Patents by Inventor Yu Hsien CHUANG

Yu Hsien CHUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED DEVICE AND FABRICATION PROCESS THEREOF
    Publication number: 20140217613
    Abstract: An integrated device includes a die attach pad, a main die, a stacked die, and a mold compound. The main die has a first (e.g., bottom) surface attached to the die attach pad and has a second (e.g., top) surface. The stacked die is attached to the second surface of the main die using, for example, an adhesive film. The main die and the stacked die include silicon crystal. The mold compound encapsulates the die attach pad, the main die, and the stacked die.
    Type: Application
    Filed: February 1, 2013
    Publication date: August 7, 2014
    Applicant: O2MICRO INC.
    Inventors: Marian UDREA-SPENEA, Viorel Alexandru MARINESCU, Yu Hsien CHUANG