Abstract: In a method of manufacturing a semiconductor device, a fin structure is formed by patterning a semiconductor layer, and an annealing operation is performed on the fin structure. In the patterning of the semiconductor layer, a damaged area is formed on a sidewall of the fin structure, and the annealing operation eliminates the damaged area.

Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a substrate, a deep trench capacitor (DTC) having a portion within the substrate, and an interconnect structure over the DTC and the substrate. The interconnect structure includes a seal ring structure in electrical contact with the substrate, a first conductive via in electrical contact with the DTC, and a first conductive line electrically coupling the seal ring structure to the first conductive via.

Abstract: A method of manufacturing a semiconductor device includes the following steps. A photoresist layer is formed over a material layer on a substrate. The photoresist layer has a composition including a solvent and a first photo-active compound dissolved in the solvent. The first photo-active compound is represented by the following formula (Al) or formula (A2): Zr12O8(OH)14(RCO2)18??Formula (A1); or Hf6O4(OH)6(RCO2)10??Formula (A2). R in the formula (A1) and R in the formula (A2) each include one of the following formulae (1) to (6): The photoresist layer is patterned. The material layer is etched using the photoresist layer as an etch mask.

Abstract: A fin field effect transistor (FinFET) device structure is provided. The FinFET device structure includes a plurality of fin structures above a substrate, an isolation structure over the substrate and between the fin structures, and a gate structure formed over the fin structure. The FinFET device structure includes a source/drain (S/D) structure over the fin structure, and the S/D structure is adjacent to the gate structure. The FinFET device structure also includes a metal silicide layer over the S/D structure, and the metal silicide layer is in contact with the isolation structure.

Abstract: An electrical connector assembly, a female connector, and a male connector are provided. The electrical connector assembly includes a female connector and a male connector detachably inserted into the female connector. The female connector includes a housing and a plurality of transmission wafers inserted into the housing. Each of the transmission wafers includes an insulating frame and a plurality of grounding terminals fixed to the insulating frame. The male connector includes a carrier and a plurality of shielding terminals fixed to the carrier. Two side walls of each of the shielding terminals are respectively abutted against and electrically connected to two of the grounding terminals each having at least one first contacting portion.

Abstract: A female connector and a transmission wafer are provided. The female connector includes a housing and a plurality of transmission wafers inserted into the housing. Each of the transmission wafers includes an insulating frame, a plurality of grounding terminals fixed to the insulating frame, and a first shielding member and a second shielding member respectively disposed on two opposite sides of the insulating frame. In each of the transmission wafers, the second shielding member is disposed on a front end portion of the insulating frame, and the first and second shielding members are electrically connected to the grounding terminals so as to be electrically connected to each other through the grounding terminals. The second shielding member of one of any two adjacent transmission wafers is abutted against and electrically connected to the first shielding member of the other one of the any two adjacent transmission wafers.

Abstract: An electrical connector assembly, a female connector, and a male connector are provided. The electrical connector assembly includes a female connector and a male connector detachably inserted into the female connector. The female connector includes a housing and a plurality of transmission wafers inserted into the housing. Each of the transmission wafers includes an insulating frame and a plurality of grounding terminals fixed to the insulating frame. The male connector includes a carrier and a plurality of shielding terminals fixed to the carrier. Two side walls of each of the shielding terminals are respectively abutted against and electrically connected to two of the grounding terminals each having at least one first contacting portion.

Abstract: A female connector and a transmission wafer are provided. The female connector includes a housing and a plurality of transmission wafers inserted into the housing. Each of the transmission wafers includes an insulating frame, a plurality of grounding terminals fixed to the insulating frame, and a first shielding member and a second shielding member respectively disposed on two opposite sides of the insulating frame. In each of the transmission wafers, the second shielding member is disposed on a front end portion of the insulating frame, and the first and second shielding members are electrically connected to the grounding terminals so as to be electrically connected to each other through the grounding terminals. The second shielding member of one of any two adjacent transmission wafers is abutted against and electrically connected to the first shielding member of the other one of the any two adjacent transmission wafers.

Abstract: A transmission wafer includes an insulating frame, a plurality of signal terminals each partially fixed in the insulating frame, and a shielding member fixed on the insulating frame. The insulating frame includes a front end portion and a bottom end portion both substantially perpendicular to each other, and the bottom end portion has a plurality of retaining structures. Each of the signal terminals includes a mounting segment protruding from the bottom end portion, and the shielding member includes a plurality of mounting portions each partially protruding from the bottom end portion. The mounting portions and the mounting segments are arranged in a row, and the mounting portions are respectively retained by the retaining structures of the insulating frame.

Abstract: A transmission wafer includes an insulating frame, a plurality of signal terminals each partially fixed in the insulating frame, and a shielding member fixed on the insulating frame. The insulating frame includes a front end portion and a bottom end portion both substantially perpendicular to each other, and the bottom end portion has a plurality of retaining structures. Each of the signal terminals includes a mounting segment protruding from the bottom end portion, and the shielding member includes a plurality of mounting portions each partially protruding from the bottom end portion. The mounting portions and the mounting segments are arranged in a row, and the mounting portions are respectively retained by the retaining structures of the insulating frame.

Abstract: A carrier module of a cable connector includes a circuit board and a grounding bar disposed on the circuit board. The circuit board includes a first insulating layer, a second insulating layer, and a grounding layer arranged between the first and second insulating layers. The circuit board has a hole formed on a surface thereof and a conductive extension disposed within the hole, and the conductive extension is connected to the grounding layer. The grounding bar includes a base portion and a conductive portion connected to the base portion. The conductive portion is inserted into the hole, and connected to the conductive extension, thereby electrically connecting the grounding bar and the grounding layer of the circuit board. Thus, the carrier module of the instant disclosure is provided with the grounding bar having well grounding performance which is firmly fixed on the circuit board.

Abstract: A carrier module of a cable connector includes a circuit board and a connecting clip clamping the circuit board. The circuit board has a first surface and a second surface. The connecting clip has a clamping portion and a plurality of positioning arms. The clamping portion has a connecting sheet and two clamping sheets curvedly extended from the connecting sheet. The clamping sheets are respectively abutted against the first and second surfaces. The positioning arms are respectively connected to the clamping sheets and respectively arranged at two opposite sides of the clamping portion. The positioning arms are respectively configured to fix a plurality of cables disposed on the clamping sheets. Thus, the carrier module of the instant disclosure provides a positioning effect for the cables by the connecting clip fixed firmly on the circuit board with good common grounding performance. Besides, the instant disclosure also provides a cable connector.

Abstract: A carrier module of a cable connector includes a circuit board and a grounding bar disposed on the circuit board. The circuit board includes a first insulating layer, a second insulating layer, and a grounding layer arranged between the first and second insulating layers. The circuit board has a hole formed on a surface thereof and a conductive extension disposed within the hole, and the conductive extension is connected to the grounding layer. The grounding bar includes a base portion and a conductive portion connected to the base portion. The conductive portion is inserted into the hole, and connected to the conductive extension, thereby electrically connecting the grounding bar and the grounding layer of the circuit board. Thus, the carrier module of the instant disclosure is provided with the grounding bar having well grounding performance which is firmly fixed on the circuit board.

Abstract: A carrier module of a cable connector includes a circuit board and a connecting clip clamping the circuit board. The circuit board has a first surface and a second surface. The connecting clip has a clamping portion and a plurality of positioning arms. The clamping portion has a connecting sheet and two clamping sheets curvedly extended from the connecting sheet. The clamping sheets are respectively abutted against the first and second surfaces. The positioning arms are respectively connected to the clamping sheets and respectively arranged at two opposite sides of the clamping portion. The positioning arms are respectively configured to fix a plurality of cables disposed on the clamping sheets. Thus, the carrier module of the instant disclosure provides a positioning effect for the cables by the connecting clip fixed firmly on the circuit board with good common grounding performance. Besides, the instant disclosure also provides a cable connector.

Abstract: An electrical connector includes a housing and a plurality of terminal wafers. The housing is formed with a plurality of terminal slots along a traverse direction. The terminal wafers are contiguous to each other and retained in the housing. Each terminal wafer has a first terminal, a second terminal and a packaging body. The first terminal has a first contacting section, a first soldering portion and a first embedded section. The second terminal has a second contacting section, a second soldering portion and a second embedded section. The first and second contacting sections are extended along a plugging direction into one corresponding terminal slot. The packaging body wraps the first and second embedded sections. A curve contour of the first embedded section is corresponded to a curve contour of the second embedded section, so that an attachment relationship is configured with substantial identical distance therebetween.

Abstract: An electrical connector includes a housing and a plurality of terminal wafers. The housing is formed with a plurality of terminal slots along a traverse direction. The terminal wafers are contiguous to each other and retained in the housing. Each terminal wafer has a first terminal, a second terminal and a packaging body. The first terminal has a first contacting section, a first soldering portion and a first embedded section. The second terminal has a second contacting section, a second soldering portion and a second embedded section. The first and second contacting sections are extended along a plugging direction into one corresponding terminal slot. The packaging body wraps the first and second embedded sections. A curve contour of the first embedded section is corresponded to a curve contour of the second embedded section, so that an attachment relationship is configured with substantial identical distance therebetween.