Patents by Inventor Yu Hong-Chi

Yu Hong-Chi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130076916
    Abstract: The present invention is intended for supply of an interactive graphic card with a digital key & its operating method, an image signal which corresponds to an object displayed on one computer's display unit, and further improved interaction between the graphic card and one user who easily operates the computer equipped with one webcam to execute an image recognition application. Accordingly, the graphic card is effective in creation of innovative and novel feelings via the present invention in addition to preservation of original texts, sounds or messages.
    Type: Application
    Filed: December 6, 2011
    Publication date: March 28, 2013
    Applicant: WALTON ADVANCED ENGINEERING INC.
    Inventors: YU Hong-Chi, Chang Mao-Ting
  • Publication number: 20120268898
    Abstract: The present invention is to provide a thin carrier device with a support pad's length positioned at a USB port's height for a supporting segment securely supported and a USB metal contact electrically connected to a female connector of the USB port effectively without problems such as invalid electrical connection or poor contact between a USB metal contact and a female connector of a computer's USB port affected by the integrated circuit module's thinned thickness. Relying on the lowered thickness of the integrated circuit module, the present invention is able to integrate other thin products with their shapes including, without limitation, card, paper card or business card for the purpose of a thinning tendency.
    Type: Application
    Filed: June 29, 2011
    Publication date: October 25, 2012
    Applicant: WALTON ADVANCED ENGINEERING INC.
    Inventors: Yu Hong-Chi, Chang Mao-Ting
  • Publication number: 20120159646
    Abstract: A storage device with a hidden space comprises a case, a biometric identification device and a switch device and embodies digital data protected in a private zone without any concern about digital data disclosed to any person who holds a data disk according to a procedure of comparing a user's characteristic signals transferred from a user's features read by the biometric identification device with a test program in an automatic executive program.
    Type: Application
    Filed: January 31, 2011
    Publication date: June 21, 2012
    Applicant: WALTON ADVANCED ENGINEERING INC.
    Inventors: Yu Hong Chi, Chang Mao-Ting
  • Publication number: 20120124274
    Abstract: The present invention provides an automatic guided flash disk and its operation method. When the present invention is plugged into a computer's port by a user, a request to connect a Human Interface Device (HID) is issued to a computer by a human interface device module in a control unit and the computer's status is determined by a system status decision module and taken as references of a character auto-entering module which regularly enables the computer's resident programs or activates a website by entering at least one character frequency.
    Type: Application
    Filed: April 20, 2011
    Publication date: May 17, 2012
    Applicant: WALTON ADVANCED ENGINEERING INC.
    Inventors: Yu Hong-Chi, Chang Mao-Ting
  • Patent number: 8094455
    Abstract: A high-density integrated circuit module structure comprises a substrate and a heat sink at least wherein the substrates form a reversely-staggered contacting stack structure by electrically contacting heat sinks and heat conductors on the heat sink have a non-flat structure at least to realize the present invention which extends the product's functions within an electronic product's restricted height and has a better vibration resistance capability, heat dissipation effect, and no steps involving junctions between solder balls and a carrier in an assembling procedure to simply an assembling procedure with improved functions, increased capacity, and reduced manufacturing costs.
    Type: Grant
    Filed: April 7, 2010
    Date of Patent: January 10, 2012
    Assignee: Walton Advanced Engineering Inc.
    Inventor: Yu Hong-Chi
  • Publication number: 20110211314
    Abstract: A high-density integrated circuit module structure comprises a substrate and a heat sink at least wherein the substrates form a reversely-staggered contacting stack structure by electrically contacting heat sinks and heat conductors on the heat sink have a non-flat structure at least to realize the present invention which extends the product's functions within an electronic product's restricted height and has a better vibration resistance capability, heat dissipation effect, and no steps involving junctions between solder balls and a carrier in an assembling procedure to simply an assembling procedure with improved functions, increased capacity, and reduced manufacturing costs.
    Type: Application
    Filed: April 7, 2010
    Publication date: September 1, 2011
    Applicant: WALTON ADVANCED ENGINEEING INC.
    Inventor: Yu Hong-Chi