Patents by Inventor Yu-Ching Kuo

Yu-Ching Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200365571
    Abstract: Provided is a package structure including at least two chips, an interposer, a first encapsulant, and a second encapsulant. The at least two chips are disposed side by side and bonded to the interposer by a plurality of connectors. The first encapsulant is disposed on the interposer and filling in a gap between the at least two chips. The second encapsulant encapsulates the plurality of connectors and surrounding the at least two chips, wherein the second encapsulant is in contact with the first encapsulant sandwiched between the at least two chips, and a material of the second encapsulant has a coefficient of thermal expansion (CTE) larger than a CTE of a material of the first encapsulant. A method of manufacturing a package structure is also provided.
    Type: Application
    Filed: May 16, 2019
    Publication date: November 19, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Wei Chen, Li-Chung Kuo, Long-Hua Lee, Szu-Wei Lu, Ying-Ching Shih, Kuan-Yu Huang
  • Publication number: 20200335465
    Abstract: An integrated circuit package includes a die. An electrically conductive layer comprises a redistribution layer (RDL) in the die, or a micro-bump layer above the die, or both. The micro bump layer comprises at least one micro-bump line. A filter comprises the electrically conductive layer. A capacitor comprises an electrode formed in the electrically conductive layer.
    Type: Application
    Filed: July 8, 2020
    Publication date: October 22, 2020
    Inventors: Hsiao-Tsung Yen, Jhe-Ching Lu, Yu-Ling Lin, Chin-Wei Kuo, Min-Chie Jeng
  • Patent number: 10714441
    Abstract: An integrated circuit package includes a die. An electrically conductive layer comprises a redistribution layer (RDL) in the die, or a micro-bump layer above the die, or both. The micro bump layer comprises at least one micro-bump line. A filter comprises the electrically conductive layer. A capacitor comprises an electrode formed in the electrically conductive layer.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: July 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiao-Tsung Yen, Jhe-Ching Lu, Yu-Ling Lin, Chin-Wei Kuo, Min-Chie Jeng
  • Publication number: 20200143985
    Abstract: The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, a first metal winding and a second metal winding. A first wiring layer, a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from the outside to the inside; the first metal winding is formed on the first wiring layer and winded around the magnetic core in a foil structure; the first insulating layer is at least partially covered by the first metal winding; a second metal winding is formed on the second wiring layer and winded around the magnetic core in a foil structure, wherein the second metal winding is at least partially covered by the first insulating layer, and is at least partially covered by the first metal winding.
    Type: Application
    Filed: October 31, 2019
    Publication date: May 7, 2020
    Inventors: Chaofeng CAI, Xiaoni XIN, Jianhong ZENG, Shouyu HONG, Rui WU, Haoyi YE, Yiqing YE, Jinping ZHOU, Zhiheng FU, Min ZHOU, YU-CHING KUO, TONG-SHENG PAN, WEN-YU LIN
  • Patent number: 10614945
    Abstract: A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: April 7, 2020
    Assignee: CYNTEC CO., LTD.
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Publication number: 20200006181
    Abstract: A method for forming an underfill structure and semiconductor packages including the underfill structure are disclosed. In an embodiment, the semiconductor package may include a package including an integrated circuit die; an interposer bonded to the integrated circuit die by a plurality of die connectors; and an encapsulant surrounding the integrated circuit die. The semiconductor package may further include a package substrate bonded to the interposer by a plurality of conductive connectors; a first underfill between the package and the package substrate, the first underfill having a first coefficient of thermal expansion (CTE); and a second underfill surrounding the first underfill, the second underfill having a second CTE less than the first CTE.
    Type: Application
    Filed: November 1, 2018
    Publication date: January 2, 2020
    Inventors: Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee, Kuan-Yu Huang
  • Publication number: 20190355982
    Abstract: A negative electrode of a thin film battery and method for forming the same, wherein the negative electrode comprises a porous structural layer, a capacitor layer, and a lithium ion source layer. The porous structural layer is formed on a metal substrate, and a thickness of the porous structural layer is between 200 nm and 700 nm. The capacitor layer is formed on the porous structural layer, and a thickness is between 100 nm and 300 nm. The lithium ion source layer is formed on the capacitor layer. Since the porous structural layer is made of stable material, a problem of charging-discharging instability that is occurred due to damage of battery structure caused by the volume expansion of the capacitor layer during the charging-discharging process can be improved. In addition, the negative electrode can be combined with a positive electrode for forming a thin film battery.
    Type: Application
    Filed: May 16, 2019
    Publication date: November 21, 2019
    Applicant: Securitag Assembly Group Co., Ltd
    Inventors: Kuan-Jiuh Lin, Wen-Yin Ko, Man-Jyun Fang, Chia Ming Kuo, Wayyu Chen, Yu Ching Wang
  • Publication number: 20190311836
    Abstract: A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.
    Type: Application
    Filed: June 20, 2019
    Publication date: October 10, 2019
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Publication number: 20190287709
    Abstract: An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. A winding space is formed among the top board, the bottom board and the pillar. The wire is wound around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a magnetic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 ?m.
    Type: Application
    Filed: June 6, 2019
    Publication date: September 19, 2019
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Patent number: 10366818
    Abstract: A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: July 30, 2019
    Assignee: CYNTEC CO., LTD
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Patent number: 10354789
    Abstract: An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. An area of the top board is smaller than an area of the bottom board. A winding space is formed among the top board, the bottom board and the pillar. The wire is winded around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a metallic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 ?m.
    Type: Grant
    Filed: December 11, 2013
    Date of Patent: July 16, 2019
    Assignee: CYNTEC CO., LTD.
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Publication number: 20190151402
    Abstract: The present invention discloses a method of treating cancer cells. The method comprises administrating a composition comprises a rhodamine or rhodamine derivative conjugated to a peptide comprises an amino acid sequence of SEQ ID NO: 1 to a subject in need, and activate the composition with light.
    Type: Application
    Filed: February 1, 2019
    Publication date: May 23, 2019
    Applicant: NATIONAL TSING HUA UNIVERSITY
    Inventors: Hui-Ching Wang, Dah-Tsyr Chang, Yu-Hsuen Tu, Ping-Hsueh Kuo
  • Patent number: 9887179
    Abstract: A light emitting diode device including a substrate, a plurality of light emitting elements, and an encapsulant. The substrate has a front surface and a back surface opposite to the front surface. The substrate includes a first portion and a second portion. The first portion has a plurality of light-penetrating holes. The second portion is separated from the first portion. The light emitting elements are disposed adjacent to the light-penetrating holes and on the front surface of the first portion. The encapsulant is disposed on the front surface of the substrate, and covers the light emitting elements.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: February 6, 2018
    Assignee: Harvatek Corporation
    Inventors: Hsin-I Lu, Hui-Yen Huang, Yu-Ching Kuo, Yu-Ping Wang, Jen-Hung Chang
  • Publication number: 20170338026
    Abstract: A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.
    Type: Application
    Filed: August 7, 2017
    Publication date: November 23, 2017
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Patent number: 9754713
    Abstract: A choke includes a single-piece core made of a same material, the single-piece core having a first board, a second board, and a pillar located between the first and second boards, a winding space located among the first board, the second board and the pillar, wherein the pillar has a non-circular and non-rectangular cross section having a first axis and a second axis substantially perpendicularly intersecting with each other at a center of the cross section of the pillar, and wherein a circumference of the cross section of the pillar includes two arc edges, four first substantially straight edges substantially parallel to the first axis, and two second substantially straight edges substantially parallel to the second axis, each of the first substantially straight edges being a joint of and in direct contact with one of the arc edges and one of the second substantially straight edges.
    Type: Grant
    Filed: July 8, 2015
    Date of Patent: September 5, 2017
    Assignee: CYNTEC CO., LTD.
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo, Chia-Hui Lai
  • Patent number: 9728331
    Abstract: A method to form a choke is disclosed, wherein the method comprises: encapsulating a hollow coil by a molding body; forming a first core, wherein the first core comprises a pillar; and disposing at least one first portion of the pillar inside the encapsulated hollow coil. The method avoids the overflow or vertical flow issue during a molding process for encapsulating a coil that has been wound on a core already.
    Type: Grant
    Filed: December 10, 2014
    Date of Patent: August 8, 2017
    Assignee: CYNTEC CO., LTD.
    Inventors: Lan-Chin Hsieh, Roger Hsieh, Yu-Ching Kuo, Chun-Tiao Liu
  • Publication number: 20160155727
    Abstract: A light emitting diode device including a substrate, a plurality of light emitting elements, and an encapsulant. The substrate has a front surface and a back surface opposite to the front surface. The substrate includes a first portion and a second portion. The first portion has a plurality of light-penetrating holes. The second portion is separated from the first portion. The light emitting elements are disposed adjacent to the light-penetrating holes and on the front surface of the first portion. The encapsulant is disposed on the front surface of the substrate, and covers the light emitting elements.
    Type: Application
    Filed: March 26, 2015
    Publication date: June 2, 2016
    Inventors: Hsin-I LU, Hui-Yen HUANG, Yu-Ching KUO, Yu-Ping WANG, Jen-Hung CHANG
  • Patent number: 9229495
    Abstract: A support retaining structure for interface card includes a support frame, a hook and positioning structure, an active hook, and a fixing member, wherein the support frame, the hook and positioning structure, the active hook, and the fixing member are cooperated to each other in order to make the support and fixing structure be suitable for interface card with different dimensions, and the hook and positioning structure is able to easily disassembly from the support frame and assembly to the support frame.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: January 5, 2016
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventor: Yu-Ching Kuo
  • Patent number: 9208937
    Abstract: A choke includes a single-piece core entirely made of a same material, the single-piece core having two boards and a pillar located between the two boards, a winding space being located among the two boards and the pillar, wherein the pillar has a non-circular and non-rectangular cross section along a direction substantially perpendicular to an axial direction of the pillar, the cross section of the pillar has a first axis and a second axis intersecting with each other at a center of the cross section of the pillar and are substantially perpendicular with each other, the first axis is longer than the second axis, and the cross section of the pillar is substantially symmetrical to both of the first axis and the second axis.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: December 8, 2015
    Assignee: CYNTEC CO., LTD.
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo
  • Publication number: 20150310975
    Abstract: A choke includes a single-piece core made of a same material, the single-piece core having a first board, a second board, and a pillar located between the first and second boards, a winding space located among the first board, the second board and the pillar, wherein the pillar has a non-circular and non-rectangular cross section having a first axis and a second axis substantially perpendicularly intersecting with each other at a center of the cross section of the pillar, and wherein a circumference of the cross section of the pillar includes two arc edges, four first substantially straight edges substantially parallel to the first axis, and two second substantially straight edges substantially parallel to the second axis, each of the first substantially straight edges being a joint of and in direct contact with one of the arc edges and one of the second substantially straight edges.
    Type: Application
    Filed: July 8, 2015
    Publication date: October 29, 2015
    Inventors: Tsung-Chan Wu, Roger Hsieh, Yi-Min Huang, Lan-Chin Hsieh, Yu-Ching Kuo, Chia-Hui LAI