Patents by Inventor Yu Hsuan TSENG

Yu Hsuan TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240144056
    Abstract: A method includes: obtaining impact values for characteristic conditions; selecting training data subsets respectively from training data sets according to the impact values; obtaining a candidate model and an evaluation value based on the training data subsets; supplementing the training data subsets according to the impact values; obtaining another candidate model and another evaluation value based on training data subsets thus supplemented; repeating the step of supplementing the training data subset, and the step of obtaining another candidate model and another evaluation value based on the training data subsets thus supplemented; and selecting one of the candidate models as a prediction model based on the evaluation values.
    Type: Application
    Filed: August 2, 2023
    Publication date: May 2, 2024
    Applicants: TAIPEI VETERANS GENERAL HOSPITAL
    Inventors: Chin-Chou Huang, Ming-Hui Hung, Ling-Chieh Shih, Yu-Ching Wang, Han Cheng, Yu-Chieh Shiao, Yu-Hsuan Tseng
  • Publication number: 20240008444
    Abstract: An absorbent article for pet excreta includes a liquid-permeable topsheet layer, a liquid-permeable backsheet layer, and a liquid-absorbing unit. The liquid-permeable backsheet layer is disposed spaced apart from the liquid-permeable topsheet layer. The liquid-absorbing unit is disposed between the liquid-permeable topsheet layer and the liquid-permeable backsheet layer, and is adapted for absorbing pet excreta from at least one of the liquid-permeable topsheet layer and the liquid-permeable backsheet layer.
    Type: Application
    Filed: December 15, 2022
    Publication date: January 11, 2024
    Inventors: Chien-Chung SU, Yu-Hsuan TSENG, Yun-Peng LIU
  • Patent number: 11044817
    Abstract: A thermally conductive board comprises a metal substrate, a foil containing copper, a thermally conductive and insulating layer and a barrier layer. The thermally conductive and electrically insulating layer is disposed on the metal substrate. The barrier layer is laminated between the foil containing copper and the thermally conductive and electrically insulating layer. The barrier is in direct contact with the foil containing copper, and the interface between the barrier layer and the foil containing copper comprises a microrough surface. The barrier layer has a Redox potential between 0 and ?1V. The microrough surface has a roughness Rz of 2-18 ?m.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: June 22, 2021
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Kuo-Hsun Chen, Chia-Hsiung Wu, Kai-Wei Lo, Yu-Hsuan Tseng
  • Publication number: 20210059056
    Abstract: A thermally conductive board comprises a metal substrate, a foil containing copper, a thermally conductive and insulating layer and a barrier layer. The thermally conductive and electrically insulating layer is disposed on the metal substrate. The barrier layer is laminated between the foil containing copper and the thermally conductive and electrically insulating layer. The barrier is in direct contact with the foil containing copper, and the interface between the barrier layer and the foil containing copper comprises a microrough surface. The barrier layer has a Redox potential between 0 and ?1V. The microrough surface has a roughness Rz of 2-18 ?m.
    Type: Application
    Filed: April 9, 2020
    Publication date: February 25, 2021
    Inventors: Kuo-Hsun CHEN, Chia-Hsiung Wu, Kai-Wei LO, Yu-Hsuan Tseng
  • Patent number: 9431822
    Abstract: An over-current protection device includes two metal foils and a PTC material layer laminated therebetween. The PTC material layer has a volumetric resistivity between about 0.07 ?-cm and 0.45 ?-cm. The PTC material layer comprises a crystalline polymer and first and second conductive fillers dispersed therein. The first conductive filler is carbon black powder. The second conductive filler is selected from the group consisting of metal powder and conductive ceramic powder and has a volumetric resistivity less than 0.1 ?-cm. The weight ratio of the second conductive filler to the first conductive filler is less than 4. The resistance jump R300/Ri of the over-current protection device is in the range from 1.5 to 5, where Ri is an initial resistance and R300 is a resistance after tripping 300 times.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: August 30, 2016
    Assignee: POLYTRONICS TECHNOLOGY CORP.
    Inventors: Kuo Hsun Chen, Yu Hsuan Tseng, Yi An Sha
  • Publication number: 20160233667
    Abstract: An over-current protection device includes two metal foils and a PTC material layer laminated therebetween. The PTC material layer has a volumetric resistivity between about 0.07 ?-cm and 0.45 ?-cm. The PTC material layer comprises a crystalline polymer and first and second conductive fillers dispersed therein. The first conductive filler is carbon black powder. The second conductive filler is selected from the group consisting of metal powder and conductive ceramic powder and has a volumetric resistivity less than 0.1 ?-cm. The weight ratio of the second conductive filler to the first conductive filler is less than 4. The resistance jump R300/Ri of the over-current protection device is in the range from 1.5 to 5, where Ri is an initial resistance and R300 is a resistance after tripping 300 times.
    Type: Application
    Filed: February 11, 2015
    Publication date: August 11, 2016
    Inventors: Kuo Hsun CHEN, Yu Hsuan TSENG, Yi An SHA