Patents by Inventor Yu-Hsiang Huang
Yu-Hsiang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12255638Abstract: The disclosure provides an electrical apparatus, including a substrate, a plurality of gate driver units and a plurality of gate lines. The gate driver units are disposed on the substrate. The gate lines are disposed on the substrate. Each of the gate lines is respectively electrically connected to the corresponding gate driver unit. Each of the gate lines is configured to transmit a respective gate signal. The gate lines include a first gate line and a second gate line. The first gate line and the second gate line are configured to transmit the respective gate signals at a same time.Type: GrantFiled: January 31, 2023Date of Patent: March 18, 2025Assignee: Innolux CorporationInventors: Hsiu-Yi Tsai, Yu-Ti Huang, Yu-Hsiang Chiu, Yi-Hung Lin
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Publication number: 20250085548Abstract: A light field display module including a light field display layer, an adjustment layer, and an image forming layer is provided. The light field display layer is configured to form a light field image beam. The adjustment layer is disposed on a path of the light field image beam, and configured to adjust the light field image beam. The image forming layer is disposed on the path of the light field image beam from the adjustment layer, and configured to change a position of a light field image by changing a direction of the light field image beam. The image forming layer has multiple optical micro-structures.Type: ApplicationFiled: August 1, 2024Publication date: March 13, 2025Applicant: Industrial Technology Research InstituteInventors: Szu-Wei Wu, Yi-Hsiang Huang, Chia-Ping Lin, Yu-Hsiang Liu, Hung Tsou
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Patent number: 12249024Abstract: Examples of the disclosure describe systems and methods for presenting virtual content on a wearable head device. In some embodiments, a state of a wearable head device is determined by minimizing a total error based on a reduced weight associated with a reprojection error. A view reflecting the determined state of the wearable head device is presented via a display of the wearable head device. In some embodiments, a wearable head device calculates a preintegration term based on the image data received via a sensor of the wearable head device and the inertial data received via a first IMU and a second IMU of the wearable head device. The wearable head device estimates a position of the device based on the preintegration term, and the wearable head device presents the virtual content based on the position of the device.Type: GrantFiled: February 12, 2024Date of Patent: March 11, 2025Assignee: Magic Leap, Inc.Inventors: Yu-Hsiang Huang, Evan Gregory Levine, Igor Napolskikh, Dominik Michael Kasper, Manel Quim Sanchez Nicuesa, Sergiu Sima, Benjamin Langmann, Ashwin Swaminathan, Martin Georg Zahnert, Blazej Marek Czuprynski, Joao Antonio Pereira Faro, Christoph Tobler, Omid Ghasemalizadeh
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Publication number: 20250067271Abstract: A ventilation system comprises a ventilation fan with a lamp for installing to a ceiling having an installation opening. The ventilation fan comprises a housing, a fan module, a power box, a junction box, a lamp module and a support. The housing has a first opening and an air outlet. The fan module comprises an inlet opening and an outlet opening. The outlet opening communicates with the air outlet. The power box has a first circuit board. The lamp module and the housing are located at opposite sides of the installation opening. The junction box is electrically connected to the first circuit board and the lamp module. The impeller comprises a hub, and a ratio of a height of the hub to a height of the housing is less than 0.5. A ratio of a height of the impeller to a height of the housing is greater than 0.65.Type: ApplicationFiled: November 12, 2024Publication date: February 27, 2025Inventors: YU-HSIANG HUANG, YUAN-CHUAN LIU, CHIH-HUA LIN
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Publication number: 20250056823Abstract: A method includes forming isolation regions extending into a semiconductor substrate. A semiconductor strip is between the isolation regions. The method further includes recessing the isolation regions so that a top portion of the semiconductor strip protrudes higher than top surfaces of the isolation regions to form a semiconductor fin, measuring a fin width of the semiconductor fin, generating an etch recipe based on the fin width, and performing a thinning process on the semiconductor fin using the etching recipe.Type: ApplicationFiled: October 30, 2024Publication date: February 13, 2025Inventors: Tsu-Hui Su, Chun-Hsiang Fan, Yu-Wen Wang, Ming-Hsi Yeh, Kuo-Bin Huang
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Publication number: 20250056746Abstract: An electronic device including a device housing, a cable, a cable positioning structure, and a housing restriction structure is provided. The device housing includes a through hole. The through hole includes a central region, a first channel region, and a second channel region. The cable passes through the device housing. The cable positioning structure is disposed on the cable. The cable positioning structure includes a first protrusion and a second protrusion. The cable positioning structure is adapted to be rotated between a first orientation and a second orientation relative to the device housing. The housing restriction structure is disposed on the device housing. The housing restriction structure includes a first restrain member and a first stopper. In a positioned state, the cable positioning structure is in the second orientation. The first restrain member and the first stopper restrict the cable positioning structure.Type: ApplicationFiled: July 18, 2024Publication date: February 13, 2025Inventors: Che-Cheng WU, Chen-Wei HUANG, Yu-Hsiang LIN, Ya-Hui LO
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Publication number: 20250054775Abstract: A method includes forming a package, which includes forming a plurality of redistribution lines over a carrier, and forming a thermal dissipation block over the carrier. The plurality of redistribution lines and the thermal dissipation block are formed by common processes. The thermal dissipation block has a first metal density, and the plurality of redistribution lines have a second metal density smaller than the first metal density. The method further includes forming a metal post over the carrier, placing a device die directly over the thermal dissipation block, and encapsulating the device die and the metal post in an encapsulant. The package is then de-bonded from the carrier.Type: ApplicationFiled: October 31, 2024Publication date: February 13, 2025Inventors: Ching-Yi Lin, Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Jyh Chwen Frank Lee, Shuo-Mao Chen
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Publication number: 20250040213Abstract: A semiconductor structure includes a source/drain feature in the semiconductor layer. The semiconductor structure includes a dielectric layer over the source/drain feature. The semiconductor structure includes a silicide layer over the source/drain feature. The semiconductor structure includes a barrier layer over the silicide layer. The semiconductor structure includes a seed layer over the barrier layer. The semiconductor structure includes a metal layer between a sidewall of the seed layer and a sidewall of the dielectric layer, a sidewall of each of the silicide layer, the barrier layer, and the metal layer directly contacting the sidewall of the dielectric layer. The semiconductor structure includes a source/drain contact over the seed layer.Type: ApplicationFiled: July 27, 2023Publication date: January 30, 2025Applicant: Taiwan Semiconductor Manufacturing Company Ltd.Inventors: Yi-Hsiang Chao, Peng-Hao Hsu, Yu-Shiuan Wang, Chi-Yuan Chen, Yu-Hsiang Liao, Chun-Hsien Huang, Hung-Chang Hsu, Wei-Jung Lin, Chih-Wei Chang, Ming-Hsing Tsai
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Patent number: 12207449Abstract: A cooling apparatus is provided. An external cooling fluid flows into an external inlet opening from an external inlet pipe and passes through a heat exchanger to flow out of an external outlet opening to an external outlet pipe. An internal cooling fluid flows into an internal inlet pipe from the server and flows into an internal inlet opening from the internal inlet pipe and passes through the heat exchanger for heat exchange with the external cooling fluid to flow out of an internal outlet opening to an internal outlet pipe. A hot-swap pump has a pump main body, an inlet anti-leakage pipe, an outlet anti-leakage pipe and a hot-swap connector. The inlet anti-leakage pipe includes an inlet connector and an inlet anti-leakage valve. The outlet anti-leakage pipe includes an outlet connector and an outlet anti-leakage valve. The hot-swap connector is electrically connected to the pump main body.Type: GrantFiled: April 5, 2022Date of Patent: January 21, 2025Assignee: Super Micro Computer, Inc.Inventors: Chia-Wei Chen, Te-Chang Lin, Yueh-Ming Liu, Yu-Hsiang Huang, Ya-Lin Liu, Chi-Che Chang
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Patent number: 12185497Abstract: A fluid immersion cooling system has a fluid tank containing a hydrocarbon dielectric fluid as a coolant fluid. One or more components of an electronic system is immersed in the coolant fluid. A gas cylinder contains a non-flammable, compressed filling gas. The temperature of the coolant fluid is monitored during operation of the electronic system. The filling gas is released from the gas cylinder and into the fluid tank when the temperature of the coolant fluid rises to a trigger temperature that is set based on the flash point of the coolant fluid. The filling gas covers a surface of the coolant fluid to block oxygen from interacting with vapors of the coolant fluid to prevent combustion.Type: GrantFiled: August 19, 2022Date of Patent: December 31, 2024Assignee: Super Micro Computer, Inc.Inventors: Yueh-Ming Liu, Hsiao-Chung Chen, Chia-Wei Chen, Yu-Hsiang Huang, Chia-Che Chang, Hua-Kai Tong, Tan-Hsin Chang, Yu-Chuan Chang, Ming-Yu Chen, Yu-Yen Hsiung, Kun-Chieh Liao
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Publication number: 20240314976Abstract: A fluid immersion cooling system includes a fluid tank that contains a layer of a dual-phase coolant fluid and one or more layers of single-phase coolant fluids. The dual-phase and single-phase coolant fluids are immiscible, with the dual-phase coolant fluid having a lower boiling point and higher density than a single-phase coolant fluid. A substrate of an electronic system is submerged in the tank such that high heat-generating components are immersed at least in the layer of the dual-phase coolant fluid. Heat from the components is dissipated to the dual-phase coolant fluid to generate vapor bubbles of the dual-phase coolant fluid. The vapor bubbles rise to a layer of a single-phase coolant fluid that is above the layer of the dual-phase coolant fluid. The vapor bubbles condense to droplets of the dual-phase coolant fluid. The droplets fall down into the layer of the dual-phase coolant fluid.Type: ApplicationFiled: May 22, 2024Publication date: September 19, 2024Inventors: Yueh Ming LIU, Yu Hsiang HUANG, Yu Chuan CHANG, Tan Hsin CHANG, Hsiao Chung CHEN, Chia-Wei CHEN, Chih-Ta CHEN, Cheng-Hung LIN, Ming-Te HSU
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Patent number: 12039093Abstract: An encrypted hard disk device is provided, including a near-field communication (NFC) sensing module, a processor, a storage unit, and a power switch. The NFC sensing module is configured to read a user identification (UID) of at least one sensor element. The processor is electrically connected to the NFC sensing module and the storage unit. The processor receives the UID and generates a control signal when the UID is approved. The power switch is electrically connected to the processor and the storage unit and maintains a conducting state according to the control signal and supplies power to the storage unit for accessing the storage unit.Type: GrantFiled: January 3, 2022Date of Patent: July 16, 2024Assignee: ASUSTEK COMPUTER INC.Inventors: Cheng-Yu Wang, Shao-Kai Liu, Yu-Hsiang Huang, Bo-Hua Yang
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Patent number: 12029012Abstract: A fluid immersion cooling system includes a fluid tank that contains a layer of a dual-phase coolant fluid and one or more layers of single-phase coolant fluids. The dual-phase and single-phase coolant fluids are immiscible, with the dual-phase coolant fluid having a lower boiling point and higher density than a single-phase coolant fluid. A substrate of an electronic system is submerged in the tank such that high heat-generating components are immersed at least in the layer of the dual-phase coolant fluid. Heat from the components is dissipated to the dual-phase coolant fluid to generate vapor bubbles of the dual-phase coolant fluid. The vapor bubbles rise to a layer of a single-phase coolant fluid that is above the layer of the dual-phase coolant fluid. The vapor bubbles condense to droplets of the dual-phase coolant fluid. The droplets fall down into the layer of the dual-phase coolant fluid.Type: GrantFiled: July 23, 2021Date of Patent: July 2, 2024Assignee: Super Micro Computer, Inc.Inventors: Yueh Ming Liu, Yu Hsiang Huang, Yu Chuan Chang, Tan Hsin Chang, Hsiao Chung Chen, Chia-Wei Chen, Chih-Ta Chen, Cheng-Hung Lin, Ming-Te Hsu
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Publication number: 20240185510Abstract: Examples of the disclosure describe systems and methods for presenting virtual content on a wearable head device. In some embodiments, a state of a wearable head device is determined by minimizing a total error based on a reduced weight associated with a reprojection error. A view reflecting the determined state of the wearable head device is presented via a display of the wearable head device. In some embodiments, a wearable head device calculates a preintegration term based on the image data received via a sensor of the wearable head device and the inertial data received via a first IMU and a second IMU of the wearable head device. The wearable head device estimates a position of the device based on the preintegration term, and the wearable head device presents the virtual content based on the position of the device.Type: ApplicationFiled: February 12, 2024Publication date: June 6, 2024Inventors: Yu-Hsiang HUANG, Evan Gregory LEVINE, Igor NAPOLSKIKH, Dominik Michael KASPER, Manel Quim SANCHEZ NICUESA, Sergiu SIMA, Benjamin LANGMANN, Ashwin SWAMINATHAN, Martin Georg ZAHNERT, Blazej Marek CZUPRYNSKI, Joao Antonio Pereira FARO, Christoph TOBLER, Omid GHASEMALIZADEH
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Patent number: 11935180Abstract: Examples of the disclosure describe systems and methods for presenting virtual content on a wearable head device. In some embodiments, a state of a wearable head device is determined by minimizing a total error based on a reduced weight associated with a reprojection error. A view reflecting the determined state of the wearable head device is presented via a display of the wearable head device. In some embodiments, a wearable head device calculates a preintegration term based on the image data received via a sensor of the wearable head device and the inertial data received via a first IMU and a second IMU of the wearable head device. The wearable head device estimates a position of the device based on the preintegration term, and the wearable head device presents the virtual content based on the position of the device.Type: GrantFiled: April 7, 2022Date of Patent: March 19, 2024Assignee: Magic Leap, Inc.Inventors: Yu-Hsiang Huang, Evan Gregory Levine, Igor Napolskikh, Dominik Michael Kasper, Manel Quim Sanchez Nicuesa, Sergiu Sima, Benjamin Langmann, Ashwin Swaminathan, Martin Georg Zahnert, Blazej Marek Czuprynski, Joao Antonio Pereira Faro, Christoph Tobler, Omid Ghasemalizadeh
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Patent number: 11920778Abstract: A ventilation fan includes a housing having an opening, a grille structure positioned to cover the opening, a fan module provided in the housing and a function module. The grille structure includes a base defining an outlet, and a grille support spaced apart from the base and connected by the connecting columns A radial inlet is formed between the base and the grille support is in communication with the outlet. The base includes a holder having a holding opening axially downward and faced away from the housing. The function module is disposed within the holder through the holding opening.Type: GrantFiled: September 30, 2022Date of Patent: March 5, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Yu-Hsiang Huang, Yen-Lin Chen, Chih-Hua Lin
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Publication number: 20240064936Abstract: A fluid immersion cooling system has a fluid tank containing a hydrocarbon dielectric fluid as a coolant fluid. One or more components of an electronic system is immersed in the coolant fluid. A gas cylinder contains a non-flammable, compressed filling gas. The temperature of the coolant fluid is monitored during operation of the electronic system. The filling gas is released from the gas cylinder and into the fluid tank when the temperature of the coolant fluid rises to a trigger temperature that is set based on the flash point of the coolant fluid. The filling gas covers a surface of the coolant fluid to block oxygen from interacting with vapors of the coolant fluid to prevent combustion.Type: ApplicationFiled: August 19, 2022Publication date: February 22, 2024Inventors: Yueh-Ming LIU, Hsiao-Chung CHEN, Chia-Wei CHEN, Yu-Hsiang HUANG, Chia-Che CHANG, Hua-Kai TONG, Tan-Hsin CHANG, Yu-Chuan CHANG, Ming-Yu CHEN, Yu-Yen HSIUNG, Kun-Chieh LIAO
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Publication number: 20230377197Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for calibrating an augmented reality device using camera and inertial measurement unit data. In some implementations, a bundle adjustment process jointly optimizes or estimates states of the augmented reality device. The process can use, as input, visual and inertial measurements as well as factory-calibrated sensor extrinsic parameters. The process performs bundle adjustment and uses non-linear optimization of estimated states constrained by the measurements and the factory calibrated extrinsic parameters. The process can jointly optimize inertial constraints, IMU calibration, and camera calibrations. Output of the process can include most likely estimated states, such as data for a 3D map of an environment, a trajectory of the device, and/or updated extrinsic parameters of the visual and inertial sensors (e.g., cameras and IMUs).Type: ApplicationFiled: September 15, 2021Publication date: November 23, 2023Inventors: Igor NAPOLSKIKH, Ankur GUPTA, Yu-Hsiang HUANG, Mohamed SOUIAI, Etienne Gregoire GROSSMAN
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Patent number: 11814465Abstract: An organic-inorganic hybrid material is disclosure. The organic-inorganic hybrid material contains 5˜50 wt % of inorganic compounds and has a characteristic peak at 1050±50 cm?1 in FTIR spectrum. Furthermore, the invention also provides a fabricating process of the organic-inorganic hybrid material as well as its starting material “isocyanates”. In particular, the isocyanates are prepared from carbonate containing compounds and amines.Type: GrantFiled: August 23, 2022Date of Patent: November 14, 2023Assignee: CHANDA CHEMICAL CORP.Inventors: Sheng-hong A. Dai, Chien-Hsin Wu, Ying-Chi Huang, Yu-Hsiang Huang, Shih-Chieh Yeh, Ru-Jong Jeng, Jau-Hsiang Yang
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Patent number: D1068055Type: GrantFiled: September 7, 2021Date of Patent: March 25, 2025Assignee: Delta Electronics, Inc.Inventors: Ko-Neng Huang, Yu-Hsiang Huang, Yen-Lin Chen