Abstract: A method of manufacturing a semiconductor device includes the following steps. A photoresist layer is formed over a material layer on a substrate. The photoresist layer has a composition including a solvent and a first photo-active compound dissolved in the solvent. The first photo-active compound is represented by the following formula (A1) or formula (A2): Zr12O8(OH)14(RCO2)18 ??Formula (A1); or Hf6O4(OH)6(RCO2)10 ??Formula (A2). R in the formula (A1) and R in the formula (A2) each include one of the following formulae (1) to (6): The photoresist layer is patterned. The material layer is etched using the photoresist layer as an etch mask.

Abstract: A method of manufacturing a semiconductor device includes the following steps. A photoresist layer is formed over a material layer on a substrate. The photoresist layer has a composition including a solvent and a first photo-active compound dissolved in the solvent. The first photo-active compound is represented by the following formula (Al) or formula (A2): Zr12O8(OH)14(RCO2)18??Formula (A1); or Hf6O4(OH)6(RCO2)10??Formula (A2). R in the formula (A1) and R in the formula (A2) each include one of the following formulae (1) to (6): The photoresist layer is patterned. The material layer is etched using the photoresist layer as an etch mask.

Abstract: A vehicle video recording apparatus has multiple cameras mounted on a car, a video processing unit electronically connected to the cameras, a storage unit for storing videos output from the cameras, and a control unit. The control unit has a signal detecting module for receiving vehicle status signals, a distance detecting module for sensing a distance between the car and an object, an output module for outputting warning signals, and a central control module for controlling the cameras based on the vehicle status signals. The vehicle video recording apparatus properly selects and activates the camera to record images around the car to enhance the driving safety.

Abstract: A method for manufacturing a light emitting diode (LED) package comprises: providing a substrate having a first electrode and a second electrode electrically insulated from the first electrode, wherein an LED die is mounted on the first electrode and electrically connected to the first electrode and the second electrode; forming a first encapsulant layer on the substrate to encapsulate the LED die therein, the first encapsulant layer being colloidal; forming a nitride compound phosphor layer distributed on an outer face of the first encapsulant layer; and heating the first encapsulant layer to solidify the first encapsulant layer. A second encapsulant layer is formed on the nitride compound phosphor layer to encapsulate the first encapsulant layer. An LED package formed by the method is also provided.