Abstract: A reading device for capacitive sensing element comprises a differential capacitive sensing element, a modulator, a charge-voltage conversion circuit, a phase adjustment circuit, a demodulator and a low-pass filter. The modulator outputs a modulation signal to the common node of the capacitive sensing element and modulates the output signal of the capacitive sensing element. The two input terminals of the charge-to-voltage conversion circuit are connected to two non-common nodes of the capacitive sensing element. The charge-to-voltage converter read the output charge of the capacitive sensing element and convert it into a voltage signal. The modulator generates a demodulation signal through the phase adjustment circuit. The demodulator receives the demodulation signal from the phase adjustment circuit and demodulates the output of the charge-to-voltage conversion circuit. The low-pass filter is connected to the output of the demodulator for filtering the demodulated voltage signal to output the read signal.

Abstract: An electronic device includes a housing, a first metal trace, a conductive pillar, a circuit board, and a metal connecting element. The housing includes a conductive via and a concave hole, and the conductive via passes through the housing. The first metal trace is disposed on an inner surface of the housing, and the conductive via is electrically connected to the first metal trace. The conductive pillar is disposed in the concave hole and exposed from the housing, and the conductive pillar is electrically connected to the conductive via. The circuit board is disposed inside the housing. The metal connecting element is disposed on the circuit board and electrically connected to the first metal trace.

Abstract: An antenna array device and an antenna unit thereof are provided. The antenna unit includes an antenna structure and a molding support. The antenna structure includes a substrate and a plurality of patches that are formed on the substrate. The substrate has a plurality of channel holes penetrating there-through. The molding support is integrally formed on the substrate as a single one-piece structure. The molding support has a first stand, a second stand, and a plurality of connection portions that are formed in the channel holes to connect the first stand and the second stand. The first stand and the second stand are formed on two sides of the substrate, respectively.

Abstract: A shielding structure and a manufacturing method thereof are provided. The shielding structure includes a metal housing, a plastic member, and a conductive trace. The metal housing has an inner surface and an internal space. The plastic member is disposed on the inner surface and in the internal space and has an accommodating space. The conductive trace is disposed on the plastic member and in the accommodating space, wherein the plastic member is between the conductive trace and the metal housing.

Abstract: A shielding structure and a manufacturing method thereof are provided. The shielding structure includes a metal housing, a plastic member, and a conductive trace. The metal housing has an inner surface and an internal space. The plastic member is disposed on the inner surface and in the internal space and has an accommodating space. The conductive trace is disposed on the plastic member and in the accommodating space, wherein the plastic member is between the conductive trace and the metal housing.

Abstract: An antenna array device and an antenna unit thereof are provided. The antenna unit includes an antenna structure and a molding support. The antenna structure includes a substrate and a plurality of patches that are formed on the substrate. The substrate has a plurality of channel holes penetrating there-through. The molding support is integrally formed on the substrate as a single one-piece structure. The molding support has a first stand, a second stand, and a plurality of connection portions that are formed in the channel holes to connect the first stand and the second stand. The first stand and the second stand are formed on two sides of the substrate, respectively.

Abstract: A sensing module and an electronic device are provided. The sensing module includes a substrate, at least one light-emitting unit, a light-guiding assembly, at least one sensing circuit structure, and a sensing processor. The light-guiding assembly is connected to the substrate and includes at least one light-guiding structure. The at least one light-emitting unit is configured to emit a light beam outwardly through the at least one light-guiding structure. One end of the at least one sensing circuit structure is disposed on the substrate. The sensing processor is disposed on the substrate, and is configured to sense a capacitance change in a peripheral area of the at least one sensing circuit structure by the at least one sensing circuit structure and to generate a sensing signal. The sensing processor or an external controller is configured to control the at least one light-emitting unit according to the sensing signal.

Abstract: The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.

Abstract: A metal pattern formed in the electromagnetic absorber structure is provided. By performing the laser treatment to form the active layer thereon, the metal pattern can be regionally formed on the electromagnetic absorber structure in the following electroless plating processes.

Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form a conductive pattern on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the conductive pattern is remained on the surface of the polymer substrate. Then, the conductive pattern on the polymer substrate is subjected to an electroplating process to form the metallic pattern over the conductive pattern on the polymer substrate.

Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form active seed residues on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the active seed residues are remained on the surface of the polymer substrate. Then, the active seed residues on the polymer substrate are subjected to an electroless plating process to form the metallic pattern over the active seed residues on the polymer substrate.

Abstract: A metal pattern formed in the electromagnetic absorber structure is provided. By performing the laser treatment to form the active layer thereon, the metal pattern can be regionally formed on the electromagnetic absorber structure in the following electroless plating processes.

Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form a conductive pattern on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the conductive pattern is remained on the surface of the polymer substrate. Then, the conductive pattern on the polymer substrate is subjected to an electroplating process to form the metallic pattern over the conductive pattern on the polymer substrate.

Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form active seed residues on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the active seed residues are remained on the surface of the polymer substrate. Then, the active seed residues on the polymer substrate are subjected to an electroless plating process to form the metallic pattern over the active seed residues on the polymer substrate.

Abstract: The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.

Abstract: A method for manufacturing an antenna structure is disclosed. Employing steps of mixing with a catalyst and embedding a metal insert can simplify steps for manufacturing the antenna structure. Further, a non-conductive frame produced by the process disclosed herein can exhibit waterproof effect. The catalyst mentioned above is mixed with a plastic and then injected into a mold to form the non-conductive frame. The metal insert mentioned above is disposed in the mold before the step of injecting the plastic. Alternatively, the metal insert is embedded in the non-conductive frame after the step of injecting the plastic.

Abstract: A method for manufacturing an antenna structure is disclosed. Employing steps of mixing with a catalyst and embedding a metal insert can simplify steps for manufacturing the antenna structure. Further, a non-conductive frame produced by the process disclosed herein can exhibit waterproof effect. The catalyst mentioned above is mixed with a plastic and then injected into a mold to form the non-conductive frame. The metal insert mentioned above is disposed in the mold before the step of injecting the plastic. Alternatively, the metal insert is embedded in the non-conductive frame after the step of injecting the plastic.

Abstract: Check code and a uniform resource locators (URL) are sent from a server to a computer. The check code, when executed on the computer, lists a reference to the URL so that an attribute of the listed reference to the URL varies depending on whether the URL is in a list indicating URLs visited by the computer, and forwards to the server, based on the attribute of the listed reference to the URL, an indication as to whether the URL is in the list indicating URLs visited by the computer. Content to be sent to the computer is selected based on the indication.

Abstract: An information handling system stores code, layout information, and location information in a memory. A processor executes the code to read the information, render a representation of the information handling system from the layout information, and display the representation on a display. The representation includes a connector that is located based on the location information. A method includes displaying a representation of an information handling system and a device. The representation includes depictions of the information handling system and the device. The method also includes receiving an input selecting the depiction of the device, and disabling the device in response to receiving the input. A memory includes code for carrying out the method.