Abstract: An imaging optical lens assembly includes four lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element and a fourth lens element. Each of the four lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. At least one of all lens surfaces of the four lens elements is aspheric and has at least one inflection point.

Abstract: A semiconductor device includes a gate structure on a substrate, in which the gate structure includes a main branch extending along a first direction on the substrate and a sub-branch extending along a second direction adjacent to the main branch. The semiconductor device also includes a first doped region overlapping the main branch and the sub-branch according to a top view and a second doped region overlapping the first doped region.

Abstract: A fabrication method is disclosed that includes: forming a first metal layer over first and second semiconductor structures; forming a first patterned photolithographic layer with an opening that exposes a portion of the first metal layer over the first semiconductor structure but not to a boundary between semiconductor structures; removing the exposed portion of the first metal layer; forming a second metal layer over the first and second semiconductor structures; forming a second patterned photolithographic layer with an opening that exposes a portion of the second metal layer over the second semiconductor structure but not to the boundary; removing the exposed portion of the first and second metal layers; wherein a barrier structure is generated between the first and second semiconductor structures that includes remaining portions of the first metal layer and a portion of the second metal layer overlying the remaining portions of the first metal layer.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: The present invention relates to a botulinum toxin type A complex, and a formulation thereof and a usage method therefor. The present invention provides the botulinum toxin type A complex, comprising an HA70 component, and an HA17 component, an HA33 component, an NTNH component, and a BoNT/A1 component, wherein the botulinum toxin complex has a molecular weight of 740-790 kDa. Compared with the existing botulinum toxin complexes, the botulinum toxin complex of the present invention is smaller in molecular weight and higher in safety, and has a comparable treatment effect.

Abstract: The described embodiments relate generally to the singulation of circuits and more particularly to a method of cutting of a polymer substrate that is overlaid with a conductive element and a passivation layer. In one embodiment, the passivation layer is applied selectively to the polymer substrate in an area covering the conductive element and extending at least a first distance past an outer edge of the conductive element. Then, a cutting operation is performed along a cutting path located a second distance from an outer edge of the passivation layer. The second distance is a minimum distance between the edge of the passivation layer and the cutting path that prevents a load applied at the second distance from causing a stress crack in the passivation layer.

Abstract: A display system having a capacitive touch panel is described. The capacitive touch panel includes an electrode circuit formed on a substrate. The electrode circuit has a first electrode including a plurality of first conducting patterns and a second electrode including a plurality of second conducting patterns. The first conducting patterns are electrically connected to each other. A plurality of signal wires is formed on the substrate. A dielectric layer covers the electrode circuit. An electrode bridge structure is formed on the dielectric layer and is electrically connected to the second conducting patterns of the electric circuit, such that the second conducting patterns are electrically connected to each other. The electrode bridge structure having uniform thickness is formed by the metal open repair technique. A method of manufacturing a display system is also described.

Abstract: The present invention provides a touch display device, which includes a display module and a touch panel. The display module includes a display panel and a control chip disposed on the display module to control the display module. The touch panel has a glass substrate and a driving chip disposed on the glass substrate to control at least one touching operation for the touch panel. The driving chip and the control chip are disposed in a misaligned manner.

Abstract: An electrode structure of multiple dielectric island layer and manufacturing method thereof are described. The electrode structure includes a substrate, an electrode bridge structure, a dielectric layer and a conducting pattern. The dielectric layer is formed on the substrate and the electrode bridge structure and has a plurality of dielectric island patterns. The dielectric island patterns cover a portion of the electrode bridge structure for forming a plurality of bridge patterns of the electrode bridge structure wherein the dielectric island patterns are alternately arranged with the bridge patterns. The conducting pattern has a first electrode, a second electrode, a third electrode and a fourth electrode. The first electrode is electrically connected to the second electrode. The third and fourth electrodes cover the bridge patterns of the electrode bridge structure for reducing the contact resistance between the third and fourth electrodes by the electrode bridge structure.

Abstract: An extruding mechanism includes a retaining base, a first handle provided for handling, a push rod pivotally coupled and having both ends extended out from a retaining base, a first resilient member and a first latch plate pivotally connected to a push rod in the retaining base; a poking member disposed on the retaining base; a second handle installed on the retaining base and having a driving arm at an end of the second handle, such that when the driving arm is turned clockwise or counterclockwise, the push rod can be shifted directly or indirectly by the first latch plate in the retaining base after being pressed by the poking member.

Abstract: An organic light emitting diode display panel element and a method for manufacturing the same are provided. The element comprises a substrate, a conductive wire layer, a protective layer, an organic light emitting diode structure, and a package body. It first makes the conductive wire layer on the substrate, then coats protective glue on a display area and a non-display area on the substrate, evaporates the organic light emitting diode structure on the display area on the substrate and connects it to the conductive wire layer (connection with electricity conductive ability), and packages the organic light emitting diode structure on the substrate. Therefore, twice protective glue coating process is not needed, it is easy to process the coating process, and the protective glue is more adhesive to the substrate, thus reducing process steps and processing time, meanwhile reducing process expenses.

Abstract: The extruding implement structure of the present invention comprises a handle pivotally connected to a rear base and disposed on one side of the base, and is substantially parallel to the base or in an aslant position, using a first resisting arm to press against a pushing member of a first exerting arm pivotally coupled to a rear base, and the pushing member uses a second resisting arm on the other end of the pivotal point to press against the first latch plate and drive the push rod to push and press against the silicon gel can for the gel injection. A latch member is disposed between the outside of the rear base and the second latch plate such that the silicon gel will not keep on squeezing the silicon gel after the operation is stopped.