Patents by Inventor Yu Hsiang Hsiao

Yu Hsiang Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230203238
    Abstract: A copolymer is formed by reacting a composition I, which includes (a) a first epoxy compound having a chemical structure of wherein R1 is single bond, —O—, (b) a second epoxy compound that is different from (a) the first epoxy compound, and (c) a curing agent. The copolymer can be mixed with inorganic powder to form a composite material.
    Type: Application
    Filed: July 15, 2022
    Publication date: June 29, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Pin TING, Kuei-Yi CHUANG, Yu-Hsiang HSIAO, Wei-Ta YANG
  • Patent number: 9960136
    Abstract: A semiconductor device includes a first circuit layer, a copper pillar disposed adjacent to the first circuit layer, a second circuit layer and a solder layer. The second circuit layer includes an electrical contact and a surface finish layer disposed on the electrical contact, wherein a material of the surface finish layer is a combination of at least two of nickel, gold, and palladium. The solder layer is disposed between the copper pillar and the surface finish layer. The solder layer includes a first intermetallic compound (IMC) and a second IMC, wherein the first IMC includes a combination of two or more of copper, nickel and tin, and the second IMC includes a combination of gold and tin, a combination of palladium and tin, or both.
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: May 1, 2018
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Hsiang Hsiao, Chiu-Wen Lee, Ping-Feng Yang, Kwang-Lung Lin
  • Publication number: 20160358875
    Abstract: A semiconductor device includes a first circuit layer, a copper pillar disposed adjacent to the first circuit layer, a second circuit layer and a solder layer. The second circuit layer includes an electrical contact and a surface finish layer disposed on the electrical contact, wherein a material of the surface finish layer is a combination of at least two of nickel, gold, and palladium. The solder layer is disposed between the copper pillar and the surface finish layer. The solder layer includes a first intermetallic compound (IMC) and a second IMC, wherein the first IMC includes a combination of two or more of copper, nickel and tin, and the second IMC includes a combination of gold and tin, a combination of palladium and tin, or both.
    Type: Application
    Filed: August 17, 2016
    Publication date: December 8, 2016
    Inventors: Yu-Hsiang HSIAO, Chiu-Wen LEE, Ping-Feng YANG, Kwang-Lung LIN
  • Patent number: 9507866
    Abstract: A geographical location rendering method executed in a geographical location rendering system for identifying at least one semantic region is provided. A density clustering is performed on a plurality of user generated contents of respective geographical location name information to generate a plurality of region candidates. A name extraction is performed on the region candidates to extract and confirm a common region name of the region candidates as a name of the semantic region. A region scope of the region candidates is detected as a location scope of the semantic region according to a spatial density analysis.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: November 29, 2016
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen Tsui, Tai-Ting Wu, Shin-Yi Wu, Yu-Hsiang Hsiao
  • Patent number: 9443813
    Abstract: The present disclosure relates to a semiconductor device and a method for manufacturing the same. The semiconductor device includes a semiconductor die, a semiconductor element and a solder layer. The semiconductor die includes a copper pillar. The semiconductor element includes a surface finish layer, wherein the material of the surface finish layer is a combination of at least two of nickel, gold, and palladium. The solder layer is disposed between the copper pillar and the surface finish layer. The solder layer includes a first intermetallic compound (IMC) and a second IMC, wherein the first IMC includes a combination of at least two of copper, nickel and tin. The second IMC is a combination of gold and tin, a combination of palladium and tin, or both.
    Type: Grant
    Filed: March 5, 2015
    Date of Patent: September 13, 2016
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Hsiang Hsiao, Chiu-Wen Lee, Ping-Feng Yang, Kwang-Lung Lin
  • Publication number: 20160260677
    Abstract: The present disclosure relates to a semiconductor device and a method for manufacturing the same. The semiconductor device includes a semiconductor die, a semiconductor element and a solder layer. The semiconductor die includes a copper pillar. The semiconductor element includes a surface finish layer, wherein the material of the surface finish layer is a combination of at least two of nickel, gold, and palladium. The solder layer is disposed between the copper pillar and the surface finish layer. The solder layer includes a first intermetallic compound (IMC) and a second IMC, wherein the first IMC includes a combination of at least two of copper, nickel and tin. The second IMC is a combination of gold and tin, a combination of palladium and tin, or both.
    Type: Application
    Filed: March 5, 2015
    Publication date: September 8, 2016
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Hsiang HSIAO, Chiu-Wen LEE, Ping-Feng YANG, Kwang-Lung LIN
  • Publication number: 20130262966
    Abstract: A digital content reordering method and a digital content aggregator are provided, in which a reading behavior log and/or a social behavior log of a user are analyzed to obtain a preference factor of the user regarding digital contents in at least one content stream. The digital content reordering method and the digital content aggregator aggregate the at least one content stream into an aggregated stream and determine the order of the digital contents in the aggregated stream according to a time factor of the digital contents and the preference factor of the user regarding the digital contents. This reordering process allows the user to view the latest, the most related, and the most interesting digital contents first.
    Type: Application
    Filed: June 5, 2012
    Publication date: October 3, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shin-Yi Wu, Yu-Hsiang Hsiao, Chi-Chun Kao, Po-Yuan Ting, Yi-Cyuan Chen, Wen-Hsi Yeh
  • Publication number: 20130156324
    Abstract: A geographical location rendering method executed in a geographical location rendering system for identifying at least one semantic region is provided. A density clustering is performed on a plurality of user generated contents of respective geographical location name information to generate a plurality of region candidates. A name extraction is performed on the region candidates to extract and confirm a common region name of the region candidates as a name of the semantic region. A region scope of the region candidates is detected as a location scope of the semantic region according to a spatial density analysis.
    Type: Application
    Filed: September 5, 2012
    Publication date: June 20, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen Tsui, Tai-Ting Wu, Shin-Yi Wu, Yu-Hsiang Hsiao
  • Publication number: 20070103902
    Abstract: A lighting fixture made in the form of a wall (floor) tile or a light box is disclosed to include a holder base holding a substrate, a plurality of light emitting devices, for example, LEDs or luminescent lamps installed in the substrate and electrically connected to together, and a cover shell, which is directly molded on the holder base and the substrate and the light emitting devices and has a patterned light-permeable area for the passing of the light from the light emitting devices.
    Type: Application
    Filed: November 8, 2005
    Publication date: May 10, 2007
    Inventor: Yu-Hsiang Hsiao
  • Patent number: D668981
    Type: Grant
    Filed: May 21, 2012
    Date of Patent: October 16, 2012
    Assignee: Sphere International Co., Ltd.
    Inventor: Yu Hsiang Hsiao
  • Patent number: D668982
    Type: Grant
    Filed: May 21, 2012
    Date of Patent: October 16, 2012
    Assignee: Sphere International Co., Ltd.
    Inventor: Yu Hsiang Hsiao
  • Patent number: D777964
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: January 31, 2017
    Inventor: Yu Hsiang Hsiao
  • Patent number: D778477
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: February 7, 2017
    Inventor: Yu Hsiang Hsiao