Patents by Inventor Yu Geun JO

Yu Geun JO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TIN-SILVER PLATING SOLUTION AND METHOD FOR FORMING TIN-SILVER SOLDER BUMP BY USING SAME
    Publication number: 20230407508
    Abstract: As a tin-silver plating solution that contains a source of tin ions; a source of silver ions (Ag+); and an organic additive including a silver (Ag) complexing agent, a tin carrier, and a crystal grain refiner is provided, in the case of performing high-speed plating using the plating solution, the generation of whiskers is diminished, the composition of silver ions (Ag+) in the tin-silver plating solution is uniformly maintained, and thus a uniform silver composition in the formed tin-silver solder bumps can be achieved.
    Type: Application
    Filed: November 17, 2021
    Publication date: December 21, 2023
    Applicants: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY, DONGWOO FINE-CHEM CO., LTD.
    Inventors: Min Hyung LEE, Woon Young LEE, Sang Hoon JIN, Yu Geun JO, Dong Ryul LEE