Patents by Inventor Yu-Hong Lee

Yu-Hong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967462
    Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. At least one hole is formed in the internal electrode layer, and a region, containing at least one selected from the group consisting of indium (In) and tin (Sn), is disposed in the hole. A method of manufacturing a capacitor component includes forming a dielectric green sheet, forming a conductive thin film, including a first conductive material and a second conductive material, on the dielectric green sheet, and sintering the conductive thin film to form an internal electrode layer. The internal electrode layer includes the first conductive material, and a region, including the second conductive material, is formed in the internal electrode layer.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: April 23, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yun Sung Kang, Su Yeon Lee, Won Jun Na, Byung Kun Kim, Yu Hong Oh, Sun Hwa Kim, Jae Eun Heo, Hoe Chul Jung
  • Patent number: 11955441
    Abstract: An interconnect structure comprises a first dielectric layer, a first metal layer, a second dielectric layer, a metal via, and a second metal layer. The first dielectric layer is over a substrate. The first metal layer is over the first dielectric layer. The first metal layer comprises a first portion and a second portion spaced apart from the first portion. The second dielectric layer is over the first metal layer. The metal via has an upper portion in the second dielectric layer, a middle portion between the first and second portions of the first metal layer, and a lower portion in the first dielectric layer. The second metal layer is over the metal via. From a top view the second metal layer comprises a metal line having longitudinal sides respectively set back from opposite sides of the first portion of the first metal layer.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jian-Hong Lin, Kuo-Yen Liu, Hsin-Chun Chang, Tzu-Li Lee, Yu-Ching Lee, Yih-Ching Wang
  • Patent number: 11948836
    Abstract: Apparatuses and methods to provide electronic devices having metal films are provided. Some embodiments of the disclosure utilize a metallic tungsten layer as a liner that is filled with a metal film comprising cobalt. The metallic tungsten layer has good adhesion to the cobalt leading to enhanced cobalt gap-fill performance.
    Type: Grant
    Filed: October 11, 2021
    Date of Patent: April 2, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Yu Lei, Sang-Hyeob Lee, Chris Pabelico, Yi Xu, Tae Hong Ha, Xianmin Tang, Jin Hee Park
  • Patent number: 6164029
    Abstract: A slabstone positioning device has a metal positioning plate, an upward bent portion connected to the metal positioning plate, and a triangular downward protrusion disposed on the upward bent portion. At least a nail fastens the metal positioning plate on a cement wall. A slabstone has four slant recesses. An adhesive is applied on each slant recess. Each slant recess receives the upward bent portion of the slabstone positioning device.
    Type: Grant
    Filed: September 17, 1998
    Date of Patent: December 26, 2000
    Inventor: Yu-Hong Lee