Abstract: An artificial bone plate unit and an assembleable artificial bone plate are provided. The artificial bone plate unit includes a plate body, multiple connecting pins, connecting holes, drug cavities, and drug-releasing openings. The plate body has two main surfaces and a peripheral surface connected between the two main surfaces. The connecting pins and the connecting holes are formed on the plate body and arranged along the peripheral surface on the plate body. The connecting holes correspond in shape to the connecting pins. The drug cavities are formed in the artificial bone plate unit and are connected to the drug-releasing openings. The artificial bone plate units are connected using the connecting pins and the connecting holes to form the assembleable artificial bone plate. The assembleable artificial bone plate can be bent into the shape of a defect area of the skull, which saves material and time.

Abstract: A development system and a method of an offline software-in-the-loop simulation are disclosed. A common firmware architecture generates a chip control program. The common firmware architecture has an application layer and a hardware abstraction layer. The application layer has a configuration header file and a product program. A processing program required by a peripheral module is added to the hardware abstraction layer during compiling. The chip control program is provided to a controller chip or a circuit simulation software to be executed to control the product-related circuit through controlling the peripheral module.

Abstract: A package structure includes a first RDL, an adhesive layer and a first electronic component. Upper bumps and conductive pads are provided on a first upper surface and a first lower surface of the first RDL, respectively. The adhesive layer is located on the first upper surface of the first RDL and surrounds the upper bumps. The first electronic component is mounted on the adhesive layer and includes conductors which are visible from an active surface of the first electronic component and joined to the upper bumps, the active surface of the first electronic component faces toward the first upper surface of the first RDL. Two adhesive surfaces of the adhesive layer are adhered to the first upper surface of the first RDL and the active surface of the first electronic component, respectively.

Abstract: The present invention provides a testing system of metal sheet, and the system at least comprises a clipping apparatus, a hydraulic press apparatus and a measuring apparatus. The clipping apparatus comprises a first mold, a second mold and a hyperelastic plate. The hydraulic press apparatus connects to the clipping apparatus and transfer a hydraulic pressure via the second mold to the one of the testing sheet set to let it bulge along an orientation toward the first mold. The measuring apparatus connects with the clipping apparatus and the hydraulic press apparatus separately to measure a momentary pressure of the hydraulic pressure and the bulge height of the one of the testing sheet set. A testing method using the abovementioned system is also disclosed in the present invention.

Abstract: The present invention provides a testing system of metal sheet, and the system at least comprises a clipping apparatus, a hydraulic press apparatus and a measuring apparatus. The clipping apparatus comprises a first mold, a second mold and a hyperelastic plate. The hydraulic press apparatus connects to the clipping apparatus and transfer a hydraulic pressure via the second mold to the one of the testing sheet set to let it bulge along an orientation toward the first mold. The measuring apparatus connects with the clipping apparatus and the hydraulic press apparatus separately to measure a momentary pressure of the hydraulic pressure and the bulge height of the one of the testing sheet set. A testing method using the abovementioned system is also disclosed in the present invention.