Patents by Inventor YU-FANG TSENG

YU-FANG TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240111210
    Abstract: A method of manufacturing a semiconductor device includes the following steps. A photoresist layer is formed over a material layer on a substrate. The photoresist layer has a composition including a solvent and a first photo-active compound dissolved in the solvent. The first photo-active compound is represented by the following formula (A1) or formula (A2): Zr12O8(OH)14(RCO2)18 ??Formula (A1); or Hf6O4(OH)6(RCO2)10 ??Formula (A2). R in the formula (A1) and R in the formula (A2) each include one of the following formulae (1) to (6): The photoresist layer is patterned. The material layer is etched using the photoresist layer as an etch mask.
    Type: Application
    Filed: May 9, 2023
    Publication date: April 4, 2024
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL TSING HUA UNIVERSITY
    Inventors: Jui-Hsiung LIU, Pin-Chia LIAO, Ting-An LIN, Ting-An SHIH, Yu-Fang TSENG, Burn Jeng LIN, Tsai-Sheng GAU, Po-Hsiung CHEN, Po-Wen CHIU
  • Publication number: 20240112912
    Abstract: A method of manufacturing a semiconductor device includes the following steps. A photoresist layer is formed over a material layer on a substrate. The photoresist layer has a composition including a solvent and a first photo-active compound dissolved in the solvent. The first photo-active compound is represented by the following formula (Al) or formula (A2): Zr12O8(OH)14(RCO2)18??Formula (A1); or Hf6O4(OH)6(RCO2)10??Formula (A2). R in the formula (A1) and R in the formula (A2) each include one of the following formulae (1) to (6): The photoresist layer is patterned. The material layer is etched using the photoresist layer as an etch mask.
    Type: Application
    Filed: July 28, 2023
    Publication date: April 4, 2024
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL TSING HUA UNIVERSITY
    Inventors: Jui-Hsiung LIU, Yu-Fang TSENG, Pin-Chia LIAO, Burn Jeng LIN, Tsai-Sheng GAU, Po-Hsiung CHEN, Po-Wen CHIU
  • Patent number: 11915755
    Abstract: A layout of a semiconductor memory device includes a substrate and a ternary content addressable memory (TCAM). The TCAM is disposed on the substrate and includes a plurality of TCAM bit cells, where at least two of the TCAM bit cells are mirror-symmetrical along an axis of symmetry, and each of the TCAM bit cells includes two storage units electrically connected to two word lines respectively, and a logic circuit electrically connected to the storage units. The logic circuit includes two first reading transistors, and two second reading transistors, where each of the second reading transistors includes a gate and source and drain regions, the source and drain regions of the second reading transistors are electrically connected to two matching lines and the first reading transistors, respectively, where the word lines are disposed parallel to and between the matching lines.
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: February 27, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Yen Tseng, Yu-Tse Kuo, Shu-Ru Wang, Chun-Hsien Huang, Hsin-Chih Yu, Meng-Ping Chuang, Li-Ping Huang, Yu-Fang Chen
  • Patent number: 9083858
    Abstract: A vehicle video recording apparatus has multiple cameras mounted on a car, a video processing unit electronically connected to the cameras, a storage unit for storing videos output from the cameras, and a control unit. The control unit has a signal detecting module for receiving vehicle status signals, a distance detecting module for sensing a distance between the car and an object, an output module for outputting warning signals, and a central control module for controlling the cameras based on the vehicle status signals. The vehicle video recording apparatus properly selects and activates the camera to record images around the car to enhance the driving safety.
    Type: Grant
    Filed: January 25, 2013
    Date of Patent: July 14, 2015
    Assignee: KEN SEAN INDUSTRIES CO., LTD.
    Inventor: Yu-Fang Tseng
  • Publication number: 20130285096
    Abstract: A method for manufacturing a light emitting diode (LED) package comprises: providing a substrate having a first electrode and a second electrode electrically insulated from the first electrode, wherein an LED die is mounted on the first electrode and electrically connected to the first electrode and the second electrode; forming a first encapsulant layer on the substrate to encapsulate the LED die therein, the first encapsulant layer being colloidal; forming a nitride compound phosphor layer distributed on an outer face of the first encapsulant layer; and heating the first encapsulant layer to solidify the first encapsulant layer. A second encapsulant layer is formed on the nitride compound phosphor layer to encapsulate the first encapsulant layer. An LED package formed by the method is also provided.
    Type: Application
    Filed: April 18, 2013
    Publication date: October 31, 2013
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: YU-FANG TSENG, CHIA-WEN HSIAO