Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.

Abstract: Devices and method for forming a switch including a heater layer including a first heater pad, a second heater pad, and a heater line connecting the first heater pad and the second heater pad, a phase change material (PCM) layer positioned in a same vertical plane as the heater line, and a floating spreader layer including a first portion positioned in the same vertical plane as the heater line and the PCM layer, in which the first portion has a first width that is less than or equal to a distance between proximate sidewalls of the first heater pad and the second heater pad.

Abstract: A display apparatus includes a light-transmitting structural plate, some optical microscopic structures, an optical film, a base plate and some light emitting elements. The light-transmitting structural plate has a first side and a second side opposite to each other. The optical microscopic structures are regularly arrayed and formed on the first side or the second side. The optical microscopic structure has an inclined surface connecting at a connecting line and forming an angle ranging between 30 degrees and 150 degrees with a corresponding inclined surface of an adjacent one of the optical microscopic structures. The optical film is located on the first side. The base plate is separated from the second side by a space. The light emitting elements are located inside the space and disposed on the base plate. The light emitting elements respectively emit a light ray to the light-transmitting structural plate.

Abstract: A method, a wireless modem and a mobile device for wireless communication are provided. The method for wireless communication includes: judging a plurality of service types for a plurality of cells; judging a plurality of gears for each of the service types; obtaining a customization favor setting; obtaining a plurality of weighted priority values for the plurality of cells according to the plurality of service types and the customization favor setting; obtaining a plurality of weighted signal quality values for the plurality of cells according to the plurality of service types, the plurality of gears for each of the plurality of service types and the customization favor setting; in an idle mode, triggering mobility via cell reselection which uses the weighted priority values or the weighted signal quality values; and in a connected mode, triggering mobility via measurement reports which are generated based on the weighted signal quality values.

Abstract: A semiconductor device according to embodiments of the present disclosure includes a first die including a first bonding layer and a second die including a second hybrid bonding layer. The first bonding layer includes a first dielectric layer and a first metal coil embedded in the first dielectric layer. The second bonding layer includes a second dielectric layer and a second metal coil embedded in the second dielectric layer. The second hybrid bonding layer is bonded to the first hybrid bonding layer such that the first dielectric layer is bonded to the second dielectric layer and the first metal coil is bonded to the second metal coil.

Abstract: A wafer transporting method includes following operations. A plurality of wafers are received in a semiconductor container attached to a mobile vehicle. An air processing system is coupled to a wall of the semiconductor container. The air processing system includes an inlet valve, an outlet valve, a pump between the inlet valve and the outlet valve, and a desiccant coupled to the pump. The semiconductor container is moved. The pump of the air processing system is turned on to extract air from inside the semiconductor container into the air processing system through the inlet valve. Humidity of the air is reduced when the air passes through the desiccant of the air processing system. The air is returned back to the semiconductor container through the outlet valve.

Abstract: A semiconductor device structure and a formation method are provided. The method includes forming a protruding structure over a substrate. The protruding structure has multiple sacrificial layers and multiple semiconductor layers, and the sacrificial layers and the semiconductor layers have an alternating configuration. The method also includes forming a gate stack to wrap a portion of the protruding structure. The method further includes forming an epitaxial structure abutting edges of the semiconductor layers. The formation of the epitaxial structure includes forming a lower semiconductor portion on a bottom of the recess and forming an upper semiconductor portion over the lower semiconductor portion. The upper semiconductor portion and the lower semiconductor portion are oppositely doped.

Abstract: A method for preparing a perovskite solar cell is disclosed, which comprises the following steps: providing a first electrode; forming an active layer on the first electrode; and forming a second electrode on the active layer. Herein, the active layer can be prepared by the following steps: mixing a perovskite precursor and a solvent mixture to form a precursor solution, wherein the solvent mixture comprises a first solvent and a second solvent, the first solvent is selected from the group consisting of ?-butyrolactone (GBL), dimethyl sulfoxide (DMSO), 2-methylpyrazine (2-MP), dimethylformamide (DMF), 1-methyl-2-pyrrolidone (NMP), dimethylacetamide (DMAc) and a combination thereof, and the second solvent is an alcohol; and coating the first electrode with the precursor solution and heating the precursor solution to form the active layer.

Abstract: The invention provides a device for sputtering comprising a main magnet, two secondary magnets mounted on two sides of the main magnet symmetrically, and a shell. The two secondary magnets face to each other in ends with the same polarity in a line. The shell is cylindrical and contains the main magnet and the secondary magnets.

Abstract: The invention provides a device for sputtering comprising a main magnet, two secondary magnets mounted on two sides of the main magnet symmetrically, and a shell. The two secondary magnets face to each other in ends with the same polarity in a line. The shell is cylindrical and contains the main magnet and the secondary magnets.

Abstract: A method for preparing a perovskite solar cell is disclosed, which comprises the following steps: providing a first electrode; forming an active layer on the first electrode; and forming a second electrode on the active layer. Herein, the active layer can be prepared by the following steps: mixing a perovskite precursor and a solvent mixture to form a precursor solution, wherein the solvent mixture comprises a first solvent and a second solvent, the first solvent is selected from the group consisting of ?-butyrolactone (GBL), dimethyl sulfoxide (DMSO), 2-methylpyrazine (2-MP), dimethylformamide (DMF), 1-methyl-2-pyrrolidone (NMP), dimethylacetamide (DMAc) and a combination thereof, and the second solvent is an alcohol; and coating the first electrode with the precursor solution and heating the precursor solution to form the active layer.

Abstract: Provided is a semiconductor device including a first fin-type field effect transistor (FinFET). The first FinFET includes a first gate structure over a first semiconductor fin and the first gate structure includes a first work function layer. The first work function layer includes a first layer and a second layer. The first layer has a bar-shaped structure, the second layer has a U-shaped structure encapsulating sidewalls and a bottom surface of the first layer, and the first layer and the second layer include different materials. A method of manufacturing the semiconductor device is also provided.

Abstract: Provided is a semiconductor device including a first fin-type field effect transistor (FinFET). The first FinFET includes a first gate structure over a first semiconductor fin and the first gate structure includes a first work function layer. The first work function layer includes a first layer and a second layer. The first layer has a bar-shaped structure, the second layer has a U-shaped structure encapsulating sidewalls and a bottom surface of the first layer, and the first layer and the second layer include different materials. A method of manufacturing the semiconductor device is also provided.

Abstract: The present invention relates to a serial module of organic solar cells and the method for manufacturing the same. The structure comprises a transparent conductive layer composed by a plurality of conductive blocks, an active layer having notches on the periphery, and a metal layer composed by a plurality of metal blocks. The active layer according to the present invention is a complete layer except the notches on the periphery for exposing a portion of the transparent conductive layer. The metal blocks can contact the conductive blocks of adjacent organic solar cell via the exposure areas and thus connecting the organic solar cells in series. The present invention can improves the power generating efficiency of organic solar cells in a limited space, which is beneficial to the development of promotion of future organic solar cells.

Abstract: The present invention discloses a method for improving mass-production yield of large-area organic solar cells for forming the active layer using the roll-to-roll process. The active layer includes low-bandgap high-polymer PTB7, Fullerenes derivative PC71BM, and high-boiling-point additives. The addition of the high-boiling-point additives can enhance the efficiency of organic solar cells effectively. In the roll-to-roll process according to the present invention, the drying temperature for the wet film is controlled for controlling the content of additives in the dry film. Thereby, the stability of the overall mass production and the device yield can be both improved.

Abstract: The present invention discloses a method for improving mass-production yield of large-area organic solar cells for forming the active layer using the roll-to-roll process. The active layer includes low-bandgap high-polymer PTB7, Fullerenes derivative PC71BM, and high-boiling-point additives. The addition of the high-boiling-point additives can enhance the efficiency of organic solar cells effectively. In the roll-to-roll process according to the present invention, the drying temperature for the wet film is controlled for controlling the content of additives in the dry film. Thereby, the stability of the overall mass production and the device yield can be both improved.

Abstract: The present relates to antioxidant conductive copper ink and the method for preparing the same. The antioxidant conductive copper ink comprises nanometer copper or copper-alloy particles, which are used as the conductive particle material, water-free alcohol, which is used as the solvent, tert-butanol and ultra-pure water, which is used as the pasting agent, and carboxylic acid, which is used as the dispersant. Alternatively, isopropanol is used as the pasting agent and glycol is used as the solvent for injecting processes. The antioxidant conductive copper ink disclosed in the present invention owns the properties of high stability and low cost, and hence is applicable to the applications of fabricating the electrodes of silicon-crystal solar cells and printable electronic materials such as PCB or RFID.

Abstract: A method of making a solar cell includes: preparing an active layer solution including p-type and n-type organic semiconductor materials, a solvent, and an additive, the additive containing 1, 8-iodooctane (DIO) and 1-chloronaphthalene (CN) that has a total volume not greater than 3 vol % based on a total volume of the solvent and the additive; preparing an assembly having a substrate, a first electrode layer, and a first transporting layer; coating the active layer solution on the first transporting layer to form a wet active layer; drying the wet active layer at a temperature not greater than 60° C.; and forming a second transporting layer and a second electrode layer on the active layer.

Abstract: A method for manufacturing large-area organic solar cells utilizes a hot solvent vapor annealing manufacturing process while manufacturing the organic solar cells via a large-area proceeding method, such as spraying. Namely, a heated solvent vapor is utilized to modify an active layer after the active layer of the organic solar cells is formed, which ensures a flatness and an uniformity thereof and increases a crystallinity of the active layer and an element charge transport rate so that a power conversion efficiency of the large area organic solar cells is increased, a proceeding time is quite short, and the performance thereof is quite obvious. Therefore, the method not only reduces the cost by a large area production but obtains organic solar cells with higher conversion efficiency.