Patents by Inventor Yu HONDA

Yu HONDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11781140
    Abstract: The present specification provides a drug that causes highly-efficient skipping of exon 51 in the human dystrophin gene. The present specification provides an antisense oligomer having an activity to induce skipping of exon 51 in the human dystrophin gene.
    Type: Grant
    Filed: August 25, 2022
    Date of Patent: October 10, 2023
    Assignees: NIPPON SHINYAKU CO., LTD., NATIONAL CENTER OF NEUROLOGY AND PSYCHIATRY
    Inventors: Yu Honda, Kaname Muchima, Takahiro Fukui, Saki Hasegawa, Shin'ichi Takeda, Yoshitsugu Aoki
  • Publication number: 20230140736
    Abstract: The present specification provides a drug that causes highly-efficient skipping of exon 51 in the human dystrophin gene. The present specification provides an antisense oligomer having an activity to induce skipping of exon 51 in the human dystrophin gene.
    Type: Application
    Filed: February 26, 2021
    Publication date: May 4, 2023
    Applicants: NIPPON SHINYAKU CO., LTD., NATIONAL CENTER OF NEUROLOGY AND PSYCHIATRY
    Inventors: Yu HONDA, Kaname MUCHIMA, Takahiro FUKUI, Saki HASEGAWA, Shin'ichi TAKEDA, Yoshitsugu AOKI
  • Publication number: 20230097387
    Abstract: The present specification provides a drug that causes highly-efficient skipping of exon 51 in the human dystrophin gene. The present specification provides an antisense oligomer having an activity to induce skipping of exon 51 in the human dystrophin gene.
    Type: Application
    Filed: August 25, 2022
    Publication date: March 30, 2023
    Applicants: NIPPON SHINYAKU CO., LTD., NATIONAL CENTER OF NEUROLOGY AND PSYCHIATRY
    Inventors: Yu HONDA, Kaname MUCHIMA, Takahiro FUKUI, Saki HASEGAWA, Shin'ichi TAKEDA, Yoshitsugu AOKI
  • Publication number: 20220266419
    Abstract: There is provided a grinding method for grinding a substrate with a grinding wheel. A dissimilar material portion made of a material different from a main constituent material of the substrate is embedded in the substrate. The grinding method includes: lowering the grinding wheel toward the substrate rotating while rotating the grinding wheel, and grinding the substrate by the grinding wheel; continuously imaging a processed surface of the substrate by an image sensor during grinding the substrate; analyzing an amount of exposure of the dissimilar material portion based on data of an image captured by the image sensor; and continuously grinding the substrate from a state where the dissimilar material portion begins to be exposed to a stage where the amount of exposure of the dissimilar material portion reaches a predetermined set value, based on the amount of exposure analyzed.
    Type: Application
    Filed: February 11, 2022
    Publication date: August 25, 2022
    Inventors: Tsubasa BANDO, Eiichi YAMAMOTO, Takahiko MITSUI, Yu HONDA