Patents by Inventor Yu-Chuan Chang

Yu-Chuan Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210313464
    Abstract: Semiconductor devices and methods of forming the same are provided. In one embodiment, a semiconductor device includes a fin extending from a substrate, a gate structure over a channel region of the fin, a source/drain contact over a source/drain region of the fin, a spacer extending along a sidewall of the gate structure, a liner extending along a sidewall of the source/drain contact, a gate contact via over and electrically coupled to the gate structure, and a source/drain contact via over and electrically coupled to the source/drain contact. The gate contact via extends through a first dielectric layer such that a portion of the first dielectric layer interposes between the gate contact via and the spacer. The source/drain contact via extends through a second dielectric layer such that a portion of the second dielectric layer interposes between the source/drain contact via and the liner.
    Type: Application
    Filed: June 21, 2021
    Publication date: October 7, 2021
    Inventors: Jia-Chuan You, Chia-Hao Chang, Tien-Lu Lin, Yu-Ming Lin, Chih-Hao Wang
  • Publication number: 20210313424
    Abstract: A semiconductor device comprises a fin disposed on a substrate, a source/drain feature disposed over the fin, a silicide layer disposed over the source/drain feature, a seed metal layer disposed over the silicide layer and wrapping around the source/drain feature, and a metal layer disposed on the silicide layer, where the metal layer contacts the seed metal layer.
    Type: Application
    Filed: June 21, 2021
    Publication date: October 7, 2021
    Inventors: Shih-Chuan Chiu, Chia-Hao Chang, Jia-Chuan You, Tien-Lu Lin, Yu-Ming Lin, Chih-Hao Wang
  • Publication number: 20210257761
    Abstract: The present disclosure is related to electronic devices. At least some embodiments of the present disclosure relate to an electronic device comprising a circuit board, a first connector, and a second connector. The first connector and the second connector are disposed on the circuit board. The first connector is different from the second connector. The second connector is adjacent to the first connector. The first connector is arranged along a reference line in a first direction, and the second connector is adjacent to the reference line in the first direction.
    Type: Application
    Filed: February 13, 2020
    Publication date: August 19, 2021
    Inventors: HSIAO CHUNG CHEN, TAN HSIN CHANG, YUEH MING LIU, YU CHUAN CHANG, HUNG CHIEH CHANG
  • Patent number: 10847188
    Abstract: An accommodating structure of data storage unit includes a carrier case formed by integrated injection molding. The carrier case is a plastic piece comprising a housing, a pair of elastic arms connected with the housing and a push block connected with the elastic arms. The housing has a receiving space, and the push block has a tab at a side away from the receiving space. Moreover, the present invention further provides an accommodating assembly of data storage unit. The components of the accommodating assembly are less and the structures are simple to enhance the convenience of assembly.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: November 24, 2020
    Assignee: SUPER MICRO COMPUTER INC.
    Inventors: Yueh-Ming Liu, Hung-Chieh Chang, Tan-Hsin Chang, Hsiao-Chung Chen, Yu-Chuan Chang
  • Patent number: 10703047
    Abstract: A three-dimensional printing apparatus including a fusion nozzle and a control device is provided. The fusion nozzle is configured to heat a molding material at a heating temperature. The control device is coupled to the fusion nozzle. The control device is configured to control the fusion nozzle to perform a printing operation according to a slicing image. The control device determines the heating temperature of the fusion nozzle according to slicing contour information of a slicing object in the slicing image. In addition, a three-dimensional printing method is also provided.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: July 7, 2020
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc.
    Inventors: Yu-Chuan Chang, Bo-Yi Wu, Yu-Ting Huang
  • Patent number: 10678215
    Abstract: A three dimensional printing method and a three dimensional printing apparatus are provided. Layer information of a three dimensional object is obtained, wherein the three dimensional object includes at least one layer object and the layer information includes a plurality of coordinate point locations of the at least one layer object. A geometry parameter is calculated according to the coordinate point locations, and whether the layer object includes at least one small-area object is determined according to the geometry parameter. If the layer object includes the at least one small-area object, a feed-material output amount associated with the small-area object is reduced. A printing module is controlled to print the small-area object according to the reduced feed-material output amount.
    Type: Grant
    Filed: May 14, 2015
    Date of Patent: June 9, 2020
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventors: Yu-Chuan Chang, Hsin-Ta Hsieh
  • Patent number: 10673663
    Abstract: A physiological information collecting system and a transceiver device thereof are configured to collect physiological information from animal bodies. The transceiver device includes a front-end circuit, a follower circuit, a quadrature delay line and an output circuit. The front-end circuit separates a discontinuous signal into an in-phase signal and a quadrature signal. The follower circuit outputs a control voltage and rotates the in-phase signal by a predetermined phase angle to output a follower signal. The quadrature delay line rotates the quadrature signal by a corresponding phase angle according to the control voltage. The output circuit synthesizes the follower signal and the quadrature signal and outputs a data signal by demodulating the discontinuous signal.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: June 2, 2020
    Assignee: TAMKANG UNIVERSITY
    Inventors: Horng-Yuan Shih, Yu-Chuan Chang, Cheng-Wei Yang
  • Patent number: 10602061
    Abstract: Various embodiments of the present disclosure may include an imaging system with a plurality of camera modules. The view configuration of the camera modules may be switchable. Thus, the imaging system may switch between, at least, a 180 view configuration and a 360 degree view configuration. A camera module may also be coupled to the imaging system to provide an additional camera.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: March 24, 2020
    Assignee: FLIR Security, Inc.
    Inventors: Chaim Shain, Yu-Chuan Chang, Shih-Tso Liao
  • Patent number: 10596801
    Abstract: A three-dimensional (3-D) printing apparatus and an inkjet coloring method thereof are provided. The 3-D printing apparatus includes a platform, a three-dimensional printing head, an inkjet head and the method includes following steps. A layer thickness of at least one layer object forming a 3-D object is obtained. An ink discharge volume of an ink layer is adjusted according to the layer thickness, wherein the ink discharge volume is in positive correlation with the layer thickness. A building material is melted and printed out on the platform according to the layer thickness by the three-dimensional printing head to form the at last one layer object. Ink is dispensed on the at last one layer object according to the adjusted ink discharge volume by the inkjet head to form the ink layer.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: March 24, 2020
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc.
    Inventors: Yu-Chuan Chang, Hsin-Ta Hsieh
  • Patent number: 10589510
    Abstract: A three-dimensional (3-D) printing apparatus and a three dimensional printing method are provided. The three dimensional printing method includes following steps. A closed printing path of a closed-contour structure is obtained, wherein the closed printing path includes a printing start point and a printing end point. A printing head is controlled to move from the printing start point and along a front segment of the closed printing path according to a first moving speed, and the printing head is controlled to simultaneously extrude a building material. After the printing head moves along the front segment of the closed printing path, the printing head is controlled to move to the printing end point along a rear segment of the closed printing path according to a second moving speed, and the printing head is controlled to simultaneously extrude the building material. The second moving speed is less than the first moving speed.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: March 17, 2020
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc.
    Inventors: Bo-Yi Wu, Yu-Chuan Chang
  • Patent number: 10518522
    Abstract: A printing method for shielding component adopted to print a shielding component (2) of a 3D model (20) having multiple printing layers (11) is disclosed. The method first obtains all candidate points of first layer of the shielding component (2) and chooses one of the candidate points as a start point (211) of the first layer according to a default rule, and prints the first layer from the chosen start point (211). Next, the method obtains all candidate points of next layer of the shielding component (2) and chooses one of the candidate points of the next layer which is closest to the start point (211) of last layer to be printed as a start point of the next layer, and prints the next layer from the chosen start point.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: December 31, 2019
    Assignees: XYZPRINTING, INC., KINPO ELECTRONICS, INC.
    Inventors: Yu-Chuan Chang, Yu-Ting Huang
  • Patent number: 10514679
    Abstract: A method of slicing and printing a colour 3D model is disclosed. The method includes following steps: loading a model data corresponding to a colour 3D model; adding a pollution-blocking structure next to the colour 3D model; executing a slicing process to the pollution-blocking structure and the colour 3D model for generating a plurality of pollution-blocking slices and a plurality of model slices and configuring colour of each of the model slices; and, controlling a modeling nozzle (100) of a multi-colour 3D printer (1) to print the pollution-blocking slices and the model slices layer by layer and controlling a coloring nozzle (102) of the multi-colour 3D printer (1) to color each of the model slices.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: December 24, 2019
    Assignees: XYZPRINTING, INC., KINPO ELECTRONICS, INC.
    Inventors: Yang-Teh Lee, Jia-Yi Juang, Chun-Hsiang Huang, Ming-En Ho, Yu-Chuan Chang
  • Patent number: D877148
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: March 3, 2020
    Assignee: HTC Corporation
    Inventors: Chang-Hua Wei, Shih-Hsiu Lee, Yu-Chuan Chang
  • Patent number: D890171
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: July 14, 2020
    Assignee: HTC CORPORATION
    Inventors: Chang-Hua Wei, Shih-Hsiu Lee, Yu-Chuan Chang
  • Patent number: D890172
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: July 14, 2020
    Assignee: HTC CORPORATION
    Inventors: Chang-Hua Wei, Shih-Hsiu Lee, Yu-Chuan Chang
  • Patent number: D890173
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: July 14, 2020
    Assignee: HTC CORPORATION
    Inventors: Chang-Hua Wei, Shih-Hsiu Lee, Yu-Chuan Chang
  • Patent number: D894897
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: September 1, 2020
    Assignee: HTC CORPORATION
    Inventors: Chang-Hua Wei, Shih-Hsiu Lee, Yu-Chuan Chang
  • Patent number: D912048
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: March 2, 2021
    Assignee: HTC CORPORATION
    Inventors: Chang-Hua Wei, Shih-Hsiu Lee, Yu-Chuan Chang
  • Patent number: D914020
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: March 23, 2021
    Assignee: HTC CORPORATION
    Inventors: Chang-Hua Wei, Shih-Hsiu Lee, Yu-Chuan Chang
  • Patent number: D916087
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: April 13, 2021
    Assignee: HTC CORPORATION
    Inventors: Chang-Hua Wei, Shih-Hsiu Lee, Yu-Chuan Chang