Patents by Inventor Yu-Da Fan

Yu-Da Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tungsten plug with conductor capping layer
    Patent number: 6835649
    Abstract: Within a method for forming a microelectronic fabrication there is provided a substrate having formed thereover a patterned dielectric layer which defines a via. There is also formed within a lower portion of the via a tungsten stud layer having a recess thereabove within the via. There is also formed within the recess a patterned conductor capping layer formed of a conductor material other than tungsten. The patterned conductor capping layer may seal a void formed within the tungsten stud layer.
    Type: Grant
    Filed: June 3, 2002
    Date of Patent: December 28, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Wei-Cheng Lee, Wen-Chen Chien, Yu-Da Fan, Kuo-Yen Liu, Yu-Ching Chang
  • Tungsten plug with conductor capping layer
    Publication number: 20030224598
    Abstract: Within a method for forming a microelectronic fabrication there is provided a substrate having formed thereover a patterned dielectric layer which defines a via. There is also formed within a lower portion of the via a tungsten.stud layer having a recess thereabove within the via. There is also formed within the recess a patterned conductor capping layer formed of a conductor material other than tungsten. The patterned conductor capping layer may seal a void formed within the tungsten stud layer.
    Type: Application
    Filed: June 3, 2002
    Publication date: December 4, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Cheng Lee, Wen-Chen Chien, Yu-Da Fan, Kuo-Yen Liu, Yu-Ching Chang