Abstract: A method and a system are provided for calibrating metrological tools used to measure features of a semiconductor device. A critical dimension (CD) ruler defines a known pitch plus a pitch offset. A photoresist layer is measured to determine a measured pitch whereupon the measured pitch is compared to the known pitch. From the comparison, appropriate calibration steps can be taken to reduce the difference between the known pitch and the measured pitch.

Abstract: A method and a system are provided for calibrating metrological tools used to measure features of a semiconductor device. A critical dimension (CD) ruler defines a known pitch plus a pitch offset. A photoresist layer is measured to determine a measured pitch whereupon the measured pitch is compared to the known pitch. From the comparison, appropriate calibration steps can be taken to reduce the difference between the known pitch and the measured pitch.

Abstract: A USB drive mass storage device mainly includes a housing having a predetermined size, in which an optical fingerprint identification system is mounted for use with the USB drive. A printed circuit board (PCB) is located on an inner bottom of the housing with a universal serial bus (USB) plug projected from a front end of the housing. The optical fingerprint identification system includes an image sensing element and an optical prism located across front and rear ends, respectively, of the PCB, so that a space above the PCB provides an optical path for the optical fingerprint identification system. The housing is provided at a rear end with a pivotally connected rear cover to enable easy protection of and access to a fingerprint surface on the optical prism.

Abstract: A method and apparatus for improving a yield and throughput of a lithographic process track, the method including providing a first resist layer on a first process wafer; forming a first resist pattern in the first resist layer including a heating process according to a first temperature profile wherein the heating process comprises a plurality of temperature controllable heating zones; producing and collecting scattered light spectra from the first resist pattern processing the scattered light spectrum to obtain 3-dimensional information including first resist pattern critical dimensions; determining a second temperature profile for performing the heating process to achieve targeted resist pattern critical dimensions including a second resist pattern on a second process wafer; and, forming the second resist pattern dimensions including the heating process according to the second temperature profile.

Abstract: A novel method for eliminating or reducing the accumulation of electrostatic charges on semiconductor wafers during spin-rinse-drying of the wafers is disclosed. The method includes rinsing a wafer; applying an ionic solution to the wafer; and spin-drying the wafer. During the spin-drying step, the ionic solution neutralizes electrostatic charges on the wafer as the wafer is rotated. This reduces the formation of defects in devices fabricated on the wafer, as well as prevents or reduces electrostatic interference with processing equipment during photolithographic and other fabrication processes.

Abstract: Provided are a system and method for modifying a fabrication process based on inline measurement information during manufacture of a semiconductor device. In one example, the method includes exposing a photoresist layer on the device, performing post-exposure baking on the photoresist layer, and obtaining at least one critical dimension (CD) measurement of the device. A determination may be made as to whether the CD measurement indicates that the exposure and/or baking step achieved a predefined result. If not, the device may be subjected to additional exposure or baking.

Abstract: A USB drive mass storage device mainly includes a housing having a predetermined size, in which an optical fingerprint identification system is mounted for use with the USB drive. A printed circuit board (PCB) is located on an inner bottom of the housing with a universal serial bus (USB) plug projected from a front end of the housing. The optical fingerprint identification system includes an image sensing element and an optical prism located across front and rear ends, respectively, of the PCB, so that a space above the PCB provides an optical path for the optical fingerprint identification system. The housing is provided at a rear end with a pivotally connected rear cover to enable easy protection of and access to a fingerprint surface on the optical prism.

Abstract: The present invention provides a method for avoiding particulate contamination of a semiconductor wafer in a stripping bath and a stripping system for implementing the method. The method includes providing at least one semiconductor wafer vertically oriented in a wafer containing fixture; providing a solution bath for removing particulate material from a semiconductor wafer surface; immersing the wafer containing fixture in the solution bath positioned over a movable member having a contact surface such that upon moving the movable member in a vertical direction the contact surface contacts a portion of the edge of the at least one semiconductor; and moving the movable member such that the at least one semiconductor wafer is projected upward from a resting position in the wafer containing fixture.

Abstract: A wet stripping apparatus for removing unwanted film layers, such as a thick photoresist layer from a wafer surface after a solder bumping process and a method for using the apparatus are disclosed. The apparatus includes a tank body, a wafer holder, and a means for reciprocally moving the wafer holder in an up-and-down motion with at least one wafer mounted in the holder immersed in a stripper solution to a frequency of not higher than 100 cycle/min. The stripper solution utilized, which is suitably kept at a temperature of at least 50° C., contains dimethyl sulfoxide, tetramethyl-ammonium-hydroxide and water. After the stripping process, the wafer is rinsed in a quick dump rinse step and then spin dried for conducting subsequent fabrication processes on the wafer.

Abstract: A method for alignment to an alignment mark array within a patterned electronic material layer, formed on a substrate employed in a microelectronics fabrication, with improved registration accuracy of a subsequent step-and-repeat photomask pattern. There is first provided a substrate upon which is formed a patterned microelectronics layer containing an alignment mark array. There is then formed over the substrate and patterned layer, covering over the alignment marks, a subsequent layer or layers which may be of opaque material. In order to align properly a patterned photomask for patterning the overlying layer by means of conventional photolithography, the alignment mark array is located by first scanning with a laser light source contained within a step-and-repeat apparatus containing the patterned photomask and detecting the optical radiation signal scattered from the alignment mark array.