Abstract: A self-aligning hybridization method enabling small pixel pitch hybridizations with self-alignment and run-out protection. The method requires providing a first IC, the surface of which includes at least one electrical contact for connection to a mating IC, depositing an insulating layer on the IC's surface, patterning and etching the insulating layer to provide recesses in the insulating layer above each of the electrical contacts, and depositing a deformable conductive material in each of the recesses. A mating IC is provided which includes conductive pins positioned to align with the deformable conductive material in respective ones of the recesses on the first chip. The first and mating ICs are then hybridized by bringing the conductive pins into contact with the deformable conductive material in the recesses, such that the conductive material deforms and the pins make electrical contact with the first IC's electrical contacts.

Abstract: A hybridization method comprises providing a first IC, depositing a first metal layer over electrical contacts on the IC, depositing an insulating layer over the first metal layer and contacts, providing recesses in the insulating layer above each contact, and depositing metal such that the sidewalls of the recesses provide electrical continuity between the top of each recess and the electrical contact it is above. The recesses are backfilled with a sacrificial planarization material and planarized, and a second metal layer is deposited, patterned and etched over each backfilled recess to form openings over each recess and to separate the pixels. The sacrificial planarization material is removed to form compliant structures overhanging the recesses and thereby creating micro-sockets capable of receiving corresponding conductive pins associated with a mating IC. Electrical contact between the first and mating ICs is accomplished through shear between the pins and the micro-sockets.

Abstract: Provided is a compact, high-speed deformable mirror for use with an adaptive optic. The mirror or wavefront correction device corrects and/or compensates for wavefront aberrations present in a wavefront received by the optics. The mirror includes a deformable membrane which may be made of a semiconductive, metallic or insulating material. Positioned in close proximity to a front surface of the membrane is a transparent conductor, which may be covered by a window having an anti-reflective coating. A plurality of electrostatic actuators is located in close proximity to a back surface of the membrane, the conductor and actuators separated by a gap of approximately 10 ?m. In operation, a bias voltage is applied to the transparent conductor and an actuator voltage is applied to the plurality of actuators. The resultant voltage differential across the membrane defines the amount of membrane deformation, which in turn compensates for distortions in a subsequently reflected wavefront.

Abstract: Provided is a compact, high-speed deformable mirror for use with an adaptive optic. The mirror or wavefront correction device corrects and/or compensates for wavefront aberrations present in a wavefront received by the optics. The mirror includes a deformable membrane which may be made of a semiconductive, metallic or insulating material. Positioned in close proximity to a front surface of the membrane is a transparent conductor, which may be covered by a window having an anti-reflective coating. A plurality of electrostatic actuators is located in close proximity to a back surface of the membrane, the conductor and actuators separated by a gap of approximately 10 ?m. In operation, a bias voltage is applied to the transparent conductor and an actuator voltage is applied to the plurality of actuators. The resultant voltage differential across the membrane defines the amount of membrane deformation, which in turn compensates for distortions in a subsequently reflected wavefront.