Abstract: Disclosed is a method for providing a haptic feedback in a touch screen, which includes displaying a plurality of soft buttons on a touch screen; applying a first pattern vibration to the touch screen if a pressing detection value for a corresponding soft button according to contact of a user input means reaches a predetermined first threshold value; and applying a second pattern vibration to the touch screen if a pressing detection value for the corresponding soft button reaches a predetermined second threshold value, the second pattern vibration being different from the first pattern vibration, the second threshold value being different from the first threshold value.

Abstract: An apparatus and a method for controlling interference in a wireless communication system are provided. The method includes receiving a signal of a DownLink (DL) frequency band that is adjacent to an UpLink (UL) frequency band supported by a User Equipment (UE), measuring a Received Signal Strength Indicator (RSSI) of the DL frequency band signal, comparing the measured RSSI with a threshold value, and, if the measured RSSI is less than the threshold value, limiting UL transmission.

Abstract: Disclosed is a vibration motor for a portable terminal, including a flat spring; a cylindrical magnetic substance mounted on the flat spring; an annular magnetic substance disposed around the cylindrical magnetic substance mounted on the flat spring; and a coil disposed between the cylindrical magnetic substance and the annular magnetic substance, wherein the magnetic substances perform a linear reciprocal movement by the electromagnetic force generated between the magnetic substances and the coil and by the elastic force of the flat spring as an electric current is applied to the coil. The vibration motor operates at higher resonant frequencies than those of conventional vibration motors, thereby improving the sense of an after-vibration and realizing a delicate haptic feedback function.

Abstract: A vibration motor includes a first resilient member and a second resilient member providing resilient forces in opposite directions; a first vibrator and a second vibrator coupled to the first resilient member and the second resilient member respectively; a magnetic body coupled to the first vibrator to create a magnetic field; and a coil applying a current of a predetermined frequency band in the region where the magnetic field is created.

Abstract: Disclosed is a method for manufacturing a semiconductor optical device for flip-chip bonding. The method includes the steps of: etching an active layer and clad which are sequentially stacked on a semiconductor substrate into first and second alignment keys and an optical area, which has a mesa structure; growing at least two insulating layers at mesa-etched portions between the first and second alignment keys and the optical areas; and forming protection masks on the first and second alignment keys, growing an electrode on the optical area and the insulating layer except for the protection masks, and removing the protection masks.

Abstract: An optical module having a second connector unit mounted on the bottom of a first connector unit to reduce the size of the radiation member and the optical module. The optical module includes a first connector unit, a radiation member provided on a first side of the first connector unit to support the first connector unit and radiate heat, a second connector provided on the first connector unit to electrically connect the first connector unit to a PCB, and a fastening member provided on surfaces of the first and second connector units, which face each other, to fasten the first and second connectors to each other. The optical module is advantageous reduces the size of the radiation member and renders a more compact optical module.

Abstract: An optical module comprises a waveguide, at least one optical transducer positioned on the waveguide for transducing an optical signal into an electric signal or an electric signal into an optical signal and a connection socket seated on the waveguide, the optical transducer being mounted in the connection socket.

Abstract: A vertical-cavity surface emitting laser includes a substrate and a first mirror that is grown on the substrate, a second mirror grown on the first mirror for resonating the first mirror and light, an active layer between the first mirror and the second mirror for generating and amplifying the light, an upper electrode grown on the active layer and a lower electrode formed on the first mirror for supplying current to the active layer, a planarizing polymer formed on the first mirror for burying the active layer and the second layer, and a first external terminal extending from the upper electrode in a vertical upward direction to be exposed to the top surface of the planarizing polymer and a second external terminal extending from the lower electrode to expose its one surface to the top surface of the planarizing polymer.

Abstract: A semiconductor optical device, which includes a semiconductor substrate, an electro-absorption modulator, and at least one optical device is monolithically integrated on the semiconductor substrate. An insulative layer surrounds the electro-absorption modulator and the optical devices on the semiconductor substrate, at least two metallic pads, one of which being an electrode of the modulator, are formed at a distance from each other on the insulative layer. A plurality of metallic wires are adapted for electrically connecting the electro-absorption modulator to the metallic pads and adjusting a value of inductance of the electro-absorption modulator. The metallic wires are formed on the insulative layer. A dielectric layer formed under the insulative layer provides a minimizing of parasitic capacitance generated in the metallic pads and the metallic wires by being formed under the metallic pads and the metallic wires.

Abstract: Provided is an optical module including a light source for generating an optical signal, a waveguide for waveguiding the optical signal, a photodetector for detecting the optical signal, a first reflecting mirror on the light source for reflecting the optical signal generated by the light source to a side of the waveguide, and a second reflecting mirror on the photodetector for reflecting an optical signal emitted from the waveguide in a vertical downward direction. The photodetector detects an optical signal reflected by the second reflecting mirror.

Abstract: A flexible printed circuit board module includes a flexible printed circuit board having a conductive layer in an upper part of the flexible printed circuit board, an optical fiber disposed under the flexible printed circuit board, light propagating through an interior of the optical fiber and a supporting member supporting an optical fiber and having a first reflecting member reflecting incident light from the flexible printed circuit board so as to connect the light to the optical fiber.

Abstract: An optical waveguide and method of providing that enhances high-speed communication includes a waveguide medium having at least one groove, in which a side wall exposed by the groove is formed inclined with respect to the traveling path of light. A reflection block having a reflection mirror faces the inclined side wall of the groove, in which the reflection block is typically arranged in the groove to face the side wall of the groove, and a refractive index matching layer is typically a coating arranged between the side wall of the groove and the reflection mirror.

Abstract: A photoelectronic hybrid board includes a circuit board having a circuit pattern layer and at least partially transparent to light, and a core laminated on a transparent portion of the circuit board and guiding light, which is coupled from outside, through an inside thereof. A connector includes a circuit board having a circuit pattern layer and at least partially transparent to light, a core laminated on a transparent portion of the circuit board and guiding light through an inside thereof, and at least one connection terminal formed at one end of the circuit board. Another connector includes the circuit board, a clad formed on a transparent portion of the circuit board, at least one core embedded in the clad and guiding light therethrough, and the at least one connection terminal.

Abstract: A method of detecting an etching end-point includes the steps of: forming a mask on a pattern area of an etching object; forming an etching indicator on an etching area of the etching object, which is not covered by the mask; etching the etching object using the mask; and evaluating the size of a remaining object covered by the mask using the etching indicator.

Abstract: A photonic integrated device using a reverse-mesa structure and a method for fabricating the same are disclosed. The photonic integrated device includes a first conductive substrate on which a semiconductor laser, an optical modulator, a semiconductor optical amplifier, and a photo detector are integrated, a first conductive clad layer and an active layer sequentially formed on the first conductive substrate in the form of a mesa structure, a second conductive clad layer formed on the active layer in the form of a reverse-mesa structure, an ohmic contact layer formed on the second clad layer in such a manner that the ohmic contact layer has a width narrower than the width of an upper surface of the second conductive clad layer, a current shielding layer filled in a sidewall having a mesa and reverse-mesa structure, and at least one window area formed between the above elements.

Abstract: A vertical-cavity surface emitting laser includes a substrate and a first mirror that is grown on the substrate, a second mirror grown on the first mirror for resonating the first mirror and light, an active layer between the first mirror and the second mirror for generating and amplifying the light, an upper electrode grown on the active layer and a lower electrode formed on the first mirror for supplying current to the active layer, a planarizing polymer formed on the first mirror for burying the active layer and the second layer, and a first external terminal extending from the upper electrode in a vertical upward direction to be exposed to the top surface of the planarizing polymer and a second external terminal extending from the lower electrode to expose its one surface to the top surface of the planarizing polymer.

Abstract: Provided is an optical module including a light source for generating an optical signal, a waveguide for waveguiding the optical signal, a photodetector for detecting the optical signal, a first reflecting mirror on the light source for reflecting the optical signal generated by the light source to a side of the waveguide, and a second reflecting mirror on the photodetector for reflecting an optical signal emitted from the waveguide in a vertical downward direction. The photodetector detects an optical signal reflected by the second reflecting mirror.

Abstract: An optical module comprises a waveguide, at least one optical transducer positioned on the waveguide for transducing an optical signal into an electric signal or an electric signal into an optical signal and a connection socket seated on the waveguide, the optical transducer being mounted in the connection socket.

Abstract: An optical spot size converter integrated laser device includes a substrate; a first waveguide laminated on the substrate and optically coupled to an optical fiber, the first waveguide being divided into a light source region having an active waveguide and an optical spot size converter region, and a trench formed on both lateral walls of the first waveguide on the substrate so that light emitted from the active waveguide interferes with light reflected by a wall surface of the first waveguide inside the first waveguide. By means of mutual interference between light emitted directly from the active waveguide of the laser device and light reflected by the interference waveguide, the optical spot size of a laser can be adjusted without affecting the single mode of the laser.

Abstract: A bi-directional optical transceiver includes: an optical fiber for transmitting and receiving first and second optical signals; a transmitter module for generating the first optical signal; a receiver module for detecting the second optical signal; a tap filter for splitting a portion of the first optical signal; a monitor module for monitoring the magnitude of the portion of the first optical signal split by the tap filter; and a wavelength selection filter, which is located between the tap filter and the optical fiber, inputs the first optical signal output from the tap filter into the optical fiber, and inputs the second optical signal output from the optical fiber into an optical detector.