Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a substrate, a plurality of capacitors, and a first supporting layer. The plurality of capacitors are disposed on the substrate. Each of the capacitors extends along a first direction. Each of the plurality of capacitors includes a first capacitor electrode, a second capacitor electrode, and a capacitor dielectric separating the first capacitor electrode from the second capacitor electrode. The first supporting layer is disposed on the substrate. The first supporting layer extends along a second direction different from the first direction. The capacitor dielectric includes a first surface and a second surface which are disposed on two opposite sides along the first direction. The second surface is exposed by the first capacitor electrode. The first supporting layer is disposed between the first surface and the second surface of the capacitor dielectric.

Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a substrate, a plurality of capacitors, and a first supporting layer. The plurality of capacitors are disposed on the substrate. Each of the capacitors extends along a first direction. Each of the plurality of capacitors includes a first capacitor electrode, a second capacitor electrode, and a capacitor dielectric separating the first capacitor electrode from the second capacitor electrode. The first supporting layer is disposed on the substrate. The first supporting layer extends along a second direction different from the first direction. The capacitor dielectric includes a first surface and a second surface which are disposed on two opposite sides along the first direction. The second surface is exposed by the first capacitor electrode. The first supporting layer is disposed between the first surface and the second surface of the capacitor dielectric.

Abstract: A semiconductor device and a method of manufacturing the semiconductor device are provided. The semiconductor device includes a substrate, a word line, a first capacitor, a second capacitor, a first bit line and a second bit line. The word line is disposed on the substrate and extends along a first direction. The first capacitor extends along a second direction different from the first direction and is located at a first level. The second capacitor extends along the second direction and is located at a second level different from the first level. The first bit line is electrically connected to the first capacitor and the word line. The second bit line is electrically connected to the second capacitor and the word line.

Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a substrate, a word line, a first capacitor, a second capacitor, a first bit line and a second bit line. The word line is disposed on the substrate and extends along a first direction. The first capacitor extends along a second direction different from the first direction and is located at a first level. The second capacitor extends along the second direction and is located at a second level different from the first level. The first bit line is electrically connected to the first capacitor and the word line. The second bit line is electrically connected to the second capacitor and the word line.

Abstract: A package structure includes a first RDL, an adhesive layer and a first electronic component. Upper bumps and conductive pads are provided on a first upper surface and a first lower surface of the first RDL, respectively. The adhesive layer is located on the first upper surface of the first RDL and surrounds the upper bumps. The first electronic component is mounted on the adhesive layer and includes conductors which are visible from an active surface of the first electronic component and joined to the upper bumps, the active surface of the first electronic component faces toward the first upper surface of the first RDL. Two adhesive surfaces of the adhesive layer are adhered to the first upper surface of the first RDL and the active surface of the first electronic component, respectively.

Abstract: A setting method of in-memory computing simulator includes: performing a plurality of test combinations by an in-memory computing device and recording a plurality of first estimation indices corresponding to the plurality of test combinations respectively, wherein each of the plurality of test combinations includes one of a plurality of neural network models and one of a plurality of datasets, executing a simulator according to the plurality of test combinations by a processing device and recording a plurality of second estimation indices corresponding to the plurality of test combinations respectively, wherein the simulator has a plurality of adjustable settings; calculating a correlation sum according to the plurality of first estimation indices and the plurality of second estimation indices by the processing device, and performing an optimal algorithm to search an optimal parameter in the setting space constructed by the plurality of settings so that the correlation sum is maximal.

Abstract: A memory circuit includes a bias voltage generator including a first buffer configured to generate a first bias voltage based on a reference voltage and a plurality of second buffers configured to generate a plurality of second bias voltages based on the first bias voltage. The memory circuit includes a plurality of voltage clamp devices coupled to the plurality of second buffers, and each voltage clamp device is configured to apply a drive voltage to a corresponding resistance-based memory device of a plurality of resistance-based memory devices based on the corresponding second bias voltage of the plurality of second bias voltages.

Abstract: A bias voltage generator includes a first current path, a first voltage clamp device, and a first buffer. The bias voltage generator receives a reference voltage and generates a first bias voltage based on a voltage difference between the reference voltage and a first drive voltage, the first voltage clamp device generates the first drive voltage based on the first bias voltage by applying the first drive voltage to the first current path, and the first buffer receives the first bias voltage and generates a second bias voltage based on the first bias voltage. A second current path includes a resistance-based memory device, and a second voltage clamp device generates a second drive voltage based on the second bias voltage and applies the second drive voltage to the second current path.

Abstract: A bias voltage generator includes a first current path, a first voltage clamp device, and a first buffer. The bias voltage generator receives a reference voltage and generates a first bias voltage based on a voltage difference between the reference voltage and a first drive voltage, the first voltage clamp device generates the first drive voltage based on the first bias voltage by applying the first drive voltage to the first current path, and the first buffer receives the first bias voltage and generates a second bias voltage based on the first bias voltage. A second current path includes a resistance-based memory device, and a second voltage clamp device generates a second drive voltage based on the second bias voltage and applies the second drive voltage to the second current path.

Abstract: A syringe is provided, including a syringe barrel, a needle set and a push rod. A front end part is provided in the syringe barrel. An end of the needle set has an open area, the open area is transversely provided with a first snap part. The push rod is slidably disposed within the syringe barrel, and an end of the push rod facing the front end part has a second snap part. When the push rod is slidingly moved to the front end part, the second snap part is engaged with the first snap part.

Abstract: A syringe is provided, including a syringe barrel, a needle set and a push rod. A front end part is provided in the syringe barrel. An end of the needle set has an open area, the open area is transversely provided with a first snap part. The push rod is slidably disposed within the syringe barrel, and an end of the push rod facing the front end part has a second snap part. When the push rod is slidingly moved to the front end part, the second snap part is engaged with the first snap part.

Abstract: Disclosure in the description is related to a method for rhythm visualization, a system, and computer-readable storage. The invention allows the system to visualize the rhythm according to audio signals and personal features made by individual. In the method according to one embodiment, a personal image is firstly captured, and features can be extracted from the image. A personalized image is therefore created based on the features. Next, audio features are extracted from the audio signals. A personalized rhythm configuration can be obtained. A personalized rhythm video is therefore created based on the information related to the audio, personalized image, and the personalized rhythm configuration. Furthermore, a group rhythm video may also be obtained as integrating multiple personal rhythm data.

Abstract: A sense amplifier includes four sub-circuits: pre-charge, sense enable, sense output, and buffer. The pre-charge sub-circuit provides a voltage between zero volts and the positive power supply (denoted VDD) to the sense enable sub-circuit. The sense enable sub-circuit is configured to adjust the received voltage based on the sensed value of bit lines and sends the adjusted voltage to the sense output sub-circuit. The sense output sub-circuit removes interference, inverts and amplifies the adjusted voltage, and sends an output voltage to the buffer sub-circuit. The buffer sub-circuit amplifies the output voltage of the sense output sub-circuit and provides it to an output bus.

Abstract: A sense amplifier includes four sub-circuits: pre-charge, sense enable, sense output, and buffer. The pre-charge sub-circuit provides a voltage between zero volts and the positive power supply (denoted VDD) to the sense enable sub-circuit. The sense enable sub-circuit is configured to adjust the received voltage based on the sensed value of bit lines and sends the adjusted voltage to the sense output sub-circuit. The sense output sub-circuit removes interference, inverts and amplifies the adjusted voltage, and sends an output voltage to the buffer sub-circuit. The buffer sub-circuit amplifies the output voltage of the sense output sub-circuit and provides it to an output bus.

Abstract: A sense amplifier includes four sub-circuits: pre-charge, sense enable, sense output, and buffer. The pre-charge sub-circuit provides a voltage between zero volts and the positive power supply (denoted VDD) to the sense enable sub-circuit. The sense enable sub-circuit is configured to adjust the received voltage based on the sensed value of bit lines and sends the adjusted voltage to the sense output sub-circuit. The sense output sub-circuit removes interference, inverts and amplifies the adjusted voltage, and sends an output voltage to the buffer sub-circuit. The buffer sub-circuit amplifies the output voltage of the sense output sub-circuit and provides it to an output bus.

Abstract: Disclosure in the description is related to a method for rhythm visualization, a system, and computer-readable storage. The invention allows the system to visualize the rhythm according to audio signals and personal features made by individual. In the method according to one embodiment, a personal image is firstly captured, and features can be extracted from the image. A personalized image is therefore created based on the features. Next, audio features are extracted from the audio signals. A personalized rhythm configuration can be obtained. A personalized rhythm video is therefore created based on the information related to the audio, personalized image, and the personalized rhythm configuration. Furthermore, a group rhythm video may also be obtained as integrating multiple personal rhythm data.

Abstract: A sense amplifier includes four sub-circuits: pre-charge, sense enable, sense output, and buffer. The pre-charge sub-circuit provides a voltage between zero volts and the positive power supply (denoted VDD) to the sense enable sub-circuit. The sense enable sub-circuit is configured to adjust the received voltage based on the sensed value of bit lines and sends the adjusted voltage to the sense output sub-circuit. The sense output sub-circuit removes interference, inverts and amplifies the adjusted voltage, and sends an output voltage to the buffer sub-circuit. The buffer sub-circuit amplifies the output voltage of the sense output sub-circuit and provides it to an output bus.

Abstract: A low-offset current-sense amplifier and an operating method thereof are disclosed. The low-offset current-sense amplifier includes a sense amplifier, a first current supply unit, a second current supply unit, and a processing unit. The first current supply unit is coupled to the sense amplifier, and includes a first transistor group and a first current output terminal. The second current supply unit is coupled to the sense amplifier, and includes a second transistor group and a second current output terminal. The processing unit controls the on/off of some transistors of the first transistor group and the second transistor group according to electric currents output from the first current output terminal and the second current output terminal, respectively.

Abstract: A temperature moderation system with temperature difference considerations between indoors and outdoors for facilitating an air conditioner in operation control, includes an indoor unit and an outdoor unit connected with each other. The outdoor unit has an outdoor temperature detection element. The indoor unit has a processor for generating and sending a target temperature to the air conditioner for operation control. The target temperature is one selected from the indoor setting temperature and a pre-set temperature; according to which temperature is closest to the outdoor temperature.

Abstract: Intelligent hotspot connection systems and methods are provided. The intelligent hotspot connection system includes a storage unit, a wireless connection unit, and a processing unit. The storage unit includes a hotspot information database recording at least one property for each of a plurality of hotspots, and a hotspot preference database recording at least one preference inclination, respectively defining a reference weight for the property and signal strength. The processing unit detects the signal strength of the respective hotspots via the wireless connection unit. The processing unit obtains the preference inclination, and calculates a score for the respective hotspots according to the preference inclination, the property and signal strength of the respective hotspots. The processing unit selects and automatically connects to the hotspot with the highest score via the wireless connection unit.