Patents by Inventor Yu-Hsueh Lin

Yu-Hsueh Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12287070
    Abstract: An LED filament light bulb includes a bulb base, a driving circuit module mounted to the bulb base and including two electrical contacts, a bulb member, a light-emitting unit, and a first heat dissipation gel. The light-emitting unit includes at least two light-emitting strip modules, each including first and second conductive tabs. The first conductive tab of one light-emitting strip module is electrically connected to the second conductive tab of another light-emitting strip module. The second conductive tab of the one light-emitting strip module and the first conductive tab of the another light-emitting strip module are electrically and respectively connected to the electrical contacts. The first heat dissipation gel is disposed between the bulb member and the bulb base, and covers at least a portion of the driving circuit module.
    Type: Grant
    Filed: July 1, 2024
    Date of Patent: April 29, 2025
    Assignee: MUSTAR LIGHTING CORPORATION
    Inventors: Chih-Ming Yu, Yu-Hsueh Lin, Pei-Rou Lin, Yu-Xuan Huang
  • Publication number: 20110074068
    Abstract: A method for sintering anhydrous calcium sulfate material as biomedical material, includes the steps of: (a) preparing the anhydrous calcium sulfate material; (b) mixing the anhydrous calcium sulfate material with a sintering-support agent thoroughly to obtain a mixture waited for sintering; (c) die-pressing the mixture into a predetermined shape; and (d) executing a heat treatment onto the mixture to make the mixture be sintered to form the biomedical material having the predetermined shape.
    Type: Application
    Filed: May 20, 2010
    Publication date: March 31, 2011
    Inventor: YU-HSUEH LIN
  • Publication number: 20100124023
    Abstract: A method for plating film on a heat dissipation module includes the steps of: cleaning the heat dissipation module; injecting hydrogen and tetra-methylsilane gases and applying an electric current to generate a bias electric field within a working chamber, thereby plating an adherent film on the heat dissipation module; injecting hydrocarbon gas together with the hydrogen and tetra-methylisilane gases into the working chamber, thereby plating a mixed film on the adherent film; and injecting the hydrogen and tetra-methylisilane gases together with hydrocarbon gas into the working chamber, thereby plating a noncrystalline DLC film on the mixed film.
    Type: Application
    Filed: January 13, 2009
    Publication date: May 20, 2010
    Inventor: YU-HSUEH LIN
  • Publication number: 20100062185
    Abstract: A method for plating films on a transmission mechanism includes the steps of: cleaning the transmission mechanism; injecting hydrogen and tetra-methylsilane gases and applying an electric current to generate a bias electric field within a working chamber, thereby forming an adherent film on the transmission mechanism; injecting hydrocarbon gas together with the hydrogen and tetra-methylsilane gases into the working chamber, thereby forming a mixed film on the adherent film; and injecting the hydrogen and tetra-methylsilane gases together with hydrocarbon gas into the working chamber while maintaining the bias electric field at 400-700 V and the applied electric current at 800-1500 watt, thereby forming a noncrystalline DLC film on the mixed film.
    Type: Application
    Filed: January 13, 2009
    Publication date: March 11, 2010
    Inventor: YU-HSUEH LIN
  • Patent number: 7638714
    Abstract: A method for manufacturing a substrate board with high efficiency of heat conduction and electrical isolation is disclosed. The method comprises the steps of: providing a substrate layer with an arrangement surface and a heat-dissipating surface; executing an anodic treatment on the arrangement surface and the heat-dissipating surface to respectively form a first anodic treatment layer and a second anodic treatment layer; forming a heat conduction and electrical isolation layer on the second anodic treatment layer; and forming a diamond like carbon (DLC) layer on the heat conduction and electrical isolation layer. The heat expansion coefficient of the substrate layer is greater than that of the second anodic treatment layer, the heat conduction and electrical isolation layer, and the DLC layer in turn.
    Type: Grant
    Filed: January 4, 2008
    Date of Patent: December 29, 2009
    Inventor: Yu-Hsueh Lin
  • Publication number: 20090257839
    Abstract: A method for film-coating drill bits comprises the steps of: providing a core drill bit; cleaning and further heating the core drill bit; forming an adherent film on the core drill bit; forming a mixing film on the adherent film; and forming a non-crystalline diamond-like film on the mixing film. The finish film-coated drill bit comprises an inner adherence film, a middle mixing film and an outer non-crystalline diamond-like carbon (DLC) film. The mixing film is composed of a non-crystalline diamond-like material and compositions of the adherence film. In the mixing film, the composition of the non-crystalline diamond-like material is higher in a position close to the DLC film.
    Type: Application
    Filed: November 7, 2008
    Publication date: October 15, 2009
    Inventor: YU-HSUEH LIN
  • Publication number: 20090116193
    Abstract: A method for manufacturing a substrate board with high efficiency of heat conduction and electrical isolation is disclosed. The method comprises the steps of: providing a substrate layer with an arrangement surface and a heat-dissipating surface; executing an anodic treatment on the arrangement surface and the heat-dissipating surface to respectively form a first anodic treatment layer and a second anodic treatment layer; forming a heat conduction and electrical isolation layer on the second anodic treatment layer; and forming a diamond like carbon (DLC) layer on the heat conduction and electrical isolation layer. The heat expansion coefficient of the substrate layer is greater than that of the second anodic treatment layer, the heat conduction and electrical isolation layer, and the DLC layer in turn.
    Type: Application
    Filed: January 4, 2008
    Publication date: May 7, 2009
    Inventor: Yu-Hsueh Lin