Patents by Inventor Yu-Fu Chen

Yu-Fu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230268260
    Abstract: A package structure includes a first redistribution layer, a semiconductor die, and through vias. The first redistribution layer includes dielectric layers, first conductive patterns, and second conductive patterns. The dielectric layers are located in a core region and a peripheral region of the first redistribution layer. The first conductive patterns are embedded in the dielectric layers in the core region, wherein the first conductive patterns are arranged in the core region with a pattern density that gradually increases or decreases from a center of the core region to a boundary of the core region. The second conductive patterns are embedded in the dielectric layers in the peripheral region. The semiconductor die is disposed on the core region over the first conductive patterns. The through vias are disposed on the peripheral region and electrically connected to the second conductive patterns.
    Type: Application
    Filed: February 23, 2022
    Publication date: August 24, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kris Lipu Chuang, Tzu-Sung Huang, Chih-Wei Lin, Yu-fu Chen, Hsin-Yu Pan, Hao-Yi Tsai
  • Publication number: 20220391385
    Abstract: A system for managing a report comprises a generating module, for receiving data of a first user and for generating a first report according to the data; an associating module, coupled to the generating module, for determine a first content of a second report according an association between the first report and the second report; and a notifying module, coupled to the associating module, for notifying a managing result of the first report and the second report to the first user and a second user, wherein the second user is associated with a project corresponding to the first report.
    Type: Application
    Filed: August 12, 2021
    Publication date: December 8, 2022
    Applicants: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Chih-Chin Yu, Yung-Wei Tseng, Yu-Fu Chen, Wan-Ling Zhong
  • Patent number: 11081774
    Abstract: A negative coupling structure applied in a dielectric waveguide filter includes an elongated blind hole formed on a first surface of a dielectric body for building the negative coupling structure, and tuning holes formed on the first surface or a second surface of the dielectric body. A first coupling portion configured to be corresponsive to a bottom wall of the elongated blind hole, a second coupling portion configured to be corresponsive to a side wall of the elongated blind hole, and a common coupling portion connected between the bottom wall and the side wall are provided to define a negative coupling structure in the dielectric body, so as to provide both capacitive coupling and inductive coupling and a negative coupling and achieve the effects of reducing the weight and volume of the dielectric waveguide filter and providing good performance, simple structure and easy manufacture.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: August 3, 2021
    Inventors: Chien-Chih Lee, Yu-Fu Chen, Hsueh-Han Chen
  • Publication number: 20160274047
    Abstract: A biosensor structure is provided, which includes a substrate, a center conductor, a first ground conductor, a second ground conductor and a protection layer. The center conductor is disposed on the substrate and defines a detection area at the central area thereof for detection of cells or biomolecules. The first ground conductor is disposed on the substrate and is located opposite to a side of the center conductor. The second ground conductor is disposed on the substrate and is located opposite to another side of the center conductor. The protection layer is disposed on the substrate, the center conductor, the first ground conductor and the second ground conductor. In a thickness direction of the biosensor structure, the protection layer is disposed without substantially overlapping the detection area.
    Type: Application
    Filed: March 20, 2015
    Publication date: September 22, 2016
    Inventors: Hung-Wei WU, Yong-Han HONG, Yu-Fu CHEN, Chien-Feng LI, Hsin-Ying LEE, Pin-Wen CHEN
  • Publication number: 20150267239
    Abstract: Disclosure is a biosensor chip having precise count function comprising: a substrate, a plurality of ground wire waveguide layers, a signal waveguide layer and a protective layer. Wherein, the plurality of ground wire waveguide layers are located on two sides of the substrate, the signal waveguide layer is located on the substrate and between the plurality of ground wire waveguide layers, wherein the signal waveguide layer has a recess which forms a cell sensing region; and the protective layer covers a portion of the ground wire waveguide layers and a portion of the signal waveguide layer to expose the recess.
    Type: Application
    Filed: August 13, 2014
    Publication date: September 24, 2015
    Inventors: Hung-Wei WU, Yu-Fu CHEN, Yong-Han HONG, Hsin-Ying LEE
  • Patent number: 8962305
    Abstract: A biosensor chip with nano-structures. The biosensor chip includes a RF biosensor, comprising an isolated substrate; a ground plane; a filtering circuit; at least one cell detection area with nano-structures and a protection layer. The RF biosensor can detect the existence of the cancer cells, high frequency biological effects and the cells relationship between transfers by noninvasive method. The RF biosensor according to the invention can provide high accuracy and sensitivity in cancer cells detection.
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: February 24, 2015
    Assignee: Kun Shan University
    Inventors: Hung-Wei Wu, Yong-Han Hong, Yu-Fu Chen, Yung-Wei Chen, Shu-Ting Teng
  • Publication number: 20130089919
    Abstract: A biosensor chip with nano-structures. The biosensor chip includes a RF biosensor, comprising an isolated substrate; a ground plane; a filtering circuit; at least one cell detection area with nano-structures and a protection layer. The RF biosensor can detect the existence of the cancer cells, high frequency biological effects and the cells relationship between transfers by noninvasive method. The RF biosensor according to the invention can provide high accuracy and sensitivity in cancer cells detection.
    Type: Application
    Filed: March 19, 2012
    Publication date: April 11, 2013
    Applicant: KUN SHAN UNIVERSITY
    Inventors: Hung-Wei Wu, Yong-Han Hong, Yu-Fu Chen, Yung-Wei Chen, Shu-Ting Teng
  • Patent number: 7073431
    Abstract: An improved structure portable strapping machine in which a band is articulated via a strap pulling device, a swinging device, and a cutting device and then bound tight by a friction welding means to facilitate strapping objects of various shapes and dimensions that are difficult to ship. As such, utilization of the improved structure portable strapping machine of the present invention is easy, convenient, rapid, reliable, and safe.
    Type: Grant
    Filed: May 18, 2005
    Date of Patent: July 11, 2006
    Inventor: Yu-Fu Chen
  • Patent number: 6363983
    Abstract: The invention herein relates to an improved tire structure comprised of a plurality of thin steel plates crisscrossingly arranged in the thick portion of a tire surface and an assembly of cover tire installed around the surface of said tire; the plurality of up and down crisscrossingly arranged thin steel plates form a shield along the circumference of tire that removes the worry of the tire being punctured by sharp objects on the roads when the vehicle travels, thus enhancing driving safety; the cover tire can be replaced after it is worn out without the need to change the whole tire, thus effectively reducing the consumption of rubber for tire production that makes the invention herein both economical and environmentally friendly.
    Type: Grant
    Filed: May 2, 2000
    Date of Patent: April 2, 2002
    Inventor: Yu-Fu Chen
  • Patent number: 6321807
    Abstract: The invention herein relates to a composite tire comprised of a rubber tire mounted over a rim which is covered externally by an assembly of cover tire having the following features: the cover tire is internally lined with a steel jacket that totally removes the risk of puncture; said cover tire is supported by the inflated tire and in contact with ground surface in rubber material that allows its usage by vehicles completely barrier-free; in addition, said cover tire uses significantly less rubber than regular tires and is replaceable anytime after wear without the need to change the entire tire. It not only effectively lowers the consumption of rubber, thus is both economical and environmentally friendly.
    Type: Grant
    Filed: April 21, 2000
    Date of Patent: November 27, 2001
    Inventor: Yu-Fu Chen
  • Patent number: 5957517
    Abstract: An improved clamp device structure for the clinching and conveyance of unusually shaped objects is provided and includes support rods equipped with steel clamp bars, of which the odd-numbered elements are fixed and the even-numbered elements are capable of leftward and rightward movement, or the even-numbered elements are fixed and the odd-numbered elements are capable of leftward and rightward movement. Installed at the upper extent of the support rods is a relief bar capable of the upward and downward movement that facilitates the clinching and conveyance of the unusually shaped objects. Since the steel clamp bars on the support rods are arrayed in a close configuration, the clinching range of the array is sufficient to accommodate a number of working objects and thereby enable the steel clamp bars to positively hold objects for conveyance.
    Type: Grant
    Filed: November 17, 1998
    Date of Patent: September 28, 1999
    Inventor: Yu-Fu Chen
  • Patent number: 5948449
    Abstract: The invention herein relates to a kind of slug production device for brick-making machines, specifically referring to a kind of slug production device that is mainly comprised of a raw brick mixture filler trough and a vacuum trough, below which are the the parallel and horizontal members of two pressure tubes and two forming tubes, and positioned at the rear of the two pressure tubes and the two forming tubes are a pair of pressure mechanisms and, furthermore, at the bottom section of the raw brick mixture filler trough and the vacuum trough is a swing-type aggregate crushing mechanism such that after the raw brick mixture is loaded into the filler trough, the raw brick mixture is conveyed precisely into the pressure tubes and the pressure mechanism pistons at the rear of the two pressure tubes operate in a reciprocal movement to convey the raw brick material slugs into the vacuum trough then the raw brick material aggregate conveyed into the vacuum trough are guided into the forming tubes by the pressure me
    Type: Grant
    Filed: December 11, 1997
    Date of Patent: September 7, 1999
    Inventor: Yu-Fu Chen
  • Patent number: D412927
    Type: Grant
    Filed: July 30, 1998
    Date of Patent: August 17, 1999
    Inventor: Yu-Fu Chen