Patents by Inventor Yu-Chun Chung

Yu-Chun Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10989363
    Abstract: The present disclosure relates to a LED filament and a LED bulb with the LED filament. The LED filament includes a carrier, LED chips disposed on the carrier, the carrier includes a first lateral section and a second lateral section opposite to the first lateral section, the LED chips are formed on the first lateral section, hardness of the first lateral section is less than that of the second lateral section. The disclosure further provides a LED bulb with the LED filament above. The LED filament above has benefits of improving structural strength and decreasing costs.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: April 27, 2021
    Assignees: KAISTAR LIGHTING (XIAMEN) CO., LTD., EPISTAR CORPORATION
    Inventors: Chien-Li Yang, Yu-Chun Chung, Yu Min Li
  • Publication number: 20190137048
    Abstract: The present disclosure relates to a LED filament and a LED bulb with the LED filament. The LED filament includes a carrier, LED chips disposed on the carrier, the carrier includes a first lateral section and a second lateral section opposite to the first lateral section, the LED chips are formed on the first lateral section, hardness of the first lateral section is less than that of the second lateral section. The disclosure further provides a LED bulb with the LED filament above. The LED filament above has benefits of improving structural strength and decreasing costs.
    Type: Application
    Filed: January 7, 2019
    Publication date: May 9, 2019
    Inventors: Chien-Li Yang, Yu-Chun Chung, Yu Min Li
  • Patent number: 10215342
    Abstract: The present disclosure relates to a LED filament and a LED bulb with the LED filament. The LED filament includes a carrier, LED chips disposed on the carrier, the carrier includes a first lateral section and a second lateral section opposite to the first lateral section, the LED chips are formed on the first lateral section, hardness of the first lateral section is less than that of the second lateral section. The disclosure further provides a LED bulb with the LED filament above. The LED filament above has benefits of improving structural strength and decreasing costs.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: February 26, 2019
    Assignees: KAISTAR LIGHTING (XIAMEN) CO., LTD, EPISTAR CORPORATION
    Inventors: Chien-Li Yang, Yu-Chun Chung, Yu Min Li
  • Patent number: 9653668
    Abstract: A LED filament and a LED filament bulb using the same are disclosed. The LED filament includes a carrier, a LED chip disposed on the carrier and a conductive lead connected to the carrier. The conductive lead is electrically connected to the LED chip and includes a lead head portion, a lead tail portion and a lead neck portion connecting the lead head portion with the lead tail portion. A solid body width of the lead neck portion is less than a maximum solid body width of the lead head portion. Because the lead neck portion with reduced solid body width can function as a vulnerable position of the conductive lead, when a stress is applied onto the conductive lead, the lead neck portion would first take action and therefore the bonding location between the lead head portion and the carrier or the carrier itself can be protected.
    Type: Grant
    Filed: October 10, 2015
    Date of Patent: May 16, 2017
    Assignees: KAISTAR LIGHTING (XIAMEN) CO., LTD., INTERLIGHT OPTOTECH CORPORATION
    Inventors: Yu-Chun Chung, Chien-Li Yang, Hong-Zhi Liu
  • Publication number: 20170016580
    Abstract: A LED filament and a LED filament bulb using the same are disclosed. The LED filament includes a carrier, a LED chip disposed on the carrier and a conductive lead connected to the carrier. The conductive lead is electrically connected to the LED chip and includes a lead head portion, a lead tail portion and a lead neck portion connecting the lead head portion with the lead tail portion. A solid body width of the lead neck portion is less than a maximum solid body width of the lead head portion. Because the lead neck portion with reduced solid body width can function as a vulnerable position of the conductive lead, when a stress is applied onto the conductive lead, the lead neck portion would first take action and therefore the bonding location between the lead head portion and the carrier or the carrier itself can be protected.
    Type: Application
    Filed: October 10, 2015
    Publication date: January 19, 2017
    Inventors: Yu-Chun Chung, Chien-Li Yang, Hong-Zhi Liu
  • Publication number: 20170016582
    Abstract: The present disclosure relates to a LED filament and a LED bulb with the LED filament. The LED filament includes a carrier, LED chips disposed on the carrier, the carrier includes a first lateral section and a second lateral section opposite to the first lateral section, the LED chips are formed on the first lateral section, hardness of the first lateral section is less than that of the second lateral section. The disclosure further provides a LED bulb with the LED filament above. The LED filament above has benefits of improving structural strength and decreasing costs.
    Type: Application
    Filed: June 24, 2016
    Publication date: January 19, 2017
    Inventors: Chien-Li Yang, Yu-Chun Chung, Yu Min Li