Patents by Inventor Yu ECHIGO

Yu ECHIGO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSITION AND METAL INSULATING COVER MATERIAL
    Publication number: 20210324144
    Abstract: A composition containing a solvent and a polyimide resin precursor and/or polyimide resin, wherein the polyimide resin precursor and/or polyimide resin includes a compound represented by Formula (0) below and/or a compound represented by Formula (0?) below, and a compound including a functional group that reacts with a terminally cyclized product of the compound represented by Formula (0) below and/or the compound represented by Formula (0?) below. In Formula (0) and Formula (0?) above, R? each independently represent a hydrogen atom or an alkyl group. Ra represents a tetracarboxylic acid residue. Rb represents a diamine residue. Ra and/or Rb includes one linking group including an active hydrogen and/or one or more and four or less substituents including an active hydrogen. p and q represent given integers.
    Type: Application
    Filed: July 1, 2021
    Publication date: October 21, 2021
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Yu ECHIGO, Dai AOKI, Jiro SUGIYAMA
  • Resin composition
    Patent number: 10947353
    Abstract: A resin composition for insulating coating material, comprises: a polyimide resin and/or a precursor thereof; and a polymer having a heterocyclic ring at a side chain, wherein the content of the polymer having a heterocyclic ring at a side chain is 0.1 to 7 parts by weight relative to 100 parts by weight of the polyimide resin and/or the precursor thereof. By adding a prescribed amount of the polymer having a heterocyclic ring at a side chain, there can be obtained a resin composition for insulating coating material still maintaining heat resistance and together having excellent bending resistance.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: March 16, 2021
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Takeshi Kato, Akira Ishikubo, Yu Echigo, Mika Matsumoto, Jiro Sugiyama
  • RESIN COMPOSITION
    Publication number: 20190031844
    Abstract: A resin composition for insulating coating material, comprises: a polyimide resin and/or a precursor thereof; and a polymer having a heterocyclic ring at a side chain, wherein the content of the polymer having a heterocyclic ring at a side chain is 0.1 to 7 parts by weight relative to 100 parts by weight of the polyimide resin and/or the precursor thereof. By adding a prescribed amount of the polymer having a heterocyclic ring at a side chain, there can be obtained a resin composition for insulating coating material still maintaining heat resistance and together having excellent bending resistance.
    Type: Application
    Filed: September 28, 2018
    Publication date: January 31, 2019
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Takeshi KATO, Akira ISHIKUBO, Yu ECHIGO, Mika MATSUMOTO, Jiro SUGIYAMA