Patents by Inventor Yu-Chun Yang
Yu-Chun Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11972957Abstract: A gas flow accelerator may include a body portion, and a tapered body portion including a first end integrally formed with the body portion. The gas flow accelerator may include an inlet port connected to the body portion and to receive a process gas to be removed from a semiconductor processing tool by a main pumping line. The semiconductor processing tool may include a chuck and a chuck vacuum line to apply a vacuum to the chuck to retain a semiconductor device. The tapered body portion may be configured to generate a rotational flow of the process gas to prevent buildup of processing byproduct on interior walls of the main pumping line. The gas flow accelerator may include an outlet port integrally formed with a second end of the tapered body portion. An end portion of the chuck vacuum line may be provided through the outlet port.Type: GrantFiled: July 31, 2020Date of Patent: April 30, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sheng-chun Yang, Chih-Lung Cheng, Yi-Ming Lin, Po-Chih Huang, Yu-Hsiang Juan, Xuan-Yang Zheng
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Publication number: 20240128178Abstract: A method of forming a semiconductor structure is provided, and includes trimming a first substrate to form a recess on a sidewall of the first substrate. A conductive structure is formed in the first substrate. The method includes bonding the first substrate to a carrier. The method includes thinning down the first substrate. The method also includes forming a dielectric material in the recess and over a top surface of the thinned first substrate. The method further includes performing a planarization process to remove the dielectric material and expose the conductive structure over the top surface. In addition, the method includes removing the carrier from the first substrate.Type: ApplicationFiled: February 8, 2023Publication date: April 18, 2024Inventors: Yu-Hung LIN, Wei-Ming WANG, Su-Chun YANG, Jih-Churng TWU, Shih-Peng TAI, Kuo-Chung YEE
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Publication number: 20240120405Abstract: A semiconductor device includes a gate structure on a substrate, in which the gate structure includes a main branch extending along a first direction on the substrate and a sub-branch extending along a second direction adjacent to the main branch. The semiconductor device also includes a first doped region overlapping the main branch and the sub-branch according to a top view and a second doped region overlapping the first doped region.Type: ApplicationFiled: December 18, 2023Publication date: April 11, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Heng-Ching Lin, Yu-Teng Tseng, Chu-Chun Chang, Kuo-Yuh Yang, Chia-Huei Lin
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Publication number: 20240079434Abstract: Various embodiments of the present disclosure are directed towards an image sensor including first chip and a second chip. The first chip includes a first substrate, a plurality of photodetectors disposed in the first substrate, a first interconnect structure disposed on a front side of the first substrate, and a first bond structure disposed on the first interconnect structure. The second chip underlies the first chip. The second chip includes a second substrate, a plurality of semiconductor devices disposed on the second substrate, a second interconnect structure disposed on a front side of the second substrate, and a second bond structure disposed on the second interconnect structure. A first bonding interface is disposed between the second bond structure and the first bond structure. The second interconnect structure is electrically coupled to the first interconnect structure by way of the first and second bond structures.Type: ApplicationFiled: January 5, 2023Publication date: March 7, 2024Inventors: Hao-Lin Yang, Kuan-Chieh Huang, Wei-Cheng Hsu, Tzu-Jui Wang, Chen-Jong Wang, Dun-Nian Yaung, Yu-Chun Chen
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Publication number: 20240067746Abstract: Disclosed herein are humanized antibodies, antigen-binding fragments thereof, and antibody conjugates, that are capable of specifically binding to certain biantennary Lewis antigens, which antigens are expressed in a variety of cancers. The presently disclosed antibodies are useful to target antigen-expressing cells for treatment or detection of disease, including various cancers. Also provided are polynucleotides, vectors, and host cells for producing the disclosed antibodies and antigen-binding fragments thereof. Pharmaceutical compositions, methods of treatment and detection, and uses of the antibodies, antigen-binding fragments, antibody conjugates, and compositions are also provided.Type: ApplicationFiled: February 28, 2023Publication date: February 29, 2024Inventors: Tong-Hsuan CHANG, Mei-Chun YANG, Liahng-Yirn LIU, Jerry TING, Shu-Yen CHANG, Yen-Ying CHEN, Yu-Yu LIN, Shu-Lun TANG
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Publication number: 20230383138Abstract: A manufacturing method of an elastic paint is provided. The manufacturing method includes: blending an original composition to produce a first rough painting material, where the original composition includes polycarbonatediol (PCDL), a polyurethane (PU) elastic powder, poly(methyl methacrylate) (PMMA), a photoinitiator, a wetting agent, a solvent, and an auxiliary agent; carrying out precipitation treatment on the first rough painting material, and filtering the treated first rough painting material, to produce a second rough painting material; blending the second rough painting material; sealing the blended second rough painting material to produce a plurality of layers in the second rough painting material; removing an upper portion and a lower portion from the layers to produce a main ingredient; and adding a curing agent and a diluent into the main ingredient to produce an elastic paint.Type: ApplicationFiled: December 6, 2022Publication date: November 30, 2023Inventors: Guo Lin YANG, Po-Wen HUANG, Yu-Chun YANG
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Patent number: 11161145Abstract: A processing method for a housing includes: providing a housing; forming a color layer on the housing; forming an ultraviolet curable layer on the color layer and executing a photo-curing process on the ultraviolet curable layer, materials of the ultraviolet curable layer including a light sensitive resin and a nano metal material; and forming an optical coating layer on the ultraviolet curable layer.Type: GrantFiled: September 18, 2019Date of Patent: November 2, 2021Assignee: ASUSTEK COMPUTER INC.Inventors: Guo-Lin Yang, Yu-Chun Yang, Po-Wen Huang
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Publication number: 20200086345Abstract: A processing method for a housing includes: providing a housing; forming a color layer on the housing; forming an ultraviolet curable layer on the color layer and executing a photo-curing process on the ultraviolet curable layer, materials of the ultraviolet curable layer including a light sensitive resin and a nano metal material; and forming an optical coating layer on the ultraviolet curable layer.Type: ApplicationFiled: September 18, 2019Publication date: March 19, 2020Inventors: Guo-Lin YANG, Yu-Chun YANG, Po-Wen HUANG
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Patent number: 10529726Abstract: A manufacturing method of a memory structure including the following steps is provided. A memory cell structure is formed on a substrate. The memory cell structure has a first side and a second side opposite to each other. A protective layer structure covering the memory cell structure is formed. The material of the protective layer structure is nitride. The protective layer structure is a continuous structure. The height of the protective layer structure adjacent to the second side of the memory cell structure is greater than the height of the protective layer structure adjacent to the first side of the memory cell structure.Type: GrantFiled: August 2, 2019Date of Patent: January 7, 2020Assignee: Winbond Electronics Corp.Inventors: Yi-Tsung Tsai, Yu-Chun Yang, Fang-Wei Lin, Hsin-Li Kuo
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Publication number: 20190355732Abstract: A manufacturing method of a memory structure including the following steps is provided. A memory cell structure is formed on a substrate. The memory cell structure has a first side and a second side opposite to each other. A protective layer structure covering the memory cell structure is formed. The material of the protective layer structure is nitride. The protective layer structure is a continuous structure. The height of the protective layer structure adjacent to the second side of the memory cell structure is greater than the height of the protective layer structure adjacent to the first side of the memory cell structure.Type: ApplicationFiled: August 2, 2019Publication date: November 21, 2019Applicant: Winbond Electronics Corp.Inventors: Yi-Tsung Tsai, Yu-Chun Yang, Fang-Wei Lin, Hsin-Li Kuo
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Patent number: 10438957Abstract: A memory structure including a substrate, a memory cell structure, and a protective layer structure is provided. The memory cell structure is disposed on the substrate and has a first side and a second side opposite to each other. The protective layer structure covers the memory cell structure. The material of the protective layer structure is nitride. The protective layer structure is a continuous structure. The height of the protective layer structure adjacent to the second side of the memory cell structure is greater than the height of the protective layer structure adjacent to the first side of the memory cell structure.Type: GrantFiled: August 15, 2017Date of Patent: October 8, 2019Assignee: Winbond Electronics Corp.Inventors: Yi-Tsung Tsai, Yu-Chun Yang, Fang-Wei Lin, Hsin-Li Kuo
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Publication number: 20190013322Abstract: A memory structure including a substrate, a memory cell structure, and a protective layer structure is provided. The memory cell structure is disposed on the substrate and has a first side and a second side opposite to each other. The protective layer structure covers the memory cell structure. The material of the protective layer structure is nitride. The protective layer structure is a continuous structure. The height of the protective layer structure adjacent to the second side of the memory cell structure is greater than the height of the protective layer structure adjacent to the first side of the memory cell structure.Type: ApplicationFiled: August 15, 2017Publication date: January 10, 2019Applicant: Winbond Electronics Corp.Inventors: Yi-Tsung Tsai, Yu-Chun Yang, Fang-Wei Lin, Hsin-Li Kuo
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Patent number: 8456656Abstract: A method for setting function options and a multi function peripheral (MFP) using the same are provided. The MFP at least includes an image sensor and an option switch, wherein the option switch includes a sliding groove and a shift lever, and the shift lever is disposed in sliding way in the sliding groove. The method includes using the image sensor to obtain an option image of the option switch; judging a corresponding position relating to the shift lever in the option image; and setting a peripheral function according to a function option corresponding to the corresponding position.Type: GrantFiled: January 7, 2011Date of Patent: June 4, 2013Assignees: Cal-Comp Electronics & Communications Company Limited, Kinpo Electronics, Inc.Inventors: Chen-Hua Pan, Yu-Chun Yang, Hsueh-Kuan Shih
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Patent number: 8199897Abstract: The invention discloses a call pickup method for a communication network system comprising a first terminal and a second terminal. The method comprise the steps of: (a) setting a common group extension in each of the first terminal and the second terminal; (b) transmitting a pickup request message via the common group extension from the second terminal while the first terminal is receiving an incoming call from a third terminal; (c) receiving the pickup request message from the second terminal via the common group extension at the first terminal; (d) transmitting a transfer message related to the pickup request message from the first terminal to the third terminal; (e) transmitting an invitation message from the third terminal to the second terminal; and (f) establishing the incoming call between the second terminal and the third terminal.Type: GrantFiled: June 12, 2009Date of Patent: June 12, 2012Assignee: Quanta Computer Inc.Inventor: Yu-Chun Yang
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Publication number: 20120138440Abstract: A method for setting function options and a multi function peripheral (MFP) using the same are provided. The MFP at least includes an image sensor and an option switch, wherein the option switch includes a sliding groove and a shift lever, and the shift lever is disposed in sliding way in the sliding groove. The method includes using the image sensor to obtain an option image of the option switch; judging a corresponding position relating to the shift lever in the option image; and setting a peripheral function according to a function option corresponding to the corresponding position.Type: ApplicationFiled: January 7, 2011Publication date: June 7, 2012Applicants: Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company LimitedInventors: Chen-Hua Pan, Yu-Chun Yang, Hsueh-Kuan Shih
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Publication number: 20100104074Abstract: The invention discloses a call recording method, including the steps of: (a) setting a call recording extension in a first terminal; (b) dialing the first terminal via the call recording extension from the first terminal to communicate with a server when a phone call is established between the first terminal and a second terminal; (c) activating a three-way conference; and (d) recording the content of the phone call between the first terminal and the second terminal into the server by use of the three-way conference.Type: ApplicationFiled: May 6, 2009Publication date: April 29, 2010Inventor: Yu-Chun Yang
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Publication number: 20100086118Abstract: The invention discloses a call pickup method for a communication network system comprising a first terminal and a second terminal. The method comprise the steps of: (a) setting a common group extension in each of the first terminal and the second terminal; (b) transmitting a pickup request message via the common group extension from the second terminal while the first terminal is receiving an incoming call from a third terminal; (c) receiving the pickup request message from the second terminal via the common group extension at the first terminal; (d) transmitting a transfer message related to the pickup request message from the first terminal to the third terminal; (e) transmitting an invitation message from the third terminal to the second terminal; and (f) establishing the incoming call between the second terminal and the third terminal.Type: ApplicationFiled: June 12, 2009Publication date: April 8, 2010Applicant: Quanta Computer, Inc.Inventor: Yu-Chun Yang
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Publication number: 20080266764Abstract: A casing of a mobile communication device includes a casing body, a cover and a screwing assembly. The outside of the casing body has a battery holding recess and a screw hole. The cover can cover the battery holding recess. The screwing assembly is fixed to the cover. The screwing assembly is screwed in the screw hole to fix the cover to the casing body or partially screwed out of the screw hole to rotate and raise the cover from the casing body. A mobile communication device is also disclosed.Type: ApplicationFiled: April 29, 2008Publication date: October 30, 2008Inventor: Yu-Chun YANG
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Publication number: 20050286215Abstract: A notebook computer. A host includes an engaging groove and a first magnet adjacent thereto. A cover structure is rotatably connected to the host, with an actuating member, a second magnet, and an engaging member. The actuating member is movably disposed in the cover structure. The magnetic force of the second magnet is less than that of the first magnet. The engaging member includes magnetic-attractive material and is rotatably disposed in the cover structure. The engaging member is rotated to a first position by pushing the actuating member and is positioned therein by attraction of the second magnet. The engaging member is rotated to a second position by attraction of the first magnet and is engaged in the engaging groove of the host.Type: ApplicationFiled: March 7, 2005Publication date: December 29, 2005Inventors: Yu-Chun Yang, Kuo-Chang Yang
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Publication number: 20040140937Abstract: A mobile computer with an integrated directional antenna has a mainframe, a display apparatus, a storage structure, a hinge apparatus, and an antenna. The mainframe having a wireless module is connected to the display apparatus. At least an antenna connected to the storage structure via the hinge is electrically connected to the wireless module. The antenna can be stored in the storage structure and can be pulled out to enhance wireless communication quality.Type: ApplicationFiled: June 9, 2003Publication date: July 22, 2004Inventor: Yu-Chun Yang