Patents by Inventor Yu-cui He

Yu-cui He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board having improved solder pad layout
    Publication number: 20060102700
    Abstract: A printed circuit board (100) includes a plurality of through-holes (26) defined therein, and a plurality of solder pads (20) defined to surround the through holes (26) respectively. Each of the solder pads (20) includes a first soldering zone (22) for accommodating solder used in a soldering process and a second soldering zone (28) in communication with the first soldering zone (22) for receiving excess solder extravasating from the first soldering zone (22). An axis of each of the solder pads (22) and a direction opposite to a movement direction of the printed circuit board (100) in the soldering process defines a predetermined angle.
    Type: Application
    Filed: December 29, 2004
    Publication date: May 18, 2006
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Ya-ling Huang, Di Li, Yu-cui He