Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.

Abstract: A method includes forming a dummy gate over a semiconductor fin; forming a source/drain epitaxial structure over the semiconductor fin and adjacent to the dummy gate; depositing an interlayer dielectric (ILD) layer to cover the source/drain epitaxial structure; replacing the dummy gate with a gate structure; forming a dielectric structure to cut the gate structure, wherein a portion of the dielectric structure is embedded in the ILD layer; recessing the portion of the dielectric structure embedded in the ILD layer; after recessing the portion of the dielectric structure, removing a portion of the ILD layer over the source/drain epitaxial structure; and forming a source/drain contact in the ILD layer and in contact with the portion of the dielectric structure.

Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.

Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a first gate electrode disposed on the substrate and located in a first region of the semiconductor device. The semiconductor device also includes a first sidewall structure covering the first gate electrode. The semiconductor device further includes a protective layer disposed between the first gate electrode and the first sidewall structure. In addition, the semiconductor device includes a second gate electrode disposed on the substrate and located in a second region of the semiconductor device. The semiconductor device also includes a second sidewall structure covering a lateral surface of the second gate electrode.

Abstract: A semiconductor structure includes a functional die, a dummy die, a redistribution structure, a seal ring and an alignment mark. The dummy die is electrically isolated from the functional die. The redistribution structure is disposed over and electrically connected to the functional die. The seal ring is disposed over the dummy die. The alignment mark is between the seal ring and the redistribution structure, wherein the alignment mark is electrically isolated from the dummy die, the redistribution structure and the seal ring. The insulating layer encapsulates the functional die and the dummy die.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: Some implementations described herein provide a laser device. The laser device includes a first portion of the laser device, at a proximal end of the laser device, that includes one or more optical devices, where the first portion is configured to emit first electromagnetic waves having a first wavelength. The laser device includes a second portion of the laser device, at a distal end of the laser device, that includes an optical crystal configured to receive the first electromagnetic waves and to emit second electromagnetic waves having a second wavelength based on reception of the first electromagnetic waves, where the optical crystal includes a thin film coating disposed on an end of the optical crystal, the thin film coating configured to: support emission of the second electromagnetic waves from the optical crystal, and support internal reflection of the first electromagnetic waves within the optical crystal.

Abstract: An illumination system includes a first light source, a wavelength conversion device, a first light-splitting element, a light-filtering device, and a light-homogenizing element. The first light source provides a first light beam. The wavelength conversion device includes a single wavelength conversion material configured to convert the first light beam into a conversion light beam. The first light-splitting element is disposed on transmission paths of the first light beam and the conversion light beam. The light-filtering device is disposed on the transmission paths of the first light beam and the conversion light beam. The light-homogenizing element is disposed on the transmission paths of the first light beam and the conversion light beam. When the first light beam is transmitted to the light-homogenizing element, the first light beam is not incident on the wavelength conversion device. A projection apparatus including the illumination system is also provided.

Abstract: An illumination system includes an excitation light source module, a light splitting and combining module, a filter module, and a wavelength conversion module. The excitation light source module provides an excitation beam. The light splitting and combining module is disposed on a transmission path of the excitation beam. The excitation beam includes a first and a second excitation beam which are different from each other in polarization state or wavelength range. The filter module is disposed on the transmission path of the excitation beam. The filter module includes a light passing area configured to allow the excitation beam to pass there-through and a light filtering area. The wavelength conversion module is disposed on the transmission path of the excitation beam reflected by the light filtering area and configured to convert the reflected excitation beam into a conversion beam. A projection apparatus including the above illumination system is also provided.

Abstract: An illumination system includes a first light source, a wavelength conversion device, a first light-splitting element, a light-filtering device, and a light-homogenizing element. The first light source provides a first light beam. The wavelength conversion device includes a single wavelength conversion material configured to convert the first light beam into a conversion light beam. The first light-splitting element is disposed on transmission paths of the first light beam and the conversion light beam. The light-filtering device is disposed on the transmission paths of the first light beam and the conversion light beam. The light-homogenizing element is disposed on the transmission paths of the first light beam and the conversion light beam. When the first light beam is transmitted to the light-homogenizing element, the first light beam is not incident on the wavelength conversion device. A projection apparatus including the illumination system is also provided.

Abstract: An illumination system includes an excitation light source module, a light splitting and combining module, a filter module, and a wavelength conversion module. The excitation light source module provides an excitation beam. The light splitting and combining module is disposed on a transmission path of the excitation beam. The excitation beam includes a first and a second excitation beam which are different from each other in polarization state or wavelength range. The filter module is disposed on the transmission path of the excitation beam. The filter module includes a light passing area configured to allow the excitation beam to pass there-through and a light filtering area. The wavelength conversion module is disposed on the transmission path of the excitation beam reflected by the light filtering area and configured to convert the reflected excitation beam into a conversion beam. A projection apparatus including the above illumination system is also provided.

Abstract: An apparatus for assembling cable to connector includes a jig holder and a cable jig. The jig holder has a basic board defining a mounting space capable of locating a connector in the front thereof. The cable jig located in the rear of the mounting space of the jig holder has an upper jig member and a lower jig member disposed beneath the upper jig member. One of the jig members protrudes to form first spaced-apart barriers. A first receiving passage is defined between each pair of adjacent first spaced-apart barriers. The other jig member defines second receiving passages for receiving the first spaced-apart barriers respectively. A second spaced-apart barrier is defined between every two adjacent second receiving passages to space the two adjacent second receiving passages apart. The second spaced-apart barriers are inserted in the first receiving passages respectively.

Abstract: An apparatus for assembling cable to connector includes a jig holder and a cable jig. The jig holder has a basic board defining a mounting space capable of locating a connector in the front thereof. The cable jig located in the rear of the mounting space of the jig holder has an upper jig member and a lower jig member disposed beneath the upper jig member. One of the jig members protrudes to form first spaced-apart barriers. A first receiving passage is defined between each pair of adjacent first spaced-apart barriers. The other jig member defines second receiving passages for receiving the first spaced-apart barriers respectively. A second spaced-apart barrier is defined between every two adjacent second receiving passages to space the two adjacent second receiving passages apart. The second spaced-apart barriers are inserted in the first receiving passages respectively.

Abstract: A cable testing device of the present invention can test sheltering performance of a cable which has a central wire, a shelter wrapped around the central wire and an exterior cover wrapped around the shelter. One end of the central wire and two ends of the shelter are earthed. The cable testing device includes a network testing device and a metal tube. The network testing device has an input which is connected to the other end of the cable and an output. The metal tube incloses the cable to be tested, one end of the metal tube is connected to the output of the network testing device, the other end is earthed. As a result, an electromagnetic field is formed in the interior of metal tube, thereby, the sheltering performance of the shelter of the cable can be tested directly before the whole cable product being assembled.