Patents by Inventor Yu-Hsuan Liu

Yu-Hsuan Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240122856
    Abstract: A method of preparing polylactic acid (PLA) microsphere and polylactic-co-glycolic acid (PLGA) microsphere is provided, including the following steps. A first solution is provided, including polylactic acid or polylactic-co-glycolic acid and an organic solvent. A second solution is provided, including polyvinyl alcohol, sodium carboxymethyl cellulose and an aqueous solution. The first solution is added to the second solution and, at the same time, the second solution is agitated until polylactic acid is solidified to form a plurality of polylactic acid microspheres, or until polylactic-co-glycolic acid is solidified to form a plurality of polylactic-co-glycolic acid microspheres. The polylactic acid microspheres or polylactic-co-glycolic acid microspheres are collected.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Inventors: Ming-Thau SHEU, Yu-Ying HSU, Yu-De SU, Yu-Hsuan LIU, Pu-Sheng WEI
  • Patent number: 11960899
    Abstract: An information handling system includes multiple dual in-line memory modules (DIMMs) and a basic input/output system (BIOS). The DIMMs form a memory system of the information handling system. The BIOS begins a system boot of the information handling system, and performs a first memory reference code training. Based on the first memory reference code training, the BIOS discovers a bad DIMM of the DIMMs, and stores information associated with the bad DIMM. The BIOS reboots the information handling system. During the reboot, the BIOS retrieves the information associated with the bad DIMM. The BIOS disables a slot associated with the bad DIMM. In response to the slot being disabled, the BIOS performs a second memory reference code training. Based on the second memory reference code training, the BIOS downgrades the memory system to a closest possible DIMM population.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: April 16, 2024
    Assignee: Dell Products L.P.
    Inventors: Ching-Lung Chao, Hsin-Chieh Wang, Wei G. Liu, Yu-Hsuan Chou
  • Patent number: 11943608
    Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device is arranged to operably generate and transmit target Bluetooth packets containing an auto-pair request to the Bluetooth host device. The second member device is arranged to operably generate a resolvable set identifier corresponding to the second member device according to a device set identification information. The Bluetooth host device is arranged to operably identify the first member device as a first privileged device according to the auto-pair request in the target Bluetooth packets, and to operably transmit a first privileged pairing notice to the first member device and to operably generate a first cypher key. The first member device further generates a second cypher key corresponding to the first cypher key after receiving the first privileged pairing notice.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: March 26, 2024
    Assignee: Realtek Semiconductor Corp.
    Inventors: Yu Hsuan Liu, Yung Chieh Lin, Po Sheng Chiu
  • Patent number: 11943609
    Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The first member device generates a first resolvable set identifier corresponding to the first member device, and generates and transmits target Bluetooth packets containing the first resolvable set identifier to the Bluetooth host device. The second member device generates a resolvable set identifier corresponding to the second member device according to a device set identification information. The Bluetooth host device identifies the first member device as a first privileged device according to the position of the first resolvable set identifier, and transmits a first privileged pairing notice to the first member device and generates a first cypher key. The first member device further generates a second cypher key corresponding to the first cypher key after receiving the first privileged pairing notice.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: March 26, 2024
    Assignee: Realtek Semiconductor Corp.
    Inventors: Yu Hsuan Liu, Yung Chieh Lin, Po Sheng Chiu
  • Publication number: 20240088307
    Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Patent number: 11929318
    Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Patent number: 11924631
    Abstract: A Bluetooth communication system includes: a Bluetooth host device; and a Bluetooth device set which including a first member device and a second member device. The Bluetooth host device controls a display device to display a candidate device list, and to display a single device item in the candidate device list to represent the Bluetooth device set, but does not simultaneously display two device items in the candidate device list to represent the first member device and the second member device. The Bluetooth host device generates a first cypher key according to an instruction from the first member device and a device information of the first member device after receiving a selection command. The first member device establishes a connection with the Bluetooth host device, and generates a second cypher key corresponding to the first cypher key according to a device information of the Bluetooth host device.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: March 5, 2024
    Assignee: Realtek Semiconductor Corp.
    Inventors: Yu Hsuan Liu, Yung Chieh Lin, Po Sheng Chiu
  • Publication number: 20240067746
    Abstract: Disclosed herein are humanized antibodies, antigen-binding fragments thereof, and antibody conjugates, that are capable of specifically binding to certain biantennary Lewis antigens, which antigens are expressed in a variety of cancers. The presently disclosed antibodies are useful to target antigen-expressing cells for treatment or detection of disease, including various cancers. Also provided are polynucleotides, vectors, and host cells for producing the disclosed antibodies and antigen-binding fragments thereof. Pharmaceutical compositions, methods of treatment and detection, and uses of the antibodies, antigen-binding fragments, antibody conjugates, and compositions are also provided.
    Type: Application
    Filed: February 28, 2023
    Publication date: February 29, 2024
    Inventors: Tong-Hsuan CHANG, Mei-Chun YANG, Liahng-Yirn LIU, Jerry TING, Shu-Yen CHANG, Yen-Ying CHEN, Yu-Yu LIN, Shu-Lun TANG
  • Patent number: 11883536
    Abstract: A method of preparing polylactic acid (PLA) microsphere and polylactic-co-glycolic acid (PLGA) microsphere is provided, including the following steps. A first solution is provided, including polylactic acid or polylactic-co-glycolic acid and an organic solvent. A second solution is provided, including polyvinyl alcohol, sodium carboxymethyl cellulose and an aqueous solution. The first solution is added to the second solution and, at the same time, the second solution is agitated until polylactic acid is solidified to form a plurality of polylactic acid microspheres, or until polylactic-co-glycolic acid is solidified to form a plurality of polylactic-co-glycolic acid microspheres. The polylactic acid microspheres or polylactic-co-glycolic acid microspheres are collected.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: January 30, 2024
    Assignees: TAIPEI MEDICAL UNIVERSITY, PANION & BF BIOTECH INC.
    Inventors: Ming-Thau Sheu, Yu-Ying Hsu, Yu-De Su, Yu-Hsuan Liu, Pu-Sheng Wei
  • Publication number: 20230370772
    Abstract: A Bluetooth audio broadcasting system includes: an audio broadcasting device, a first Bluetooth member device, and a second Bluetooth member device. The audio broadcasting device broadcasts BLE audio packets and transmits a predetermined volume instruction to the first Bluetooth member device and the second Bluetooth member device before broadcasting the BLE audio packets. The first Bluetooth member device parses the BLE audio packets to acquire a predetermined audio data, controls a first audio playback circuit to playback the predetermined audio data, and configures an audio volume of the first audio playback circuit in advance according to the predetermined volume instruction. The second Bluetooth member device parses the BLE audio packets to acquire the predetermined audio data, controls a second audio playback circuit to playback the predetermined audio data, and configures an audio volume of the second audio playback circuit in advance according to the predetermined volume instruction.
    Type: Application
    Filed: July 26, 2023
    Publication date: November 16, 2023
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yu Hsuan LIU, Yung Chieh LIN, Qing GU, Bi WEI, Yi-Cheng CHEN
  • Publication number: 20230369518
    Abstract: An optical sensing apparatus including: a substrate including a first material; an absorption region including a second material different from the first material; an amplification region formed in the substrate and configured to collect at least a portion of the photo-carriers from the absorption region and to amplify the portion of the photo-carriers; an interface-dopant region formed in the substrate between the absorption region and the amplification region; a buffer layer formed between the absorption region and the interface-dopant region; one or more field-control regions formed between the absorption region and the interface-dopant region and at least partially surrounding the buffer layer; and a buried-dopant region formed in the substrate and separated from the absorption region, where the buried-dopant region is configured to collect at least a portion of the amplified portion of the photo-carriers from the amplification region.
    Type: Application
    Filed: July 14, 2023
    Publication date: November 16, 2023
    Inventors: Yen-Cheng Lu, Yu-Hsuan Liu, Jung-Chin Chiang, Yun-Chung Na, Tsung-Ting Wu, Zheng-Shun Liu, Chou-Yun Hsu
  • Patent number: 11818555
    Abstract: A Bluetooth audio broadcasting system includes: an audio broadcasting device, a first Bluetooth member device, and a second Bluetooth member device. The audio broadcasting device broadcasts BLE audio packets and transmits a volume adjusting instruction to the first Bluetooth member device and the second Bluetooth member device after they receive the BLE audio packets. The first Bluetooth member device parses the BLE audio packets to acquire a predetermined audio data, controls a first audio playback circuit to playback the predetermined audio data, and adjusts an audio volume of the first audio playback circuit according to the volume adjusting instruction. The second Bluetooth member device parses the BLE audio packets to acquire the predetermined audio data, controls a second audio playback circuit to playback the predetermined audio data, and adjusts an audio volume of the second audio playback circuit according to the volume adjusting instruction.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: November 14, 2023
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yu Hsuan Liu, Yung Chieh Lin, Qing Gu, Bi Wei, Yi-Cheng Chen
  • Publication number: 20230280206
    Abstract: A photodetecting device is provided. The photodetecting device includes a silicon substrate, a germanium absorption region, and a plurality of microstructures. The silicon substrate includes a first surface and a second surface. The germanium absorption region is formed proximal to the first surface of the silicon substrate, and the germanium absorption region is configured to absorb photons and to generate photo-carriers. The plurality of microstructures are formed over the second surface of the silicon substrate, and the plurality of microstructures are configured to direct an optical signal towards the germanium absorption region. A system including an optical transmitter and an optical receiver is also provided.
    Type: Application
    Filed: May 11, 2023
    Publication date: September 7, 2023
    Inventors: YEN-CHENG LU, YUN-CHUNG NA, SHU-LU CHEN, CHIEN-YU CHEN, SZU-LIN CHENG, CHUNG-CHIH LIN, YU-HSUAN LIU
  • Patent number: 11709651
    Abstract: A Bluetooth audio broadcasting system includes: an audio broadcasting device, a first Bluetooth member device, and a second Bluetooth member device. The audio broadcasting device broadcasts BLE audio packets. After the first Bluetooth member device issues a volume adjusting request, the audio broadcasting device transmits a volume adjusting instruction to the first Bluetooth member device and the second Bluetooth member device. The first Bluetooth member device acquires a predetermined audio data from the BLE audio packets, controls a first audio playback circuit to playback the predetermined audio data, and adjusts an audio volume of the first audio playback circuit according to the volume adjusting instruction. The second Bluetooth member device acquires the predetermined audio data from the BLE audio packets, controls a second audio playback circuit to playback the predetermined audio data, and adjusts an audio volume of the second audio playback circuit according to the volume adjusting instruction.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: July 25, 2023
    Assignee: Realtek Semiconductor Corp.
    Inventors: Yu Hsuan Liu, Yung Chieh Lin, Qing Gu, Bi Wei, Yi-Cheng Chen
  • Patent number: 11709650
    Abstract: A Bluetooth audio broadcasting system includes: an audio broadcasting device arranged to operably broadcast BLE audio packets; a first Bluetooth member device arranged to operably parse the BLE audio packets to acquire a predetermined audio data and to operably control a first audio playback circuit to playback the predetermined audio data; and a second Bluetooth member device arranged to operably parse the BLE audio packets to acquire the predetermined audio data and to operably control a second audio playback circuit to playback the predetermined audio data. After receiving the BLE audio packets from the audio broadcasting device, the first Bluetooth member further adjusts an audio volume of the first audio playback circuit according to a volume adjusting instruction transmitted from another device other than the audio broadcasting device, and the second Bluetooth member further adjusts an audio volume of the second audio playback circuit according to the volume adjusting instruction.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: July 25, 2023
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yu Hsuan Liu, Yung Chieh Lin, Qing Gu, Bi Wei, Yi-Cheng Chen
  • Patent number: 11686614
    Abstract: A photodetecting device is provided. The photodetecting device includes a first photodetecting component including a substrate having a first absorption region configured to absorb photons having a first peak wavelength and to generate first photo-carriers, and a second photodetecting component including a second absorption region configured to absorb photons having a second peak wavelength different from the first peak wavelength and to generate second photo-carriers. The first photodetecting component further includes two first readout circuits and two first control circuits for the first photo-carriers and electrically coupled to the first absorption region.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: June 27, 2023
    Assignee: ARTILUX, INC.
    Inventors: Yen-Cheng Lu, Yun-Chung Na, Shu-Lu Chen, Chien-Yu Chen, Szu-Lin Cheng, Chung-Chih Lin, Yu-Hsuan Liu
  • Patent number: 11683025
    Abstract: A timing generator includes a first current source, a first switch, a second current source, a second switch, a third switch, a capacitor, a signal synthesizer, and a timing difference extractor. The first current source is for generating a first current according to the input voltage. The second current source is for generating a second current according to the input voltage. The first switch includes a control terminal for receiving a charging signal. The second switch includes a control terminal for receiving a timing difference signal. The third switch includes a control terminal for receiving a reset signal. The capacitor is coupled between a charging terminal and a ground terminal. The signal synthesizer is for generating a timing signal according to a charging voltage and a reference voltage. The timing difference extractor is for generating a timing difference signal according to the timing signal and a deformed timing signal.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: June 20, 2023
    Assignee: RICHTEK TECHNOLOGY CORP.
    Inventors: Yu-Hsuan Liu, Yung-Chun Chuang
  • Patent number: 11647332
    Abstract: A Bluetooth communication system is provided, which comprises a Bluetooth host device and a Bluetooth device set. The connections between the Bluetooth host device and the Bluetooth device set complies with the specification of Bluetooth Low Energy Audio technology. The Bluetooth device set comprises at least a first member device and a second member device. The first member device and the second member device may be configured in a first mode wherein uplink audio signal transmission is allowed, and the connections are carried out by isochronous streaming channels respectively. The first member device transmits captured voice data to the Bluetooth host device, while the second member device does not transmit. When an event is triggered, the first member device can notify the second member device through a third-part device, so that the first member device and the second member device can carry out subsequent voice input handover procedures.
    Type: Grant
    Filed: February 9, 2022
    Date of Patent: May 9, 2023
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Qing Gu, Bi Wei, Yu Hsuan Liu, Yi-Cheng Chen, Cheng Cai, Hung Chuan Chang
  • Publication number: 20230137317
    Abstract: A Bluetooth audio system includes: an audio playback device arranged to operably generate and transmit Bluetooth audio transmission parameters; a first audio generating device arranged to operably capture sound to generate first audio packets, to operably receive the Bluetooth audio transmission parameters without conducting Bluetooth pairing with the audio playback device, and to operably broadcast the first audio packets through BIS logical transport; and a second audio generating device arranged to operably capture sound to generate second audio packets, to operably receive the Bluetooth audio transmission parameters without conducting Bluetooth pairing with the audio playback device, and to operably broadcast the second audio packets through BIS logical transport.
    Type: Application
    Filed: October 24, 2022
    Publication date: May 4, 2023
    Applicant: Realtek Semiconductor Corp.
    Inventor: Yu Hsuan LIU
  • Publication number: 20230120504
    Abstract: A wafer includes a plurality of testing dies, a plurality of non-testing dies, and a dicing region. Each testing die includes: a first active area including one or more first active devices, and one or more first device pads electrically coupled to the one or more first active devices. Each non-testing die includes: a second active area including one or more second active devices, and one or more second device pads electrically coupled to the one or more second active devices. The dicing region includes one or more testing pads electrically coupled to the one or more first device pads. The one or more testing pads are arranged to receive one or more external probes for determining one or more characteristics of the one or more first active devices of the plurality of testing dies. The plurality of non-testing dies are electrically isolated from the dicing region.
    Type: Application
    Filed: September 12, 2022
    Publication date: April 20, 2023
    Inventors: Chien-Yu Chen, Yi-Chuan Teng, Yu-Hsuan Liu, Yun-Chung Na