Abstract: In some embodiments, the present disclosure relates an integrated chip including a substrate. A conductive interconnect feature is arranged over the substrate. The conductive interconnect feature has a base feature portion with a base feature width and an upper feature portion with an upper feature width. The upper feature width is narrower than the base feature width such that the conductive interconnect feature has tapered outer feature sidewalls. An interconnect via is arranged over the conductive interconnect feature. The interconnect via has a base via portion with a base via width and an upper via portion with an upper via width. The upper via width is wider than the base via width such that the interconnect via has tapered outer via sidewalls.

Abstract: A method of manufacturing a semiconductor structure is provided. A conductive layer is formed on a precursor memory structure. A target layer is formed on the conductive layer. A first photoresist with a first opening is formed on the target layer. A spacer is formed on sidewalls of the first opening. A second photoresist with a second opening is formed on the target layer and the spacer. The target layer is patterned by the second photoresist and the spacer to form a first patterned target layer. A third photoresist with a third opening is formed on the first patterned target layer. The first patterned target layer is patterned by the third photoresist to form a second patterned target layer. The conductive layer is patterned by the second patterned target layer to form a patterned conductive layer including a ring structure aligned with a source/drain region.

Abstract: In some embodiments, the present disclosure relates to an integrated chip having an inter-layer dielectric (ILD) structure along a first surface of a substrate having a photodetector. An etch stop layer is over the ILD structure, and a reflector is surrounded by the etch stop layer and the ILD structure. The reflector has a curved surface facing the substrate at a location directly over the photodetector. The curved surface is coupled between a first sidewall and a second sidewall of the reflector. The reflector has larger thicknesses along the first sidewall and the second sidewall than at a center of the reflector between the first sidewall and the second sidewall.

Abstract: The present disclosure provides a multi-state one-time programmable (MSOTP) memory circuit including a memory cell and a programming voltage driving circuit. The memory cell includes a MOS storage transistor, a first MOS access transistor and a second MOS access transistor electrically connected to store two bits of data. When the memory cell is in a writing state, the programming voltage driving circuit outputs a writing control potential to the gate of the MOS storage transistor, and when the memory cell is in a reading state, the programming voltage driving circuit outputs a reading control potential to the gate of the MOS storage transistor.

Abstract: A hand tool comprises a support, a handle, at least two spindles, a driver, at least two followers and at least two spanners. The handle is rotatably mounted on a middle portion of the support. The at least two spindles are respectively fixed to two opposite ends of the support by ends thereof. The driver is mounted on an end of the handle. The at least two followers are respectively rotatably attached on another end of each spindle and drivably connected with driver. The at least two spanners are attached on a surface of each follower which is away from the corresponding spindle.

Abstract: A molding apparatus includes a mold plate, a mold core received in the mold plate, a plurality of temperature sensors and a heater. A heat passage is defined in the mold plate and adjacent to the mold core. The heat passage is configured for flowing a heating medium therethrough to heat up the mold core. The plurality of temperature sensors are mounted in the mold plate for sensing a temperature of the mold plate. The heater is configured for heating the mold plate according to the temperature sensed by the sensors.

Abstract: A hand tool comprises a support, a handle, at least two spindles, a driver, at least two followers and at least two spanners. The handle is rotatably mounted on a middle portion of the support. The at least two spindles are respectively fixed to two opposite ends of the support by ends thereof. The driver is mounted on an end of the handle. The at least two followers are respectively rotatably attached on another end of each spindle and drivably connected with driver. The at least two spanners are attached on a surface of each follower which is away from the corresponding spindle.

Abstract: A light curing apparatus including a carrier device and a light source with a lamp. The light curing apparatus also includes a light intensity detection device, a data processing unit and a display unit. The light intensity detection device is configured for detecting the intensity of the light source and outputting a light intensity value, the data processing unit is configured for receiving the light intensity value and forming and outputting a data signal of the changed curve of light intensity with the time change, the display unit is configured for receiving the output of the data processing unit and displaying the curve of the light intensity with the time change. The light curing apparatus can detect the actual light intensity of the light source, such that the light curing time can be changed accordingly.