Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: An active-matrix display panel including a display area, a peripheral region and a fanout circuitry is provided. The peripheral region is connected with at least one side of the display area. The fanout circuitry is arranged on the peripheral region and is a multi-layered routing structure. By using the multi-layered routing structure aforementioned, the layout flexibility is improved significantly.