Patents by Inventor Yu-Da Lee

Yu-Da Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package support structure and light emitting device including same
    Patent number: 10784412
    Abstract: The present invention provides a package support structure and a light emitting device including same. The package support structure includes: a housing which comprises a light emitting surface, a backlight surface, a bottom surface and a groove; a conductive support which is partially covered by the housing and includes a first lead and a second lead that are separated from each other, where each of the first lead and the second lead includes an electrode portion and a bent portion, the electrode portion is exposed from the housing through the groove, and the bent portion extends outward from the electrode portion beyond the housing and bends toward the bottom surface of the housing; where one of the first lead and the second lead further includes a heat radiation portion, the heat radiation portion extend outward from the electrode portion and is exposed from the backlight surface of the housing.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: September 22, 2020
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Chien-Nan Liu, Teng-Wei Chen, Chieh-Yu Kang, Hao-Yu Yang, Yu-Da Lee
  • PACKAGE SUPPORT STRUCTURE AND LIGHT EMITTING DEVICE INCLUDING SAME
    Publication number: 20180374997
    Abstract: The present invention provides a package support structure and a light emitting device including same. The package support structure includes: a housing which comprises a light emitting surface, a backlight surface, a bottom surface and a groove; a conductive support which is partially covered by the housing and includes a first lead and a second lead that are separated from each other, where each of the first lead and the second lead includes an electrode portion and a bent portion, the electrode portion is exposed from the housing through the groove, and the bent portion extends outward from the electrode portion beyond the housing and bends toward the bottom surface of the housing; where one of the first lead and the second lead further includes a heat radiation portion, the heat radiation portion extend outward from the electrode portion and is exposed from the backlight surface of the housing.
    Type: Application
    Filed: June 27, 2018
    Publication date: December 27, 2018
    Applicant: Everlight Electronics Co., Ltd.
    Inventors: Chien-Nan Liu, Teng-Wei Chen, Chieh-Yu Kang, Hao-Yu Yang, Yu-Da Lee