Abstract: A quantum dot composite structure and a method for forming the same are provided. The quantum dot composite structure includes: a glass particle including a glass matrix and a plurality of quantum dots located in the glass matrix, wherein at least one of the plurality of quantum dots includes an exposed surface in the glass matrix; and an inorganic protective layer disposed on the glass particle and covering the exposed surface.

Abstract: A control method of a driving mechanism is provided, including: the driving mechanism provides a first electrical signal from a control assembly to the driving mechanism to move the movable portion into an initial position relative to the fixed portion, wherein the control assembly includes a control unit and a position sensing unit; the status signal of an inertia sensing unit is read; the control unit sends the status signal to the control unit to calculate a target position; the control unit provides a second electrical signal to the driving assembly according to the target position for driving the driving assembly; a position signal is sent from the position sensing unit to the control unit; the control unit provides a third electric signal to the driving assembly to drive the driving assembly according the position signal.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: Methods, non-transitory computer readable media, and collaboration management devices are disclosed that identify a venue and registered users within a first radius of a venue geolocation of the venue. The venue satisfies venue parameters received from a client device and the venue geolocation is within a second radius of a user geolocation of an authenticated user. Social data for the venue generated from user data for the registered users is output to the client device. Digital invitations are sent to client devices associated with the registered users. A notification is output to the client device that includes user data for a subset of the registered users from which a positive response to the digital invitations was received. Visit data for the venue is updated to reflect a visit to the venue by the authenticated user and the subset of the registered users.

Abstract: Methods, non-transitory computer readable media, and reservation management devices are disclosed that obtain workspace parameter(s) from a client device after authenticating a user of the client device. User geolocations are determined for the authenticated user and registered user(s) identified by the authenticated user. Workspaces are filtered based on a correlation of the user geolocations and workspace geolocations for the workspaces to identify a subset of the workspaces. The workspaces are determined to satisfy the workspace parameter(s) based on workspace data for the workspaces. A selection of one of the subset of the workspaces is received from the authenticated user. Availability data for the one of the subset of the workspaces is updated based on a time window input by the authenticated user. A digital calendar invitation is then generated and provided to the client device and/or other client device(s) associated with one or more of the registered user(s).

Abstract: A connector assembling structure is provided. The connector assembling structure includes a shell, a circuit board, a connector, a fixing member, and an elastic member. The circuit board is disposed on the shell. The connector is disposed on the circuit board. The fixing member is fixed on the shell. The elastic member is disposed on the fixing member. The circuit board includes a pillar. The fixing member includes a fixing member opening corresponding to the pillar. The pillar passes through the fixing member opening. The size of the fixing member opening is greater than the size of the pillar, such that the circuit board and the elastic member may move relative to the fixing member through the fixing member opening.

Abstract: A wearable device includes a frame, two feet, and two pivoting modules. Each of the pivoting modules includes a first bracket fixedly connected to the frame, and a second bracket fixedly connected to one of the feet and pivotally coupled to the first bracket. The second bracket includes a positioning member and an inserting member. The positioning member is located in the first bracket, and the positioning member includes a plurality of slots. The inserting member is switchably inserted into one of the slots for adjusting a maximum outreaching volume from the frame to the feet.

Abstract: A connector assembling structure is provided. The connector assembling structure includes a shell, a circuit board, a connector, a fixing member, and an elastic member. The circuit board is disposed on the shell. The connector is disposed on the circuit board. The fixing member is fixed on the shell. The elastic member is disposed on the fixing member. The circuit board includes a pillar. The fixing member includes a fixing member opening corresponding to the pillar. The pillar passes through the fixing member opening. The size of the fixing member opening is greater than the size of the pillar, such that the circuit board and the elastic member may move relative to the fixing member through the fixing member opening.

Abstract: A head mounted display device includes a spectacles frame, two temples, an optomechanical module, a lens and a circuit board module. The temples are connected to the opposite ends of the spectacles frame, respectively. The lens is fixed to the spectacles frame. The optomechanical module is loaded on the spectacles frame, jointed to the lens, and configured for outputting signals to the lens. The circuit board module is disposed on the frame and electrically connected to the optomechanical module.

Abstract: A head mounted display device includes a spectacles frame, two temples, an optomechanical module, a lens and a circuit board module. The temples are connected to the opposite ends of the spectacles frame, respectively. The lens is fixed to the spectacles frame. The optomechanical module is loaded on the spectacles frame, jointed to the lens, and configured for outputting signals to the lens. The circuit board module is disposed on the frame and electrically connected to the optomechanical module.

Abstract: A wearable device includes a frame, two feet, and two pivoting modules. Each of the pivoting modules includes a first bracket fixedly connected to the frame, and a second bracket fixedly connected to one of the feet and pivotally coupled to the first bracket. The second bracket includes a positioning member and an inserting member. The positioning member is located in the first bracket, and the positioning member includes a plurality of slots. The inserting member is switchably inserted into one of the slots for adjusting a maximum outreaching volume from the frame to the feet.

Abstract: A time controller is able to convert and present the LCD display of gray levels within images with a brightness equal to that within the original images. The time controller alternates in operation between first and second modes of gamma correction, each for a specified time duration. In the first correction mode, the time controller corrects the original gray levels in a correction-positive manner and outputs first correction gray levels. In the second correction mode, the time controller corrects the original gray levels in a correction-negative manner, and outputs the second correction gray levels. The first correction gray level is equal to or larger than the second correction gray level, to correspond with original gray levels.

Abstract: A time controller is able to convert and present the LCD display of gray levels within images with a brightness equal to that within the original images. The time controller alternates in operation between first and second modes of gamma correction, each for a specified time duration. In the first correction mode, the time controller corrects the original gray levels in a correction-positive manner and outputs first correction gray levels. In the second correction mode, the time controller corrects the original gray levels in a correction-negative manner, and outputs the second correction gray levels. The first correction gray level is equal to or larger than the second correction gray level, to correspond with original gray levels.

Abstract: A method for fabricating liquid crystal display panels. The method includes forming at least one adhesive structure on a first substrate, to partition the first substrate into at least one dummy region and panel group regions, in which the dummy region is located between the two adjacent panel group regions; pouring liquid crystal into the dummy region and the panel group regions; and conjugating a second substrate at a side of the first substrate disposed with the adhesive structure, to seal spaces of the dummy region and the panel group regions between the first substrate and the second substrate, in which the liquid crystal can fill up the spaces of the panel group regions and at least a part of the spaces of the dummy region being sealed between the first substrate and the second substrate.

Abstract: A method for fabricating liquid crystal display panels. The method includes forming at least one adhesive structure on a first substrate, to partition the first substrate into at least one dummy region and panel group regions, in which the dummy region is located between the two adjacent panel group regions; pouring liquid crystal into the dummy region and the panel group regions; and conjugating a second substrate at a side of the first substrate disposed with the adhesive structure, to seal spaces of the dummy region and the panel group regions between the first substrate and the second substrate, in which the liquid crystal can fill up the spaces of the panel group regions and at least a part of the spaces of the dummy region being sealed between the first substrate and the second substrate.

Abstract: A resistor renormalization method for a source driving circuit is provided, wherein the source driving circuit includes a plurality of resistors coupled in series, and the resistors respectively have a resistance and correspond to a number section value. The resistor renormalization method includes the steps of: (A) adding the resistances of the resistors to generate a total resistance; (B) providing a radix, wherein the radix is a natural number; (C) dividing the total resistance by the radix to generate a calculated section value; (D) dividing the resistances of the resistors by the radix to generate a plurality of remainders, respectively, and adding the remainders to generate an accumulated remainder; and (E) setting the number section value and the resistance of each resistor according to a relation between the calculated section value and the number section value and a relation between the remainder of each resistor and the radix.

Abstract: A gate driver and a liquid crystal display using the same are provided. The gate driver includes a scan signal generating unit and a compensation unit. The scan signal generating unit has a plurality of output channels, and is used for sequentially outputting a scan signal through the output channels according to a basic clock and a start pulse. The compensation unit is coupled to the scan signal generating unit, and used for compensating the total resistance of each of the output channels, and sequentially receiving and transmitting the scan signal to a display panel.