Abstract: A memory device includes a first stacking structure, a second stacking structure, a plurality of first isolation structures, gate dielectric layers, channel layers and conductive pillars. The first stacking structure includes a plurality of first gate layers, and a second stacking structure includes a plurality of second gate layers, where the first stacking structure and the second stacking structure are located on a substrate and separated from each other through a trench. The first isolation structures are located in the trench, where a plurality of cell regions are respectively confined between two adjacent first isolation structures of the first isolation structures in the trench, where the first isolation structures each includes a first main layer and a first liner surrounding the first main layer, where the first liner separates the first main layer from the first stacking structure and the second stacking structure.

Abstract: A semiconductor package includes a semiconductor component, a package body, a first RDL structure and an insulation layer. The package body surrounds the semiconductor component and has a first package surface. The first RDL structure is formed on the first package surface of the package body. The insulation layer is formed on the first RDL structure and includes an insulation body, a plurality of recessed portions and a plurality of voids, wherein the insulation body has a first insulation surface, the recessed portions are recessed with respect to the first insulation surface and form a pattern, and the voids are embedded in the insulation body.

Abstract: The present disclosure provides a semiconductor manufacturing process control method and apparatus, a device, and a storage medium. The method includes: analyzing wafer lot information and determining a current product lot of a current product; obtaining historical measurement data within a specified period; when determining that the historical measurement data does not include first measurement data of the current product lot, if determining, based on preset configuration information, that the historical measurement data includes second measurement data of a target product lot, determining a target regulatory data based on the preset configuration information and the second measurement data; and controlling a production parameter of the current product based on the target regulatory data.

Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.

Abstract: The present disclosure provides a semiconductor manufacturing process control method and apparatus, a device, and a storage medium. The method includes: analyzing wafer lot information and determining a current product lot of a current product; obtaining historical measurement data within a specified period; when determining that the historical measurement data does not include first measurement data of the current product lot, if determining, based on preset configuration information, that the historical measurement data includes second measurement data of a target product lot, determining a target regulatory data based on the preset configuration information and the second measurement data; and controlling a production parameter of the current product based on the target regulatory data.

Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.

Abstract: A rotor for a generating system includes a drive shaft, a plurality of support frames mounted on the drive shaft to rotate the drive shaft, and a plurality of blades each pivotally mounted on a respective one of the support frames. When the power touches the blades, the blades are pushed to pivot such that some of the blades are moved to abut the drive shaft and some of the blades are moved to be parallel with the travel direction of the power. Thus, the blades that are moved to abut the drive shaft will be pushed by the power to rotate the drive shaft, while the blades that are moved to be parallel with the power will not produce a drag or resistance to the power.

Abstract: A rejuvenation method includes a) removing blood or tissue from a human body or animal body, b) nurturing and purifying the blood or tissue, and c) implanting the blood or tissue that has been nurtured and purified into a user to increase the amount of stem cells in the user and to recover degraded organs in the user. Thus, the rejuvenation method is used to increase the number of the stem cells in the user successively so that the degraded organs in the user are repaired and recovered completely and can be returned to the optimum state so as to achieve the rejuvenation purpose. In addition, the blood or tissue is removed and taken from the user's body without causing a rejection.