Abstract: Methods and systems for managing the operation of data processing systems are disclosed. A data processing system may include a computing device that may provide computer implemented services. To provide the computer implemented services, hardware components of the data processing system may need to operate in predetermined manners. To manage the operation of the hardware components, the data processing system may cool them when their temperatures fall outside of thermal operating ranges. To facilitate cooling, fans may be densely packed and arranged in a manner the occupies a majority of the space in a stack up. At least one side of the fans may be exposed and may not be covered.

Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.

Abstract: Methods, systems, and devices for managing the operation of data processing systems are disclosed. A data processing system may include a computing device that may provide computer-implemented services. To provide the computer-implemented services, hardware components of the data processing system may need to operate within certain thermal dissipation requirements. To regulate the temperature of the hardware components, a fan may circulate air through the data processing system when the temperatures fall outside the thermal dissipation requirements. To regulate the temperature of the hardware components more efficiently, higher air flow rates may be desired. To increase air flow rates, a three-dimensional ventilation port may be implemented to de-constrict air flow when air enters or exits the data processing system.

Abstract: Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, the quantity of hardware resources available for providing the computer implemented services may be modified. The quantity of hardware resources may be modified by adding removable cards to a host system. The host system may, while the added removable cards are cold, selectively warm the removable cards through conduction heating to retain their temperatures within operating temperature ranges.

Abstract: A defect-reducing coating method is disclosed, which is characterized by making the coating surface of a sample face the bottom of the coating chamber, so that the sticking particles on side walls of the coating chamber will not fall on the coating surface of the sample during the coating process, thereby a smooth coating layer can be formed on the coating surface of the sample after the coating process is finished.

Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.

Abstract: An electrical connector includes a metallic shell defining a mating cavity opening forwards, a terminal module assembly received in the metallic shell, and a shielding plate being located between an upper surface and a lower surface of the terminal module assembly. The terminal module assembly defines a front region exposed in the mating cavity to function as a mating tongue. The terminal module assembly defines an insulator associated with a plurality of contacts with corresponding contacting sections exposed upon opposite upper and lower faces of the mating tongue, the contacts are categorized with differential pairs and grounding contacts. The shielding plate defines a main plate and grounding fingers split from the main plate to directly touch with corresponding grounding contacts. The shielding plate is embedded with the terminal module assembly and the grounding fingers of the shielding plate are fixed with the insulator of the terminal assembly.

Abstract: An electrical connector includes an insulative housing, a plurality of first contacts arranged in a side-by-side manner, and a resilient contact retained in the housing. The housing defines a mating face, a blocking face and a mating cavity disposed between the mating face and the blocking face. Each first contact defines a first contacting portion projecting into the mating cavity. The resilient contact defines a blocking piece abutting against the blocking face, a retaining leg extending out of the mating cavity, and latching arms extending into the mating cavity from the blocking piece. The latching arms can be easily released from a mating connector so as to realize a better retaining effect.

Abstract: An electrical connector for mating with a plug and mounting to a printed circuit board, includes an insulative housing defining a rear base and a front mating tongue, two rows of terminals received in the insulating housing and a shielding plate interposed between said two rows of the terminals. The terminals include contacting portions exposed upon opposite surfaces of the front mating tongue and board-connecting legs extending out of the rear base for mounting to the printed circuit board. The terminals are categorized with differential pairs of signal and grounding terminals mixed up with one another for coupling to the plug. The shielding plate includes at least one grounding finger split therefrom and a grounding leg for mounting to the printed circuit board. Each grounding finger is disposed between two adjacent differential pairs and parallel to the contacting portions of said terminals.

Abstract: An electrical connector for mating with a plug and mounting to a printed circuit board, includes an insulative housing defining a rear base and a front mating tongue, two rows of terminals received in the insulating housing and a shielding plate interposed between said two rows of the terminals. The terminals include contacting portions exposed upon opposite surfaces of the front mating tongue and board-connecting legs extending out of the rear base for mounting to the printed circuit board. The terminals are categorized with differential pairs of signal and grounding terminals mixed up with one another for coupling to the plug. The shielding plate includes at least one grounding finger split therefrom and a grounding leg for mounting to the printed circuit board. Each grounding finger is disposed between two adjacent differential pairs and parallel to the contacting portions of said terminals.

Abstract: An electrical connector includes a metallic shell defining a mating cavity opening forwards, a terminal module assembly received in the metallic shell, and a shielding plate being located between an upper surface and a lower surface of the terminal module assembly. The terminal module assembly defines a front region exposed in the mating cavity to function as a mating tongue. The terminal module assembly defines an insulator associated with a plurality of contacts with corresponding contacting sections exposed upon opposite upper and lower faces of the mating tongue, the contacts are categorized with differential pairs and grounding contacts. The shielding plate defines a main plate and grounding fingers split from the main plate to directly touch with corresponding grounding contacts. The shielding plate is embedded with the terminal module assembly and the grounding fingers of the shielding plate are fixed with the insulator of the terminal assembly.

Abstract: An electrical connector includes an insulative housing, a plurality of first contacts arranged in a side-by-side manner, and a resilient contact retained in the housing. The housing defines a mating face, a blocking face and a mating cavity disposed between the mating face and the blocking face. Each first contact defines a first contacting portion projecting into the mating cavity. The resilient contact defines a blocking piece abutting against the blocking face, a retaining leg extending out of the mating cavity, and latching arms extending into the mating cavity from the blocking piece. The latching arms can be easily released from a mating connector so as to realize a better retaining effect.