Abstract: A method of object tracking is provided with creating areas of a tracking object and a non-tracking object respectively; determining a state of the tracking object and the non-tracking object is separation, proximity, or overlap; creating at least one separation template image of a separation area of the tracking object and/or the non-tracking object if the tracking object is proximate the non-tracking object; fetching all feature points of an overlapping area of the tracking object and the non-tracking object if the tracking object and the non-tracking object overlap; performing a match on each of the feature points and the separation template image so as to calculate a corresponding matching error score respectively; and comparing the matching error score of each feature point with that of the separation template image so as to determine whether the feature points belong to the tracking object or the non-tracking object.

Abstract: Measurements of line roughness are separated into groups depending upon pre-layers. Image data collected from similar pre-layer types are considered together in order to separate effects of line roughness from distortion of measurements caused by the pre-layers. The resulting line roughness measurements are used to estimate an aspect of line quality.

Abstract: A fabricating method of a flexible circuit board includes the following steps. The metal carrier foil with metal oxide layer on its surfaces is provided first. The metal oxide layer is formed from the spontaneous oxidization of the metal carrier foil in ambient air and provides passive protection in a sulfuric acid solution or an acidic copper sulphate solution. A conductive seed layer is electroplated onto the metal oxide layer. A flexible insulating layer is formed onto the conductive seed layer by performing a polyimide casting process. The metal carrier foil is then peeled off from the conductive seed layer, which is supported by the insulating layer. A patterned circuit is formed on the insulating layer by performing photoresist coating, developing and etching.

Abstract: In an embodiment of the invention, a method for manufacturing a carrier-attached copper foil is provided. The method includes providing a carrier foil including stainless steel, titanium, aluminum, nickel or alloy thereof with a surface oxide layer, and forming a copper foil onto the carrier foil to prepare the carrier-attached copper foil.

Abstract: A method of object tracking is provided with creating areas of a tracking object and a non-tracking object respectively; determining a state of the tracking object and the non-tracking object is separation, proximity, or overlap; creating at least one separation template image of a separation area of the tracking object and/or the non-tracking object if the tracking object is proximate the non-tracking object; fetching all feature points of an overlapping area of the tracking object and the non-tracking object if the tracking object and the non-tracking object overlap; performing a match on each of the feature points and the separation template image so as to calculate a corresponding matching error score respectively; and comparing the matching error score of each feature point with that of the separation template image so as to determine whether the feature points belong to the tracking object or the non-tracking object.

Abstract: The present invention related to a method for manufacturing a semiconductor, comprising steps of: providing a growing substrate; forming on the growing substrate to have plural grooves; forming a semiconductor element layer on the growing substrate; and changing the temperature of the growing substrate and the semiconductor element layer so as to separate the semiconductor element layer from the growing substrate.

Abstract: A light emitting diode (LED) substrate including a sapphire substrate is provided. The sapphire substrate has a surface consisting of a plurality of upper trigonal and lower hexagonal tapers, wherein each of the upper trigonal and lower hexagonal tapers is consisted of a hexagonal taper and a trigonal taper on the hexagonal taper, and a pitch of the upper trigonal and lower hexagonal tapers is less than 10 ?m. This LED substrate has high light-emitting efficiency.

Abstract: An isolation structure comprising a substrate is provided. A trench is in the substrate. A sidewall of the trench has a first inclined surface and a second inclined surface. The first inclined surface is located on the second inclined surface. The slope of the first inclined surface is different from the slope of the second inclined surface. A length of the first inclined surface is greater than 15 nanometers.

Abstract: A fabricating method of a flexible circuit board includes the following steps. The metal carrier foil with metal oxide layer on its surfaces is provided first. The metal oxide layer is formed from the spontaneous oxidization of the metal carrier foil in ambient air and provides passive protection in a sulfuric acid solution or an acidic copper sulphate solution. A conductive seed layer is electroplated onto the metal oxide layer. A flexible insulating layer is formed onto the conductive seed layer by performing a polyimide casting process. The metal carrier foil is then peeled off from the conductive seed layer, which is supported by the insulating layer. A patterned circuit is formed on the insulating layer by performing photoresist coating, developing and etching.

Abstract: An isolation structure comprising a substrate is provided. A trench is in the substrate. A sidewall of the trench has a first inclined surface and a second inclined surface. The first inclined surface is located on the second inclined surface. The slope of the first inclined surface is different from the slope of the second inclined surface. A length of the first inclined surface is greater than 15 nanometers.

Abstract: In an embodiment of the invention, a method for manufacturing a carrier-attached copper foil is provided. The method includes providing a carrier foil including stainless steel, titanium, aluminum, nickel or alloy thereof with a surface oxide layer, and forming a copper foil onto the carrier foil to prepare the carrier-attached copper foil.

Abstract: A method to further adjust the final CD of a material to be etched during an etching process, and after a photolithographic patterning process can include patterning a semiconductor substrate using a mask layer. The mask layer can comprise a hardmask material having a protruding feature with an initial width. A first plasma comprising carbon and fluorine can be introduced into a chamber, where residual carbon and fluorine is deposited on at least the chamber wall. A portion of the mask layer can then be removed with a second plasma incorporating the residual carbon and fluorine, whereby remaining hardmask material forms a feature pattern where the protruding feature has a final width different from the initial width. The feature pattern can then be transferred to the semiconductor substrate using the final width of the at least one protruding feature provided by the remaining hardmask material.

Abstract: An isolation structure comprising a substrate is provided. A trench is in the substrate. A sidewall of the trench has a first inclined surface and a second inclined surface. The first inclined surface is located on the second inclined surface. The slope of the first inclined surface is different from the slope of the second inclined surface. A length of the first inclined surface is greater than 15 nanometers.

Abstract: A thin film resistor structure is disclosed. The resistor structure comprises a resistor film comprising a copper oxide layer and a plurality of metal islands thereon. The copper oxide layer has a top surface comprising a plurality of adjacent nodule-shaped recess regions, in which vacancies are formed between the nodule-shaped recess regions and are arranged in reticulate distribution. The plurality of metal islands is respectively distributed in the vacancies between the nodule-shaped recess regions. A method for fabricating the thin film resistor structure is also disclosed.

Abstract: An isolation structure comprising a substrate is provided. A trench is in the substrate. A sidewall of the trench has a first inclined surface and a second inclined surface. The first inclined surface is located on the second inclined surface. The slope of the first inclined surface is different from the slope of the second inclined surface. A length of the first inclined surface is greater than 15 nanometers.

Abstract: The invention is directed to a method for patterning a material layer. The method comprises steps of providing a material layer having a first hard mask layer and a second hard mask layer successively formed thereon and then patterning the second hard mask layer. Thereafter, an etching process is performed to pattern the first hard mask layer by using the patterned second hard mask layer as a mask, and the etching process is performed with a power of about 1000 W. Next, the material layer is patterned by using the patterned first hard mask layer as a mask.

Abstract: A thin film resistor structure is disclosed. The resistor structure comprises a resistor film comprising a copper oxide layer and a plurality of metal islands thereon. The copper oxide layer has a top surface comprising a plurality of adjacent nodule-shaped recess regions, in which vacancies are formed between the nodule-shaped recess regions and are arranged in reticulate distribution. The plurality of metal islands is respectively distributed in the vacancies between the nodule-shaped recess regions. A method for fabricating the thin film resistor structure is also disclosed.

Abstract: A remote control method of tile display is disclosed for a tile display system, which contains a host computer, several projector modules, and a screen. The images produced by the projector modules are simultaneously displayed on the screen as a single image. The remote control method includes the steps of: obtaining setting parameters of each projector using a control program on the host computer via a network; storing the setting parameters of each projector in a storage module of the host computer; simultaneously generating a projector parameter table for each projector; updating the projector parameter table when the parameters of any projector are modified; generating a control message for the corresponding projector according to the new parameter table; transmitting the control message to the corresponding projector via the network; and converting the control message into one recognizable by the projector in order to make corresponding modifications.

Abstract: A new copper foil structure with enhanced flexibility and its fabrication method thereof are disclosed. This inventive structure includes a copper base foil having a matte side and shiny side, and a more thermally stable deposited layer overlying at least the matte side of the copper base foil.

Abstract: A remote control method of tile display is disclosed for a tile display system, which contains a host computer, several projector modules, and a screen. The images produced by the projector modules are simultaneously displayed on the screen as a single image. The remote control method includes the steps of: obtaining setting parameters of each projector using a control program on the host computer via a network; storing the setting parameters of each projector in a storage module of the host computer; simultaneously generating a projector parameter table for each projector; updating the projector parameter table when the parameters of any projector are modified; generating a control message for the corresponding projector according to the new parameter table; transmitting the control message to the corresponding projector via the network; and converting the control message into one recognizable by the projector in order to make corresponding modifications.