Patents by Inventor Yu-Feng CHIANG
Yu-Feng CHIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240081077Abstract: A transistor includes a first semiconductor layer, a second semiconductor layer, a semiconductor nanosheet, a gate electrode and source and drain electrodes. The semiconductor nanosheet is physically connected to the first semiconductor layer and the second semiconductor layer. The gate electrode wraps around the semiconductor nanosheet. The source and drain electrodes are disposed at opposite sides of the gate electrode. The first semiconductor layer surrounds the source electrode, the second semiconductor layer surrounds the drain electrode, and the semiconductor nanosheet is disposed between the source and drain electrodes.Type: ApplicationFiled: September 1, 2022Publication date: March 7, 2024Applicants: Taiwan Semiconductor Manufacturing Company, Ltd., National Yang Ming Chiao Tung UniversityInventors: Po-Tsun Liu, Meng-Han Lin, Zhen-Hao Li, Tsung-Che Chiang, Bo-Feng Young, Hsin-Yi Huang, Sai-Hooi Yeong, Yu-Ming Lin
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Publication number: 20240071954Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.Type: ApplicationFiled: November 9, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Publication number: 20240071953Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Patent number: 9433079Abstract: A heat dissipation device is used in a circuit board, where the circuit board includes a chip and at least one positioning hole disposed around the chip, and each of the positioning holes has a bare metal area on its periphery. The heat dissipation device includes a heat dissipation element, a conductive element and at least one fixing part. The heat dissipation element is disposed on the chip; the conductive element is connected electrically to the bare metal area of the circuit board and the heat dissipation element respectively; the fixing part passes through the fixing holes and is connected to the positioning hole, so as to fix the heat dissipation element to the circuit board. A circuit board is also provided, which includes a substrate, a chip, a positioning hole and the heat dissipation device.Type: GrantFiled: December 2, 2014Date of Patent: August 30, 2016Assignee: WISTRON CORPORATIONInventors: Yu-Feng Chiang, Cheng-Hao Lee, Chun-Lin Wang, Tung-Huang Kuo
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Patent number: 9373907Abstract: A flexible flat cable includes conductive wires disposed on a first surface of an insulation layer, and a cover shield covering an opposite second surface and side surfaces of the insulation layer. An electrical connector includes an insulation case defining an insertion space for receiving an insertion portion of the flexible flat cable, conductive terminals disposed on the base and contacting respectively with the conductive wires, and a ground unit. The ground unit includes a contacting portion disposed in the insertion space and contacting with the cover shield of the flexible flat cable, and a conductive portion extending out of the insulation case for grounding the flexible flat cable.Type: GrantFiled: December 16, 2014Date of Patent: June 21, 2016Assignee: Winstron CorporationInventors: Yu-Feng Chiang, Cheng-Hao Lee, Tung-Huang Kuo
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Publication number: 20150200473Abstract: A flexible flat cable includes conductive wires disposed on a first surface of an insulation layer, and a cover shield covering an opposite second surface and side surfaces of the insulation layer. An electrical connector includes an insulation case defining an insertion space for receiving an insertion portion of the flexible flat cable, conductive terminals disposed on the base and contacting respectively with the conductive wires, and a ground unit. The ground unit includes a contacting portion disposed in the insertion space and contacting with the cover shield of the flexible flat cable, and a conductive portion extending out of the insulation case for grounding the flexible flat cable.Type: ApplicationFiled: December 16, 2014Publication date: July 16, 2015Inventors: Yu-Feng CHIANG, Cheng-Hao LEE, Tung-Huang KUO
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Publication number: 20150131234Abstract: A heat dissipation device is used in a circuit board, where the circuit board includes a chip and at least one positioning hole disposed around the chip, and each of the positioning holes has a bare metal area on its periphery. The heat dissipation device includes a heat dissipation element, a conductive element and at least one fixing part. The heat dissipation element is disposed on the chip; the conductive element is connected electrically to the bare metal area of the circuit board and the heat dissipation element respectively; the fixing part passes through the fixing holes and is connected to the positioning hole, so as to fix the heat dissipation element to the circuit board. A circuit board is also provided, which includes a substrate, a chip, a positioning hole and the heat dissipation device.Type: ApplicationFiled: December 2, 2014Publication date: May 14, 2015Inventors: Yu-Feng CHIANG, Cheng-Hao LEE, Chun-Lin WANG, Tung-Huang KUO
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Patent number: 8941996Abstract: A heat dissipation device is used in a circuit board, where the circuit board includes a chip and at least one positioning hole disposed around the chip, and each of the positioning holes has a bare metal area on its periphery. The heat dissipation device includes a heat dissipation element, a conductive element and at least one fixing part. The heat dissipation element is disposed on the chip; the conductive element is connected electrically to the bare metal area of the circuit board and the heat dissipation element respectively; the fixing part passes through the fixing holes and is connected to the positioning hole, so as to fix the heat dissipation element to the circuit board. A circuit board is also provided, which includes a substrate, a chip, a positioning hole and the heat dissipation device.Type: GrantFiled: September 12, 2012Date of Patent: January 27, 2015Assignee: Wistron CorporationInventors: Yu-Feng Chiang, Cheng-Hao Lee, Chun-Lin Wang, Tung-Huang Kuo
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Publication number: 20140016272Abstract: A heat dissipation device is used in a circuit board, where the circuit board includes a chip and at least one positioning hole disposed around the chip, and each of the positioning holes has a bare metal area on its periphery. The heat dissipation device includes a heat dissipation element, a conductive element and at least one fixing part. The heat dissipation element is disposed on the chip; the conductive element is connected electrically to the bare metal area of the circuit board and the heat dissipation element respectively; the fixing part passes through the fixing holes and is connected to the positioning hole, so as to fix the heat dissipation element to the circuit board. A circuit board is also provided, which includes a substrate, a chip, a positioning hole and the heat dissipation device.Type: ApplicationFiled: September 12, 2012Publication date: January 16, 2014Inventors: Yu-Feng CHIANG, Cheng-Hao Lee, Chun-Lin Wang, Tung-Huang Kuo