Patents by Inventor Yu-Hsun Wang

Yu-Hsun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12278162
    Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.
    Type: Grant
    Filed: August 7, 2023
    Date of Patent: April 15, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Hsun Wang, Ping-Yin Hsieh, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Patent number: 12174596
    Abstract: A grinding and polishing simulation method, a grinding and polishing simulation system and a grinding and polishing process transferring method. The grinding and polishing simulation method includes the following steps. A sensing information of a grinding and polishing apparatus when grinding or polishing a workpiece is obtained. A plurality of model parameters is identified according to the sensing information. At least one quality parameter is calculated according to a machining path, a plurality of process parameters and the plurality of model parameters.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: December 24, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yuan-Chieh Lo, Yu-Hsun Wang, Pei-Chun Lin, Chih-Hsuan Shih, Shu Huang
  • Patent number: 11973005
    Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Hsun Wang, Ping-Yin Hsieh, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Publication number: 20240014100
    Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.
    Type: Application
    Filed: August 7, 2023
    Publication date: January 11, 2024
    Inventors: Yu-Hsun Wang, Ping-Yin Hsieh, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Publication number: 20230011493
    Abstract: A package assembly includes an interposer module on a package substrate, a thermal interface material (TIM) film on the interposer module, and a package lid that includes a plate portion on the TIM film and a step region projecting away from the plate portion and located over the TIM film and over an edge region of the interposer module.
    Type: Application
    Filed: March 29, 2022
    Publication date: January 12, 2023
    Inventors: Ping-Yin HSIEH, Yu-Hsun WANG, Li-Hui CHENG, Szu-Wei LU
  • Publication number: 20220359345
    Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.
    Type: Application
    Filed: August 3, 2021
    Publication date: November 10, 2022
    Inventors: Yu-Hsun Wang, Ping-Yin Hsieh, Pu Wang, Li-Hui Cheng, Szu-Wei Lu
  • Publication number: 20210331287
    Abstract: A grinding and polishing simulation method, a grinding and polishing simulation system and a grinding and polishing process transferring method. The grinding and polishing simulation method includes the following steps. A sensing information of a grinding and polishing apparatus when grinding or polishing a workpiece is obtained. A plurality of model parameters is identified according to the sensing information. At least one quality parameter is calculated according to a machining path, a plurality of process parameters and the plurality of model parameters.
    Type: Application
    Filed: December 28, 2020
    Publication date: October 28, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yuan-Chieh LO, Yu-Hsun WANG, Pei-Chun LIN, Chih-Hsuan SHIH, Shu HUANG
  • Publication number: 20170190375
    Abstract: A direction control method for the self-balancing electric vehicle and electric vehicle using the same are disclosed in the present invention.
    Type: Application
    Filed: December 29, 2016
    Publication date: July 6, 2017
    Inventors: Li Sheng LO, Chih Hsiang YANG, Chia Sheng HSU, Yu Hsun WANG, Chi Wei FAN, Jing Jo BEI
  • Patent number: 8678296
    Abstract: On a two-dimensional optical identification device with same gray level, a plurality of two-dimensional optical identification codes are arranged, each having a plurality of data blocks and an outer positioning block. Each data block has a plurality of defined patterns, and each defined pattern is located in one of virtual areas produced by equally dividing the data block. The outer positioning block has a plurality of first positioning points and a first direction identification point, and is placed at two adjacent boundaries of the plurality of data blocks for defining the positions of the plurality of data blocks. A fixed position data block is selected as a data block coding indication block for indicating the coding of the other data blocks.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: March 25, 2014
    Assignee: Generalplus Technology Inc.
    Inventors: Shih-Chien Lin, Yu-Hsun Wang
  • Patent number: 8534565
    Abstract: A two-dimensional optical identification device for a quick decoding operation in a same gray level and decoding method applied to the same. The two-dimensional optical identification device has at least one two-dimensional optical identification with the same gray level. The two-dimensional optical identification has a first positioning block, a plurality of data blocks, and a second positioning block. The first positioning block has a plurality of first positioning points. The data blocks are placed around the first positioning block. The second positioning block has a plurality of second positioning points and a second direction identification point for providing the direction of the two-dimensional optical identification, and the second positioning block is placed at each boundary of the plurality of data blocks for defining the positions of the plurality of data blocks. The second direction identification point indicates an identification direction of the two-dimensional optical identification.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: September 17, 2013
    Assignee: Generalplus Technology Inc.
    Inventors: Shih-Chien Lin, Yu-Hsun Wang
  • Publication number: 20120298754
    Abstract: A two-dimensional optical identification device for a quick decoding operation in a same gray level and decoding method applied to the same. The two-dimensional optical identification device has at least one two-dimensional optical identification with the same gray level. The two-dimensional optical identification has a first positioning block, a plurality of data blocks, and a second positioning block. The first positioning block has a plurality of first positioning points. The data blocks are placed around the first positioning block. The second positioning block has a plurality of second positioning points and a second direction identification point for providing the direction of the two-dimensional optical identification, and the second positioning block is placed at each boundary of the plurality of data blocks for defining the positions of the plurality of data blocks. The second direction identification point indicates an identification direction of the two-dimensional optical identification.
    Type: Application
    Filed: November 7, 2011
    Publication date: November 29, 2012
    Applicant: Generalplus Technology Inc.
    Inventors: Shih-Chien Lin, Yu-Hsun Wang
  • Publication number: 20120298761
    Abstract: On a two-dimensional optical identification device with same gray level, a plurality of two-dimensional optical identification codes are arranged, each having a plurality of data blocks and an outer positioning block. Each data block has a plurality of defined patterns, and each defined pattern is located in one of virtual areas produced by equally dividing the data block. The outer positioning block has a plurality of first positioning points and a first direction identification point, and is placed at two adjacent boundaries of the plurality of data blocks for defining the positions of the plurality of data blocks. A fixed position data block is selected as a data block coding indication block for indicating the coding of the other data blocks.
    Type: Application
    Filed: November 7, 2011
    Publication date: November 29, 2012
    Applicant: Generalplus Technology Inc.
    Inventors: Shih-Chien LIN, Yu-Hsun WANG