Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion, a fixed portion, and a driving assembly. The movable portion is used to connect the optical element. The movable portion may move relative to the fixed portion. The driving assembly is used to drive the movable portion to move relative to the fixed portion.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion, a fixed portion, and a driving assembly. The movable portion is used to connect the optical element. The movable portion may move relative to the fixed portion. The driving assembly is used to drive the movable portion to move relative to the fixed portion.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion, a fixed portion, and a driving assembly. The movable portion is used to connect the optical element. The movable portion may move relative to the fixed portion. The driving assembly is used to drive the movable portion to move relative to the fixed portion.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion, a fixed portion, and a driving assembly. The movable portion is used to connect the optical element. The movable portion may move relative to the fixed portion. The driving assembly is used to drive the movable portion to move relative to the fixed portion.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion, a fixed portion, and a driving assembly. The movable portion is used to connect the optical element. The movable portion may move relative to the fixed portion. The driving assembly is used to drive the movable portion to move relative to the fixed portion.

Abstract: A method and apparatus for forming tungsten features in semiconductor devices is provided. The method includes exposing a top opening of a feature formed in a substrate to a physical vapor deposition (PVD) process to deposit a tungsten liner layer within the feature. The PVD process is performed in a first processing region of a first processing chamber and the tungsten liner layer forms an overhang portion, which partially obstructs the top opening of the feature. The substrate is transferred from the first processing region of the first processing chamber to a second processing region of a second processing chamber without breaking vacuum. The overhang portion is exposed to nitrogen-containing radicals in the second processing region to inhibit subsequent growth of tungsten along the overhang portion. The feature is exposed to a tungsten-containing precursor gas to form a tungsten fill layer over the tungsten liner layer within the feature.

Abstract: A modular portable computer includes a base board unit, an inner frame member and a casing unit. A processor socket and at least one memory socket are mounted on a first surface of the base board unit and are connected electrically thereto. The processor socket has a processing unit mounted removably thereon and connected electrically thereto. The memory socket has a respective memory module mounted removably thereon and connected electrically thereto. The inner frame member is superimposed on the first surface of the base board unit, and includes a heat-dissipating portion, a fan-mounting cavity, a heat-dissipating fan mounted in the fan-mounting cavity, and a heat-conducting pipe having one end disposed to contact the processing unit and an opposite end connected to the heat-dissipating portion so as to transmit heat generated by the processing unit to the heat-dissipating portion.

Abstract: A modular portable computer includes a housing, a signal transmission circuit board unit mounted in the housing, a power supply unit mounted on the housing and connected electrically to the circuit board unit, a display unit coupled pivotally to the housing and connected electrically to the circuit board unit, a keyboard module mounted on the housing and connected electrically to the circuit board unit, and a main board module which includes a casing unit mounted removably in the housing, and a processing unit, a memory module and a data storage medium that are mounted in the casing unit. The main board module further includes a connector unit for connecting electrically the main board module with the power supply unit, the display unit and the keyboard module via the circuit board unit when the main board module is disposed in the housing.

Abstract: A modular portable computer includes a base board unit, an inner frame member and a casing unit. A processor socket and at least one memory socket are mounted on a first surface of the base board unit and are connected electrically thereto. The processor socket has a processing unit mounted removably thereon and connected electrically thereto. The memory socket has a respective memory module mounted removably thereon and connected electrically thereto. The inner frame member is superimposed on the first surface of the base board unit, and includes a heat-dissipating portion, a fan-mounting cavity, a heat-dissipating fan mounted in the fan-mounting cavity, and a heat-conducting pipe having one end disposed to contact the processing unit and an opposite end connected to the heat-dissipating portion so as to transmit heat generated by the processing unit to the heat-dissipating portion.