target region, which is typically located within one or more target fragments. The methods are particularly useful for analyzing populations having a high degree of complexity, e.g., chromosomal-derived DNA, whole genomic DNA, or mRNA populations.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: December 8, 2020
    Assignee: Pacific Biosciences of California, Inc.
    Inventors: Yu-Chih Tsai, Igor Vilfan, Khai Luong
  • Patent number: 10640818
    Abstract: Methods are provided for reducing the complexity of a population of nucleic acids prior to performing an analysis of the nucleic acids, e.g., sequence analysis. The methods result in a subset of the initial population enriched for a target region, which is typically located within one or more target fragments. The methods are particularly useful for analyzing populations having a high degree of complexity, e.g., chromosomal-derived DNA, whole genomic DNA, or mRNA populations.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: May 5, 2020
    Assignee: Pacific Biosciences of California, Inc.
    Inventors: Thang Tat Pham, Yu-Chih Tsai, Jonas Korlach, Tyson A. Clark, Stephen Turner
  • Publication number: 20200109396
    Abstract: Methods are provided for reducing the complexity of a population of nucleic acids prior to performing an analysis of the nucleic acids, e.g., sequence analysis. The methods result in a subset of the initial population enriched for a target region, which is typically located within one or more target fragments. The methods are particularly useful for analyzing populations having a high degree of complexity, e.g., chromosomal-derived DNA, whole genomic DNA, or mRNA populations.
    Type: Application
    Filed: August 28, 2019
    Publication date: April 9, 2020
    Inventors: Yu-Chih Tsai, Igor Vilfan, Khai Luong
  • Patent number: 10435685
    Abstract: Methods are provided for reducing the complexity of a population of nucleic acids prior to performing an analysis of the nucleic acids, e.g., sequence analysis. The methods result in a subset of the initial population enriched for a target region, which is typically located within one or more target fragments. The methods are particularly useful for analyzing populations having a high degree of complexity, e.g., chromosomal-derived DNA, whole genomic DNA, or mRNA populations.
    Type: Grant
    Filed: January 14, 2016
    Date of Patent: October 8, 2019
    Assignee: Pacific Biosciences of California, Inc.
    Inventors: Yu-Chih Tsai, Igor Drasko Vilfan, Khai Luong
  • Publication number: 20170145492
    Abstract: Methods are provided for reducing the complexity of a population of nucleic acids prior to performing an analysis of the nucleic acids, e.g., sequence analysis. The methods result in a subset of the initial population enriched for a target region, which is typically located within one or more target fragments. The methods are particularly useful for analyzing populations having a high degree of complexity, e.g., chromosomal-derived DNA, whole genomic DNA, or mRNA populations.
    Type: Application
    Filed: November 16, 2016
    Publication date: May 25, 2017
    Inventors: Thang Tat Pham, Yu-Chih Tsai, Jonas Korlach, Tyson A. Clark, Stephen Turner
  • Patent number: 9528107
    Abstract: Methods are provided for reducing the complexity of a population of nucleic acids prior to performing an analysis of the nucleic acids, e.g., sequence analysis. The methods result in a subset of the initial population enriched for a target region, which is typically located within one or more target fragments. The methods are particularly useful for analyzing populations having a high degree of complexity, e.g., chromosomal-derived DNA, whole genomic DNA, or mRNA populations.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: December 27, 2016
    Assignee: Pacific Biosciences of California, Inc.
    Inventors: Thang Tat Pham, Yu-Chih Tsai, Jonas Korlach, Tyson A. Clark, Stephen Turner
  • Publication number: 20160208241
    Abstract: Methods are provided for reducing the complexity of a population of nucleic acids prior to performing an analysis of the nucleic acids, e.g., sequence analysis. The methods result in a subset of the initial population enriched for a target region, which is typically located within one or more target fragments. The methods are particularly useful for analyzing populations having a high degree of complexity, e.g., chromosomal-derived DNA, whole genomic DNA, or mRNA populations.
    Type: Application
    Filed: January 14, 2016
    Publication date: July 21, 2016
    Inventors: Yu-Chih Tsai, Igor Drasko Vilfan, Khai Luong
  • Patent number: 9381517
    Abstract: Disclosed are compositions, devices, and methods for loading molecules of interest onto a substrate by contacting beads having molecules of interest attached to them with the substrate, for example by providing a field that brings the beads into proximity or contact with the substrate and moves the beads with respect to the substrate. Such molecules of interest can be deposited onto substrates for single-molecule analysis.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: July 5, 2016
    Assignee: Pacific Biosciences of California, Inc.
    Inventors: Thang Pham, Jeremy Gray, Adrian Fehr, AJ Chmura, Yu-Chih Tsai, Arunashree Bhamidipati
  • Publication number: 20140193315
    Abstract: Disclosed are compositions, devices, and methods for loading molecules of interest onto a substrate by contacting beads having molecules of interest attached to them with the substrate, for example by providing a field that brings the beads into proximity or contact with the substrate and moves the beads with respect to the substrate. Such molecules of interest can be deposited onto substrates for single-molecule analysis.
    Type: Application
    Filed: January 7, 2014
    Publication date: July 10, 2014
    Applicant: Pacific Biosciences of California, Inc.
    Inventors: Thang Pham, Jeremy Gray, Adrian Fehr, Aj Chmura, Yu-Chih Tsai, Arunashree Bhamidipati
  • Publication number: 20140134610
    Abstract: Methods are provided for reducing the complexity of a population of nucleic acids prior to performing an analysis of the nucleic acids, e.g., sequence analysis. The methods result in a subset of the initial population enriched for a target region, which is typically located within one or more target fragments. The methods are particularly useful for analyzing populations having a high degree of complexity, e.g., chromosomal-derived DNA, whole genomic DNA, or mRNA populations.
    Type: Application
    Filed: October 31, 2013
    Publication date: May 15, 2014
    Applicant: Pacific Biosciences of California, Inc.
    Inventors: Thang-Tat Pham, Yu-Chih Tsai, Jonas Korlach, Tyson A. Clark, Stephen Turner