Abstract: A virtual metrology method using a convolutional neural network (CNN) is provided. In this method, a dynamic time warping (DTW) algorithm is used to delete unsimilar sets of process data, and adjust the sets of process data to be of the same length, thereby enabling the CNN to be used for virtual metrology. A virtual metrology model of the embodiments of the present invention includes several CNN models and a conjecture model, in which plural inputs of the CNN model are sets of time sequence data of respective parameters, and plural outputs of the CNN models are inputs to the conjecture model.

Abstract: An oriented loading system is provided. The oriented loading system includes a substrate, a plurality of wells formed in the substrate, each well having a bottom and sidewalls, a plurality of particles loaded in the wells, wherein the particle comprises a core structure and an inner layer comprising magnetic material partially covering the core structure such that a part of the core structure uncovered by the inner layer is exposed, and a metal layer comprising magnetic material deposited partially in the sidewalls of the wells, wherein the inner layer is attracted by the metal layer such that the exposed core structure is oriented towards the bottom of the well or the inner layer is oriented towards the bottom of the well.

Abstract: A process for making a low-profile choke includes steps of: providing an etchable substrate; applying a masking layer on the etchable substrate; etching the etchable substrate through perforated patterns of the masking layer to permit the etchable substrate to be formed with an array of recessed patterns, each of which includes a core recess portion and a coil-patterned recess portion; filling a magnetic material and a conductive material respectively into the core recess portion and the coil-patterned recess portion of each of the recessed patterns to form in the etchable substrate a plurality of magnetic cores and a plurality of conductive coils; and slicing the etchable substrate to obtain a plurality of choke bodies.

Abstract: A method for making a miniaturized circuit includes: depositing a bottom metal layer including a first metal on a substrate; forming a patterned photoresist layer on the bottom metal layer to expose a first portion of the bottom metal layer and to cover a second portion thereof; plating a middle circuit pattern including a second metal on the bottom metal layer to cover the first portion of the bottom metal layer; plating a top circuit pattern including a third metal different from the first metal onto the middle circuit pattern to cover the middle circuit pattern; removing the patterned photoresist layer; and etching the second portion of the bottom metal layer with an etchant, so as to pattern the bottom metal layer into a bottom circuit pattern.

Abstract: A process for making a low-profile choke includes steps of: providing an etchable substrate; applying a masking layer on the etchable substrate; etching the etchable substrate through perforated patterns of the masking layer to permit the etchable substrate to be formed with an array of recessed patterns, each of which includes a core recess portion and a coil-patterned recess portion; filling a magnetic material and a conductive material respectively into the core recess portion and the coil-patterned recess portion of each of the recessed patterns to form in the etchable substrate a plurality of magnetic cores and a plurality of conductive coils; and slicing the etchable substrate to obtain a plurality of choke bodies.

Abstract: An oriented loading system is provided. The oriented loading system includes a substrate, a plurality of wells formed in the substrate, each well having a bottom and sidewalls, a plurality of particles loaded in the wells, wherein the particle comprises a core structure and an inner layer comprising magnetic material partially covering the core structure such that a part of the core structure uncovered by the inner layer is exposed, and a metal layer comprising magnetic material deposited partially in the sidewalls of the wells, wherein the inner layer is attracted by the metal layer such that the exposed core structure is oriented towards the bottom of the well or the inner layer is oriented towards the bottom of the well.