Patents by Inventor Yu-Hsuen Lee

Yu-Hsuen Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PROBE PIN CLEANING PAD AND CLEANING METHOD FOR PROBE PIN
    Publication number: 20240069069
    Abstract: A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.
    Type: Application
    Filed: November 10, 2023
    Publication date: February 29, 2024
    Applicant: Alliance Material Co., Ltd.
    Inventors: Chun-Fa Chen, Yu-Hsuen Lee, Ching-Wen Hsu, Chao-Hsuan Yang, Ting-Wei Lin
  • Probe pin cleaning pad and cleaning method for probe pin
    Patent number: 11865588
    Abstract: A probe pin cleaning pad including a release layer or composite plate, an adhesive layer, a substrate layer, a cleaning layer, and a polishing layer is provided. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. The polishing layer is disposed on the cleaning layer. A cleaning method for a probe pin is also provided.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: January 9, 2024
    Assignee: Alliance Material Co., Ltd.
    Inventors: Chun-Fa Chen, Chi-Hua Huang, Yu-Hsuen Lee, Ching-Wen Hsu, Chao-Hsuan Yang, Ting-Wei Lin, Chin-Kai Lin, Chen-Ju Lee
  • PROBE PIN CLEANING PAD AND CLEANING METHOD FOR PROBE PIN
    Publication number: 20220193733
    Abstract: A probe pin cleaning pad including a release layer or composite plate, an adhesive layer, a substrate layer, a cleaning layer, and a polishing layer is provided. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. The polishing layer is disposed on the cleaning layer. A cleaning method for a probe pin is also provided.
    Type: Application
    Filed: March 10, 2022
    Publication date: June 23, 2022
    Applicant: Alliance Material Co., Ltd.
    Inventors: Chun-Fa Chen, Chi-Hua Huang, Yu-Hsuen Lee, Ching-Wen Hsu, Chao-Hsuan Yang, Ting-Wei Lin, Chin-Kai Lin, Chen-Ju Lee
  • PROBE PIN CLEANING PAD AND CLEANING METHOD FOR PROBE PIN
    Publication number: 20210141000
    Abstract: A probe pin cleaning pad is provided, including a release layer or composite plate, an adhesive layer, a substrate layer, and a cleaning layer. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. A cleaning method for a probe pin is also provided.
    Type: Application
    Filed: November 12, 2020
    Publication date: May 13, 2021
    Applicant: Alliance Material Co., Ltd.
    Inventors: Chun-Fa Chen, Chi-Hua Huang, Yu-Hsuen Lee, Chen-Ju Lee, Huan-Hsuan Ku, Ching-Wen Hsu, Chin-Kai Lin